Display substrate and preparation method thereof, and display apparatus

Patent metadata

Field	Value
Publication number	US-12284903-B2
Application number	US-202117795547-A
Country	US
Kind code	B2
Filing date	Sep 27, 2021
Priority date	Sep 27, 2021
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

Provided is a display substrate including a flexible base substrate, a first filling layer, and an encapsulation layer. The flexible base substrate includes at least one stretch display region. The stretch display region includes multiple pixel island regions spaced apart from each other, multiple hole regions, and a connection bridge region located between a pixel island region and a hole region. At least one hole region is provided with one or more first through holes penetrating the flexible base substrate. The first filling layer is located in the hole region and is filled in a first through hole. The encapsulation layer is located on a side of the first filling layer away from the flexible base substrate, and an orthographic projection of the encapsulation layer on the flexible base substrate is partially overlapped with or is not overlapped with the first filling layer.

First claim

The invention claimed is:

1. A display substrate, comprising:
a flexible base substrate comprising at least one stretch display region, wherein the stretch display region comprises multiple pixel island regions spaced apart from each other, multiple hole regions, and a connection bridge region located between a pixel island region and a hole region; wherein at least one hole region is provided with one or more first through holes penetrating the flexible base substrate;
a first filling layer located in the hole region and filled in a first through hole; and
an encapsulation layer located on a side of the first filling layer away from the flexible base substrate, wherein an orthographic projection of the encapsulation layer on the flexible base substrate is partially overlapped with or is not overlapped with the first filling layer.

2. The display substrate according to claim 1 , further comprising: a first planarization layer located in the pixel island region and the connection bridge region, wherein the first planarization layer and the first filling layer have a same layer structure and a same material.

3. The display substrate according to claim 1 , wherein the hole region further comprises a composite insulation layer stacked on the flexible base substrate, the composite insulation layer has a second through hole; the second through hole penetrates the composite insulation layer and penetrates through a corresponding first through hole;
the composite insulation layer comprises at least one inorganic layer, or comprises at least one organic layer, or comprises at least one inorganic layer and at least one organic layer.

4. The display substrate according to claim 3 , further comprising a second filling layer located in the hole region, wherein the second filling layer is filled in the second through hole;
the second filling layer is in contact with the first filling layer, and an orthographic projection of the second filling layer on the flexible base substrate is at least partially overlapped with an orthographic projection of the first filling layer on the flexible base substrate; and the orthographic projection of the encapsulation layer on the flexible base substrate is partially overlapped with or is not overlapped with the orthographic projection of the second filling layer on the flexible base substrate.

5. The display substrate according to claim 4 , further comprising a second planarization layer located in the pixel island region and the connection bridge region, wherein the second planarization layer is located on a side of the first planarization layer away from the flexible base substrate, and the second planarization layer and the second filling layer have a same layer structure and a same material.

6. The display substrate according to claim 2 , wherein a surface of the first filling layer is flush with a surface of the flexible base substrate.

7. The display substrate according to claim 3 , wherein the at least one hole region is provided with a second isolation groove formed on the flexible base substrate and the first filling layer, the second isolation groove penetrates through the second through hole of the composite insulation layer; at least one insulation layer in the composite insulation layer has a second protruding part, an orthographic projection of the second protruding part on the flexible base substrate is located in an orthographic projection of the second isolation groove on the flexible base substrate; and the orthographic projection of the second isolation groove on the flexible base substrate covers an orthographic projection of the first filling layer on the flexible base substrate.

8. The display substrate according to claim 2 , further comprising: a second planarization layer located on a side of the first planarization layer away from the flexible base substrate, and a passivation layer located on a side of the second planarization layer away from the flexible base substrate;
the connection bridge region is provided with a first isolation groove formed by penetrating the passivation layer and a part of the second planarization layer; the passivation layer has a first protruding part, and an orthographic projection of the first protruding part on the flexible base substrate is located in an orthographic projection of the first isolation groove on the flexible base substrate.

9. The display substrate according to claim 1 , wherein the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked.

10. A display apparatus, comprising the display substrate according to claim 1 .

11. A preparation method of a display substrate, the display substrate comprises at least one stretch display region, the stretch display region comprises multiple pixel island regions spaced apart from each other, multiple hole regions, and a connection bridge region located between a pixel island region and a hole region;
the preparation method comprises:
forming one or more first through holes penetrating a flexible base substrate in the hole region;
forming a first filling layer for filling a first through hole in the hole region; and
forming an encapsulation layer, wherein an orthographic projection of the encapsulation layer on the flexible base substrate is partially overlapped with or is not overlapped with the first filling layer.

12. The preparation method according to claim 11 , further comprising: forming a first planarization layer in the pixel island region and the connection bridge region while forming the first filling layer in the hole region.

13. The preparation method according to claim 11 , further comprising: forming a composite insulation layer on the flexible base substrate before the first filling layer is formed in the hole region, and forming a second through hole in the composite insulation layer of the hole region, wherein the second through hole penetrates the composite insulation layer and penetrates through a corresponding first through hole.

14. The preparation method according to claim 13 , further comprising: forming a second planarization layer in the pixel island region and the connection bridge region after the first filling layer is formed in the hole region, at the same time, forming a second filling layer in the hole region, wherein the second filling layer is filled in the second through hole;
wherein the second filling layer is in contact with the first filling layer, and an orthographic projection of the second filling layer on the flexible base substrate is at least partially overlapped with an orthographic projection of the first filling layer on the flexible base substrate, and the orthographic projection of the encapsulation layer on the flexible base substrate is partially overlapped with or is not overlapped with the orthographic projection of the second filling layer on the flexible base substrate.

15. The preparation method according to claim 13 , further comprising: after the first filling layer is formed in the hole region, forming a second isolation groove penetrating the composite insulation layer, a part of the second planarization part, and a part of the flexible base substrate, in the hole region; wherein the second isolation groove penetrates through the second through hole of the composite insulation layer; at least one insulation layer in the composite insulation layer has a second protruding part, an orthographic projection of the second protruding part on the flexible base substrate is located in an orthographic projection of the second isolation gr

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Jia Li
• Gao Tao
• Chan Yucheng
• Wang Pinfan

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K71/135

  using ink-jet printing · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• H10K50/80

  Constructional details · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title