Circuit module and method for manufacturing submodule

Patent metadata

Field	Value
Publication number	US-12279374-B2
Application number	US-202318169333-A
Country	US
Kind code	B2
Filing date	Feb 15, 2023
Priority date	Aug 31, 2020
Publication date	Apr 15, 2025
Grant date	Apr 15, 2025

Abstract

A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part that is mounted on a top surface of the sub-substrate, a plurality of conductive members that have linear shapes, and are connected to the top surface of the sub-substrate and the shield film, and a subsealing resin that is provided on the top surface of the sub-substrate, and covers the electronic part and part of each of the plurality of conductive members.

First claim

What is claimed is:

1. A circuit module comprising:
a main substrate;
a submodule mounted on a top surface of the main substrate;
a main sealing resin provided on the top surface of the main substrate, and covering at least part of the submodule; and
a conductive shield film covering at least part of the main sealing resin, wherein
the submodule includes:
a sub-substrate,
an electronic part mounted on a top surface of the sub-substrate;
a plurality of conductive members having linear shapes or bar shapes, and connected to the top surface of the sub-substrate and the shield film; and
a subsealing resin provided on the top surface of the sub-substrate, and covering at least part of the electronic part and part of each of the plurality of conductive members.

2. The circuit module of claim 1 , wherein
the shield film includes an upper film covering an upper side of the main sealing resin, and wherein
the plurality of conductive members are connected with the upper film.

3. The circuit module of claim 1 , wherein
the electronic part is surrounded by the plurality of conductive members in plan view.

4. The circuit module of claim 1 , wherein
the shield film includes a side film covering a lateral side of the main sealing resin, and wherein
the electronic part is surrounded by the plurality of conductive members and the side film in plan view.

5. The circuit module of claim 1 , wherein
the shield film includes a side film covering a lateral side of the main sealing resin, and wherein
the sub-substrate includes a planar electrode, and a side surface of the planar electrode is exposed from a lateral side of the sub-substrate, and connected with the side film.

6. The circuit module of claim 5 , wherein
the planar electrode is conducted with the plurality of conductive members.

7. The circuit module of claim 5 , wherein
the electronic part is surrounded by the plurality of conductive members and the planar electrode in plan view.

8. The circuit module of claim 5 , wherein
at least part of the planar electrode overlaps at least part of the electronic part in plan view.

9. The circuit module of claim 1 , wherein
the shield film includes a side film covering a lateral side of the main sealing resin, and
each of the plurality of conductive members includes:
an upward extending part extending upward from a top surface of the sub-substrate; and
a laterally extending part extending laterally from a distal end part of the upward extending part, and wherein
a distal end part of the laterally extending part is connected with the side film.

10. The circuit module of claim 9 , wherein
at least part of the laterally extending part overlaps at least part of the electronic part in plan view.

11. The circuit module of claim 1 , wherein
the submodule further includes a non-linear terminal disposed in a back surface of the sub-substrate, and conducted with the plurality of conductive members, and wherein
the terminal is connected with the main substrate, and conducted with the shield film via the main substrate.

12. The circuit module of claim 11 , wherein
the terminal has a bar shape.

13. The circuit module of claim 11 , wherein
the plurality of conductive members have linear shapes.

14. A method for manufacturing the submodule comprised in the circuit module of claim 1 , comprising:
a mounting step of mounting the electronic part on the top surface of the sub-substrate;
a connecting step of connecting the plurality of conductive members having linear shapes or bar shapes to the top surface of the sub-substrate; and
a covering step of covering at least part of the electronic part with the subsealing resin, and covering the plurality of conductive members with the subsealing resin at such postures that at least a distal end part of each of the plurality of conductive members is exposed upward.

15. A method for manufacturing the submodule comprised in the circuit module of claim 1 , comprising:
a mounting step of mounting the electronic part on the top surface of the sub-substrate;
a connecting step of connecting two positions to the top surface of the sub-substrate such that a top part of each of the plurality of conductive members having linear shapes is located above the top surface of the sub-substrate, the two portions being located on both sides of the top part of each of the plurality of conductive members;
a covering step of covering the electronic part and the plurality of conductive members with the subsealing resin; and
a removing step of removing the top part of each of the plurality of conductive members by removing an upper part of the subsealing resin, and dividing each of the plurality of conductive members into two conductive members taking such postures that the two conductive members stand upward from the top surface of the sub-substrate and distal end parts of the two conductive members are exposed upward.

Assignees

• Murata Manufacturing Co

Inventors

• Otsubo Yoshihito
• Hatase Minoru

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K1/023

  using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16) · CPC title