Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium
US-2016002789-A1 · Jan 7, 2016 · US
US12286703B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12286703-B2 |
| Application number | US-202318542356-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2023 |
| Priority date | Sep 18, 2020 |
| Publication date | Apr 29, 2025 |
| Grant date | Apr 29, 2025 |
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An evaporation apparatus is described, particularly for evaporating a reactive material such as lithium. The evaporation apparatus includes an evaporation crucible for evaporating a liquid material, a material conduit for supplying the liquid material to the evaporation crucible, and a valve configured to close the material conduit by solidifying a part of the liquid material in the material conduit with a cooling device. The valve may include a cooling gas supply for a cooling gas, and the cooling device may be configured to cool the liquid material with the cooling gas. Further described are a vapor deposition apparatus for coating a substrate as well as an evaporation method.
Opening claim text (preview).
The invention claimed is: 1. An evaporation apparatus, comprising: an evaporation crucible for evaporating a liquid material, the liquid material being lithium; a heatable enclosure having one or more heating elements, the one or more heating elements heating an inner volume of the heatable enclosure to a temperature of 300° C. or more; a material conduit for supplying the liquid material into the evaporation crucible, the material conduit extending at least partially through the heatable enclosure; a freeze valve positioned upstream from the evaporation crucible and at least partially in the heatable enclosure, comprising: a cooling passage extending axially along the material conduit and surrounding a section of the material conduit, the cooling passage in thermal contact with the material conduit; a fluid supply conduit coupled to the cooling passage at a first end of the cooling passage to provide a cooling gas to the cooling passage to cool the liquid material in the material conduit to a temperature below a melting point temperature of the liquid material such that a part of the liquid material solidifies to form a plug that clogs the material conduit; and a second fluid conduit coupled to the cooling passage at a second end of the cooling passage, the second end of the cooling passage opposite of and spaced apart from the first end of the cooling passage; and a noble gas supply for guiding the cooling gas to the cooling passage for cooling the liquid material with the cooling gas. 2. The evaporation apparatus according to claim 1 , wherein the noble gas supply is an argon supply. 3. The evaporation apparatus according to claim 1 , wherein the cooling gas supply is configured to guide the cooling gas through the cooling passage with at least one or more of: (i) a gas pressure in a range from 2 bar to 20 bar, (ii) a gas velocity in a range from 15 m/s to 50 m/s, and (iii) a mass flow in a range from 10 slm to 50 slm. 4. The evaporation apparatus according to claim 1 , wherein a distance between the cooling passage and the evaporation crucible is 20 cm or less. 5. The evaporation apparatus according to claim 1 , further comprising a thermal insulation arrangement that at least partially or entirely encloses the cooling passage for thermally insulating the cooling passage and a section of the material conduit surrounded by the cooling passage from a hot environment inside the heatable enclosure or chamber. 6. The evaporation apparatus according to claim 5 , wherein the thermal insulation arrangement comprises one or more heat shields that coaxially extend around the material conduit. 7. The evaporation apparatus according to claim 1 , wherein the cooling gas is argon. 8. The evaporation apparatus according to claim 1 , wherein the cooling passage extends annularly around a section of the material conduit and a main flow direction of the cooling gas in the cooling passage corresponds to a main flow direction of the liquid material in the material conduit. 9. A vapor deposition apparatus for coating a substrate, comprising: the evaporation apparatus according to claim 1 ; a vapor distributor with a plurality of nozzles for directing the liquid material that has been evaporated in the evaporation crucible toward the substrate; and a movable substrate support for moving the substrate past the vapor distributor. 10. An evaporation apparatus, comprising: an evaporation crucible for evaporating a liquid material, the liquid material being lithium; a heatable enclosure having one or more heating elements, the one or more heating elements heating an inner volume of the heatable enclosure to a temperature of 300° C. or more; a material conduit for supplying the liquid material into the evaporation crucible, the material conduit extending at least partially through the heatable enclosure; a freeze valve positioned upstream from the evaporation crucible and at least partially in the heatable enclosure, comprising: a cooling passage extending helically or spirally along the material conduit and surrounding a section of the material conduit, the cooling passage in thermal contact with the material conduit; a fluid supply conduit fluidly coupled to the cooling passage at a first end of the cooling passage to provide a cooling gas to the cooling passage to cool the liquid material in the material conduit to a temperature below a melting point temperature of the liquid material such that a part of the liquid material solidifies to form a plug that clogs the material conduit; and a second fluid conduit coupled to the cooling passage at a second end of the cooling passage, the second end of the cooling passage opposite of and spaced apart from the first end of the cooling passage; and a noble gas supply for guiding the cooling gas to the cooling passage for cooling the liquid material with the cooling gas.
Other constructional types of cut-off apparatus (means for plugging pipes or hoses F16L55/10); Arrangements for cutting-off · CPC title
Crucibles for source material (C23C14/28, C23C14/30 take precedence) · CPC title
for coating elongated substrates · CPC title
Replenishment of source material · CPC title
Metallic material, boron or silicon · CPC title
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