Gravure plate for wiring printing

US12280586B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12280586-B2
Application numberUS-202318121207-A
CountryUS
Kind codeB2
Filing dateMar 14, 2023
Priority dateMar 22, 2022
Publication dateApr 22, 2025
Grant dateApr 22, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a gravure plate for wiring printing on which a recessed portion defining a wiring pattern is formed on a plate surface, a projecting portion for reducing a volume of the recessed portion is formed on a bottom surface of the recessed portion. A contour of the projecting portion in cross section parallel to the plate surface has a semicircular arc shape, which protrudes toward one side in one direction that is parallel to the plate surface, on the one side. The recessed portion has a side wall that is composed of a plane orthogonal to the plate surface and faces the projecting portion at a distance of 15 μm or less without coming into contact with the projecting portion. The contour of the projecting portion has a semicircular arc shape, which protrudes toward the side wall, also on a side closer to the side wall.

First claim

Opening claim text (preview).

What is claimed is: 1. A gravure printing plate for gravure-printing a wiring pattern with conductive ink including silver particles, the gravure printing plate comprising: a groove to be filled with the conductive ink by a doctor blade squeegeeing the gravure printing plate in a predetermined squeegeeing direction, the groove having two parallel sidewalls and a bottom extending between the two parallel sidewalls; and a bump standing on the bottom of the groove, the bump having a top face located in the groove, wherein the bump consists, when viewed in the predetermined squeegeeing direction, of a front portion close to the doctor blade heading for the groove, and a rear portion being a remaining portion thereof, the front portion of the bump has a shape of a half cylinder and face neither of the two parallel sidewalls within a range of smaller than six micrometers in front, in the predetermined squeegeeing direction, of the front portion, the rear portion of the bump has a shape different from the shape of the front portion of the bump, the bump consists, when viewed in a direction in which the two parallel sidewalls face each other, of a first portion apart from one of the two parallel sidewalls by a minimum interval between six micrometers and fifteen micrometers inclusive, and a second portion, being a remaining portion thereof, either abutting the other of the two parallel sidewalls to have a planar boundary therebetween or apart from the other of the two parallel sidewalls by a minimum interval not smaller than fifteen micrometers, the first portion of the bump has a shape of a half cylinder, and the second portion of the bump has a shape different from the shape of the first portion of the bump.

Assignees

Inventors

Classifications

  • details of the printing plate ends · CPC title

  • Combinations of endless conveyors and grippers · CPC title

  • Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

  • Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • Details · CPC title

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Frequently asked questions

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What does patent US12280586B2 cover?
In a gravure plate for wiring printing on which a recessed portion defining a wiring pattern is formed on a plate surface, a projecting portion for reducing a volume of the recessed portion is formed on a bottom surface of the recessed portion. A contour of the projecting portion in cross section parallel to the plate surface has a semicircular arc shape, which protrudes toward one side in one …
Who is the assignee on this patent?
Japan Aviation Electronics Ind Ltd
What technology area does this patent fall under?
Primary CPC classification B41F13/11. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).