Force sensing scale with target

Patent metadata

Field	Value
Publication number	US-12287233-B2
Application number	US-202217850509-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Jun 28, 2021
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A weight sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece by a product due to the weight of said product, the displacement of the target piece with respect to sensing elements can be sensed.

First claim

The invention claimed is:

1. A weight sensor comprising:
a flexible piece provided with a target piece, the flexible piece configured for receiving a force stimulus from a product provided on the flexible piece for displacement of the target piece with respect to a sensing element;
the sensing element configured to sense changes of a magnetic field from said displacement of the target piece with respect to the sensing element and to provide a signal representative of a position of the target piece; and
an integrated circuit configured for processing signals from the sensing element;
wherein the sensing element is a first sensing element, the weight sensor comprising at least one further sensing element spaced apart a predetermined distance from the first sensing element,
wherein the integrated circuit is further configured to process signals from the sensing element and the at least one further sensing element, to provide a gradient of at least one component of the magnetic field and to obtain a weight of the product based on said gradient.

2. The weight sensor of claim 1 , wherein the integrated circuit and the sensing element are packaged in a semiconductor package.

3. The weight sensor of claim 2 , wherein the semiconductor package comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein the flexible piece does not extend beyond the first surface of the semiconductor package in a direction parallel to the horizontal plane.

4. The weight sensor of claim 2 , wherein the flexible piece is deposited or adhered to the semiconductor package.

5. The weight sensor of claim 2 , wherein the semiconductor package comprises a first surface facing the flexible piece and the flexible piece is attached to the first surface of the semiconductor package,
wherein an attachment area between the flexible piece and the first surface of the semiconductor package is equal to or smaller than an area of the first surface of the semiconductor package.

6. The weight sensor of claim 2 , wherein the semiconductor package comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein a ratio between a largest dimension of the semiconductor package in a direction parallel to the horizontal plane and a largest dimension of the target piece in the direction parallel to the horizontal plane is 1.5 or larger.

7. The weight sensor of claim 1 , wherein the integrated circuit comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein a ratio between a largest dimension of the integrated circuit in a direction parallel to the horizontal plane and a largest dimension of the target piece in the direction parallel to the horizontal plane is 1.5 or larger.

8. The weight sensor of claim 1 , wherein the first sensing element is a Hall effect-based position sensing element, and the target piece is a magnetic target piece or wherein the first sensing element is an inductive sensing element and the target piece is a conductive target piece.

9. The weight sensor of claim 1 , wherein the target piece is a metallic sheet embedded in or provided on the flexible piece.

10. The weight sensor of claim 1 , wherein the first sensing element is provided between the integrated circuit and the target piece.

11. The weight sensor of claim 1 , wherein the first sensing element is adjacent to the integrated circuit.

12. The weight sensor of claim 1 , wherein the first sensing element is integrated in the integrated circuit.

13. The weight sensor of claim 1 , further comprising a temperature sensor for measuring a temperature of the weight sensor or parts thereof, for compensating temperature drifts in the signal of the first sensing element.

14. A domestic appliance comprising the weight sensor of claim 1 , for measuring the weight of the product.

15. A weight sensor assembly comprising:
a force sensor, the force sensor comprising:
a flexible piece provided with a target piece, the flexible piece configured for receiving a force stimulus from a product provided on the flexible piece for displacement of the target piece with respect to a sensing element;
the sensing element configured to sense changes of a magnetic field from said displacement of the target piece with respect to the sensing element, the sensing element being configured to provide a signal representative of a position of the target piece; and
an integrated circuit configured for processing signals from the sensing element and to provide readout signals based on the processed signals from the sensing element; and

a support structure, wherein the force sensor is provided on the support structure including connections for rerouting readout signals generated in the force sensor to an external output.

16. The weight sensor assembly of claim 15 , wherein the integrated circuit and the sensing element are packaged in a semiconductor package.

17. The weight sensor assembly of claim 16 , wherein the semiconductor package comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein the flexible piece does not extend beyond the first surface of the semiconductor package in a direction parallel to the horizontal plane.

18. The weight sensor assembly of claim 16 , wherein the flexible piece is deposited or adhered to the semiconductor package.

19. The weight sensor assembly of claim 16 , wherein the semiconductor package comprises a first surface facing the flexible piece and the flexible piece is attached to the first surface of the semiconductor package,
wherein an attachment area between the flexible piece and the first surface of the semiconductor package is equal to or smaller than an area of the first surface of the semiconductor package.

20. The weight sensor assembly of claim 16 , wherein the semiconductor package comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein a ratio between a largest dimension of the semiconductor package in a direction parallel to the horizontal plane and a largest dimension of the target piece in the direction parallel to the horizontal plane is 1.5 or larger.

21. The weight sensor assembly of claim 15 , wherein the integrated circuit comprises a first surface facing the flexible piece, the first surface defining a horizontal plane parallel to the first surface,
wherein a ratio between a largest dimension of the integrated circuit in a direction parallel to the horizontal plane and a largest dimension of the target piece in the direction parallel to the horizontal plane is 1.5 or larger.

22. The weight sensor assembly of claim 15 , wherein the sensing element is a Hall effect-based position sensing element, and the target piece is a magnetic target piece or wherein the sensing element is an inductive sensing element and the target piece is a conductive target piece.

23. The weight sensor assembly of claim 15 , wherein the target piece is a metallic sheet embedded in or provided on the flexible piece.

24. The weight sensor assembly of claim 15 , wherein the sensing element is provided between the integrated circuit and the target piece.

25. The weight sensor assembly of claim 15

Assignees

• Melexis Tech Sa

Inventors

• Close Gael
• Degois Jerome
• Dupre Nicolas
• Le Signor Theo
• Vangerven Tim

Classifications

• G01R33/072

  Constructional adaptation of the sensor to specific applications · CPC title

• G01R33/0047

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• G01L1/122

  by using permanent magnets · CPC title

• G01L1/04

  by measuring elastic deformation of gauges, e.g. of springs · CPC title

• A47J42/44

  Automatic starting or stopping devices (bag clamps with means for actuating switches A47J42/40); Warning devices · CPC title