Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-12283431-B2
Application number	US-202318132195-A
Country	US
Kind code	B2
Filing date	Apr 7, 2023
Priority date	Dec 8, 2022
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
first and second external electrodes respectively disposed on the third and fourth surfaces and connected to the first internal electrode; and
a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode,
wherein one of the first and second external electrodes includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer,
the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound and a first resin, and
a ratio (N1/N2) of N1 to N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.

2. The multilayer electronic component of claim 1 , wherein the Feret diameter of the first conductive particle is measured in a cross-section of the first conductive resin layer in the first and second direction.

3. The multilayer electronic component of claim 2 , wherein, in the cross-section of the first conductive resin layer in the first and second directions, the Feret diameter of the first conductive particle is measured in a region in which a size in the first direction is 10 μm to 20 μm and a size in the second direction is 10 μm to 35 μm based on a center of the first conductive resin layer in the second direction.

4. The multilayer electronic component of claim 1 , wherein an average Feret diameter of the first conductive particles is 10 μm or more.

5. The multilayer electronic component of claim 1 , wherein the third external electrode includes a 3-1-th external electrode disposed on the fifth surface and a 3-2-th external electrode disposed on the sixth surface.

6. The multilayer electronic component of claim 1 , wherein
the third external electrode includes a third electrode layer connected to the second internal electrode and a third conductive resin layer disposed on the third electrode layer,
the third conductive resin layer includes third conductive particles including at least one of third metal particles and a third intermetallic compound and a third resin, and
a ratio (N1′/N2′) of N1′ to N2′ is greater than or equal to 17%, in which N1′ is the number of particles having a Feret diameter of 14 μm or more, among the third conductive particles, and N2′ is a total number of third conductive particles.

7. The multilayer electronic component of claim 6 , wherein the Feret diameter of the third conductive particle is measured in a cross-section of the third conductive resin layer in the first and third directions.

8. The multilayer electronic component of claim 1 , wherein the first intermetallic compound is an intermetallic compound between the first metal particle and a low melting point metal having a melting point lower than that of the first metal particle.

9. The multilayer electronic component of claim 8 , wherein the first metal particle includes at least one of Ag and Cu, the low melting point metal includes Sn or an Sn alloy, and the first intermetallic compound includes one or more of Cu 3 Sn, Cu 6 Sn 5 , and Ag 3 Sn.

10. The multilayer electronic component of claim 1 , wherein the one of the first and second external electrodes includes a first interfacial layer including a second intermetallic compound and disposed between the first electrode layer and the first conductive resin layer.

11. The multilayer electronic component of claim 10 , wherein the second intermetallic compound includes Cu 3 Sn.

12. The multilayer electronic component of claim 10 , wherein the first interfacial layer further includes glass in contact with the first electrode layer.

13. The multilayer electronic component of claim 10 , wherein the one of the first and second external electrodes includes a first plating layer disposed on the first conductive resin layer, and at least some of the first conductive particles connect the first interfacial layer and the first plating layer.

14. The multilayer electronic component of claim 1 , wherein an average thickness of the first conductive resin layer measured on the third surface is 30 μm or less.

15. The multilayer electronic component of claim 1 , wherein the first electrode layer includes Cu and glass.

16. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
first and second external electrodes respectively disposed on the third and fourth surfaces and connected to the first internal electrode; and
a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode,
wherein the third external electrode includes a third electrode layer connected to the second internal electrode and a third conductive resin layer disposed on the third electrode layer,
the third conductive resin layer includes third conductive particles including at least one of third metal particles and a third intermetallic compound and a third resin, and
a ratio (N1′/N2′) of N1′ to N2′ is greater than or equal to 17%, in which N1′ is the number of particles having a Feret diameter of 14 μm or more, among the third conductive particles, and N2′ is a total number of third conductive particles.

17. The multilayer electronic component of claim 16 , wherein the third external electrode includes a 3-1-th external electrode disposed on the fifth surface and a 3-2-th external electrode disposed on the sixth surface.

18. The multilayer electronic component of claim 16 , wherein the Feret diameter of the third conductive particle is measured in a cross-section of the third conductive resin layer in the first and third directions.

19. The multilayer electronic component of claim 16 , wherein the third intermetallic compound is an intermetallic compound between the third metal particle and a low melting point metal having a melting point lower than that of the third metal particle.

20. The multilayer electronic component of claim 16 , wherein the third external electrode includes a third interfacial layer including a fourth intermetallic compound and disposed between the third electrode layer and the third conductive resin layer and glass in contact with the third electrode layer.

Assignees

• Samsung Electro Mech

Inventors

• Yun Su Yun
• Choi Hong Je
• Han Ji Hye
• Kang Byung Woo
• Park Hye Jin
• Lee Sang Wook
• Kim Jung Min

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1227 Primary

  based on alkaline earth titanates · CPC title