Resin composition, prepreg, resin-equipped film, resin- equipped metal foil, metal-clad laminate, and wiring board

Patent metadata

Field	Value
Publication number	US-12286500-B2
Application number	US-202218284386-A
Country	US
Kind code	B2
Filing date	Mar 24, 2022
Priority date	Mar 29, 2021
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

First claim

The invention claimed is:

1. A resin composition comprising:
a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule; and
a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule,

wherein
the curable resin (B) contains a maleimide compound (B1) and a reactive compound (B2) other than the maleimide compound (B1),
the reactive compound (B2) includes at least one selected from the group consisting of an unsaturated double bond-modified polyphenylene ether compound having a terminal modified with a substituent having an unsaturated double bond, an allyl compound, an acrylate compound, a methacrylate compound, a polybutadiene compound, and a styrene compound,
the number of carbon atoms in the acid anhydride (a2) is 6 or more and 25 or less,
an equivalent ratio of the acid anhydride group in the acid anhydride (a 2 ) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and
a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

2. The resin composition according to claim 1 , wherein the acid anhydride (a2) includes an acid anhydride having one or more cyclic acid anhydride groups in a molecule.

3. The resin composition according to claim 1 , wherein the preliminary reaction product (A) includes an ester/carboxyl-modified polyphenylene ether compound having a terminal modified with a substituent having one or more ester bonds and carboxyl groups.

4. The resin composition according to claim 1 , wherein
a content of the maleimide compound (B1) is 10 to 70 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B), and
a content of the reactive compound (B2) is 10 to 70 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

5. The resin composition according to claim 1 , wherein the curable resin (B) further contains a benzoxazine compound.

6. The resin composition according to claim 1 , further comprising an inorganic filler.

7. The resin composition according to claim 6 , wherein the inorganic filler is subjected to surface treatment with a silane coupling agent.

8. A prepreg comprising:
the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a fibrous base material.

9. A film with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a support film.

10. A metal foil with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a metal foil.

11. A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and
a metal foil.

12. A wiring board comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and
wiring.

13. A metal-clad laminate comprising:
an insulating layer containing a cured product of the prepreg according to claim 8 ; and
a metal foil.

14. A wiring board comprising:
an insulating layer containing a cured product of the prepreg according to claim 8 ; and
wiring.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• NAKASHIMA Taichi
• Fujisawa Hiroyuki
• Otsuka Akira
• Isaji Koichi
• Ogushi Hajime

Classifications

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08K9/06

  with silicon-containing compounds · CPC title

• C08J2351/08

  grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds · CPC title

• C08J5/244

  using glass fibres · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title