Power supply control device

Patent metadata

Field	Value
Publication number	US-12288659-B2
Application number	US-202118260953-A
Country	US
Kind code	B2
Filing date	Dec 28, 2021
Priority date	Jan 12, 2021
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A power supply control device is to be installed in a vehicle. The power supply control device controls power supply via a semiconductor switch and a fuse by turning the semiconductor switch ON or OFF. The semiconductor switch and the fuse are mounted on a circuit board. In the fuse, two long plate-shaped terminals are arranged in a row. The fusing portion and a part of the two terminals are covered with a housing having heat resistance. The two terminals are disposed in a current path of a current flowing through the semiconductor switch. The current flows through the fusing portion. If the temperature of the fusing portion exceeds a predetermined temperature, the fusing portion is fused.

First claim

The invention claimed is:

1. A vehicle power supply control device that controls power supply via a semiconductor switch by switching the semiconductor switch ON or OFF, comprising:
a fuse; and
a circuit board on which the semiconductor switch and the fuse are mounted, the circuit board including an insulating substrate, a pair of through holes passing through the insulating substrate and a plurality of substrate plating portions covering the insulating substrate, wherein the each of the pair of through holes has a first length,
wherein the fuse includes:
a pair of long plate-shaped terminals arranged in a row, the pair of long plate-shaped terminals includes a first plate portion and a second plate portion extending from the first plate portion, the first plate portion having a length longer than the first length of the pair of through holes and a width of the first plate portion is the same as a width of the second plate portion;
a fusing portion connected to two terminals of the plurality of terminals; and
a housing covering the fusing portion and a part of the terminals, and
the two terminals of the plurality of terminals are arranged in a current path of a current flowing through the semiconductor switch,
the current flows through the fusing portion,
the fusing portion is fused when a temperature of the fusing portion exceeds a predetermined temperature, and
the housing is heat-resistant; and
wherein a distal end of the first plate portion is pressed against a top surface of a top one of the plurality of substrate plating portions and the first plate portion of the pair of terminals respectively connected to the substrate plating portions by soldering and the second plate portion of the pair of terminals are disposed within the pair of through holes and connected within the pair of through holes by soldering.

2. The power supply control device according to claim 1 , wherein the housing has heat resistance to heat of 300 degree Celsius or higher.

3. The power supply control device according to claim 1 , further comprising:
a detection unit configured to detect a voltage value between the two terminals of the fuse disposed in the current path.

4. The power supply control device according to claim 1 ,
wherein the plurality of terminals each include:
a metal body; and
terminal plating made of tin and covering a surface of the metal body.

5. The power supply control device according to claim 1 ,
a cross-sectional area of the second plate portion is smaller than a cross-sectional area of the first plate portion.

6. The power supply control device according to claim 2 , further comprising:
a detection unit configured to detect a voltage value between the two terminals of the fuse disposed in the current path.

7. The power supply control device according to claim 2 ,
wherein the plurality of terminals each include:
a metal body; and
terminal plating made of tin and covering a surface of the metal body.

8. The power supply control device according to claim 3 ,
wherein the plurality of terminals each include:
a metal body; and
terminal plating made of tin and covering a surface of the metal body.

9. The power supply control device according to claim 2 ,
wherein a cross-sectional area of the second plate portion is smaller than a cross-sectional area of the first plate portion.

10. The power supply control device according to claim 3 ,
wherein a cross-sectional area of the second plate portion is smaller than a cross-sectional area of the first plate portion.

11. The power supply control device according to claim 4 ,
wherein a cross-sectional area of the second plate portion is smaller than a cross-sectional area of the first plate portion.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Masuda Ryosuke
• Kato Masayuki
• Sawano Shunichi
• Sawada Ryohei

Classifications

• H01H2085/0283

  Structural association with a semiconductor device · CPC title

• H01H2085/0275

  Structural association with a printed circuit board · CPC title

• H01H85/143

  Electrical contacts; Fastening fusible members to such contacts · CPC title

• B60R16/03

  for supply of electrical power to vehicle subsystems {or for (circuit arrangements for charging batteries H02J7/00)} · CPC title

• H01H2085/0412

  specially adapted for being mounted on a printed circuit board · CPC title