Secondary side heatsink techniques for optical and electrical modules

Patent metadata

Field	Value
Publication number	US-12288954-B2
Application number	US-202017761036-A
Country	US
Kind code	B2
Filing date	Sep 9, 2020
Priority date	Sep 16, 2019
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

First claim

What is claimed is:

1. A system for use in a hardware platform for networking, computing, and/or storage, the system comprising:
a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side;
one or more optical components disposed on a surface of the printed circuit board assembly on the primary side of the printed circuit board assembly, wherein the optical components include a pluggable optical module which is removable from the printed circuit board assembly; and
a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is in thermal communication with and disposed via a direct thermal interface opposite of the pluggable optical module disposed on the primary side, for thermal management, when the pluggable module is inserted.

2. The system of claim 1 , wherein the secondary side heatsink is floating under a spring force including attachment components disposed on the primary side.

3. The system of claim 2 , wherein the attachment components are located through holes in the printed circuit board assembly.

4. The system of claim 1 , wherein the secondary side heatsink includes an adjustable vertical height relative to the optical component via an adjustable mechanical interface.

5. The system of claim 4 , wherein the adjustable mechanical interface is a set screw and cylindrical post.

6. The system of claim 4 , wherein the adjustable vertical height is set via the adjustable mechanical interface and is based on a thickness of the printed circuit board assembly.

7. The system of claim 1 , wherein the secondary side heatsink protrudes through a hole in the printed circuit board assembly to attach to the some of the optical components.

8. The system of claim 1 , wherein the printed circuit board assembly and the components are in a pluggable optical module compliant to a multi-source agreement.

9. The system of claim 8 , further comprising a cage for housing the pluggable optical module, wherein the secondary side heatsink protrudes through a hole in the cage.

10. The system of claim 1 , wherein the printed circuit board assembly, the components, and the secondary side heatsink are in a pluggable optical module compliant to a multi-source agreement.

11. A method comprising:
providing a system for use in a hardware platform for networking, computing, and/or storage, the system comprising:
a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side;
one or more optical components disposed on a surface of the printed circuit board assembly on the primary side of the printed circuit board assembly, wherein the optical components include a pluggable optical module which is removable from the printed circuit board assembly; and
a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is in thermal communication with and disposed via a direct thermal interface opposite of the pluggable optical module disposed on the primary side, for thermal management, when the pluggable module is inserted.

12. The method of claim 11 , wherein the secondary side heatsink is floating under a spring force including attachment components disposed on the primary side.

13. The method of claim 12 , wherein the attachment components are located through holes in the printed circuit board assembly.

14. The method of claim 11 , wherein the secondary side heatsink includes an adjustable height.

15. The method of claim 14 , wherein the adjustable height is based on a set screw.

16. The method of claim 14 , wherein the adjustable height is based on a thickness of the printed circuit board assembly.

17. The method of claim 11 , wherein the secondary side heatsink protrudes through a hole in the printed circuit board assembly to attach to the some of the optical components.

18. The method of claim 11 , wherein the printed circuit board assembly and the components are in a pluggable optical module compliant to a multi-source agreement.

19. The method of claim 18 , further comprising a cage for housing the pluggable optical module, wherein the secondary side heatsink protrudes through a hole in the cage.

20. The method of claim 11 , wherein the printed circuit board assembly, the components, and the secondary side heatsink are in a pluggable optical module compliant to a multi-source agreement.

Assignees

• Ciena Corp

Inventors

• O'Leary Mitchell
• Aldea Victor
• Rahmani Kamran
• Meunier Trevor
• Ajersch Peter
• Graham Terence
• Leclair Marc

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H01R4/48 Primary

  utilising a spring, clip, or other resilient member (H01R4/52 takes precedence) · CPC title

• H01R4/30

  utilising a screw or nut clamping member (H01R4/50 takes precedence; utilising a clamping member acted on by screw or nut H01R4/38; {for coaxial cables H01R9/0521}) · CPC title

• H05K2201/10734

  Ball grid array [BGA]; Bump grid array · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title