Device with integrated liquid cooling system

Patent metadata

Field	Value
Publication number	US-12284783-B2
Application number	US-202117534645-A
Country	US
Kind code	B2
Filing date	Nov 24, 2021
Priority date	Nov 24, 2021
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

First claim

The invention claimed is:

1. A device comprising:
a frame having an interior;
an electronic component;
a heat conducting body in thermal contact with the electronic component;
a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body;
a heat sink positioned within the interior of the frame, wherein at least a portion of the conduit passes through the heat sink, and wherein the heat sink comprises a plurality of fins that are parallel to an axis extending between a first end and a second end of the frame; and
a first pump and a second pump positioned within the interior of the frame, the first pump and the second pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit;
wherein the first pump and the second pump are positioned one above the other relative to a bottom surface of the frame and along a side wall of the frame.

2. The device of claim 1 , further comprising one or more fan receptacles at a first end of the frame, each of the fan receptacles being configured to removably receive a fan.

3. The device of claim 2 , wherein the pump is removably insertable into the interior of the frame through one of the fan receptacles.

4. The device of claim 3 , further comprising a coupler having a first dripless blind-mate connector and a second dripless blind-mate connector to removably couple the pump to the conduit.

5. The device of claim 2 , comprising one or more fans, wherein each fan of the one or more fans is removably received within one of the fan receptacles.

6. The device of claim 1 , further comprising a coupler to couple in parallel the pump and the second pump to the conduit.

7. The device of claim 6 , wherein the coupler comprises:
a first dripless blind-mate connector and a second dripless blind-mate connector to removably couple the pump to the conduit, and
a third dripless blind-mate connector and a fourth dripless blind-mate connector to removably couple the second pump to the conduit.

8. The device of claim 1 , further comprising a controller to control the pump and the second pump to maintain a desired flow rate of the liquid coolant through the conduit.

9. The device of claim 8 , wherein the controller is a central processing unit (CPU) of the device.

10. The device of claim 1 , being a network switch device.

11. A device comprising:
a housing having: a first end, a second end, and an interior;
a heat producing component;
a cooling body in thermal contact with the heat producing component;
a conduit containing a coolant, the conduit being coupled to the cooling body to deliver the coolant to and from the cooling body;
a heat exchanger positioned within the interior of the housing and having at least a portion of the conduit passing therethrough;
one or more fan openings at the first end of the housing;
one or more fans, wherein each fan of the one or more fans is removably received within one of the fan openings; and
a first pump and a second pump positioned within the interior of the housing, the first pump and the second pump being removably insertable into the interior of the housing through one of the fan openings and being removably couplable in parallel to the conduit to circulate the coolant through the conduit;
wherein the first pump and the second pump are positioned one above the other relative to a bottom surface of the housing and along a side wall of the housing.

12. The device of claim 11 , further comprising a coupler comprising:
a first dripless blind-mate connector and a second dripless blind-mate connector to removably couple the first pump to the conduit, and
a third dripless blind-mate connector and a fourth dripless blind-mate connector to removably couple the second pump to the conduit.

13. The device of claim 11 , wherein the heat exchanger comprises a heat sink and wherein the heat sink comprises a plurality of fins that are parallel to an axis extending between the first end and the second end of the housing.

14. The device of claim 11 , further comprising a controller to control the first pump and the second pump to maintain a desired flow rate of the coolant through the conduit.

15. The device of claim 14 , wherein the controller controlling the one or more fans to maintain a desired flow rate of air into the interior of the housing.

16. The device of claim 14 , wherein the controller is a central processing unit (CPU) of the device.

17. The device of claim 11 , being a network switch device.

18. A device comprising:
a frame having an interior;
a heat producing device;
a cooling body in contact with the heat producing device;
a coolant conduit delivering coolant to the cooling body;
a heat sink positioned within the interior of the frame, wherein at least a portion of the coolant conduit passes through the heat sink, and wherein the heat sink comprises a plurality of fins that are parallel to an axis extending between a first end and a second end of the frame; and
a first pump and a second pump positioned within the interior of the frame to circulate the liquid coolant in the conduit, the first pump and the second pump being positioned one above the other relative to a bottom surface of the frame and along a side wall of the frame.

Assignees

• Mellanox Technologies Ltd

Inventors

• Weltsch Oren
• Becker Rom
• Zaretsky Shay
• Shabtay Ayal
• Halachmi Beeri
• Blayer Yuval
• Katz Kfir
• Dagan Yuval
• Noyman Bar

Classifications

• G06F1/20

  Cooling means · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• G06F1/181

  Enclosures (for portable computers G06F1/1613) · CPC title