Reworkable inter-substrate bond structure

Patent metadata

Field	Value
Publication number	US-12278212-B2
Application number	US-202217663857-A
Country	US
Kind code	B2
Filing date	May 18, 2022
Priority date	May 18, 2022
Publication date	Apr 15, 2025
Grant date	Apr 15, 2025

Abstract

An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

First claim

What is claimed is:

1. An inter-substrate bond structure comprising:
an adhesion layer configured to attach the inter-substrate bond structure to a first substrate;
an outer gas-permeable layer coupled to the adhesion layer, wherein the outer gas-permeable layer is configured to expand and create a fracture in the inter-substrate bond structure in response to an absorption of a gas; and
an outer bond layer coupled to the outer gas-permeable layer, wherein the outer bond layer is configured to form an initial thermocompression bond with a mating layer on a second substrate in response to an applied pressure and an applied heat,
wherein the initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure, and the fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

2. The inter-substrate bond structure according to claim 1 , further comprising:
an inner bond layer disposed between the adhesion layer and the outer gas-permeable layer, wherein the inner bond layer is configured to form a subsequent thermocompression bond after the outer bond layer and the outer gas-permeable layer are removed from the inter-substrate bond structure.

3. The inter-substrate bond structure according to claim 2 , further comprising:
an intermediate gas-permeable layer disposed between the outer gas-permeable layer and the inner bond layer, wherein the intermediate gas-permeable layer is configured to expand and create another fracture in the inter-substrate bond structure in response to another absorption of the gas, and the intermediate gas-permeable layer absorbs the gas at an intermediate rate, the outer gas-permeable layer absorbs the gas at an outer rate, and the intermediate rate is slower than the outer rate; and
an intermediate bond layer disposed between the outer gas-permeable layer and the intermediate gas-permeable layer, wherein the intermediate bond layer is configured to form another thermocompression bond after the outer bond layer and the outer gas-permeable layer are removed from the inter-substrate bond structure.

4. The inter-substrate bond structure according to claim 3 , further comprising:
an intermediate gateway layer adjoining the intermediate gas-permeable layer, wherein the intermediate gateway layer is configured to transfer the gas from an atmosphere around the inter-substrate bond structure into the intermediate gas-permeable layer.

5. The inter-substrate bond structure according to claim 1 , further comprising:
an outer gateway layer adjoining the outer gas-permeable layer, wherein the outer gateway layer is configured to transfer the gas from an atmosphere around the inter-substrate bond structure into the outer gas-permeable layer.

6. The inter-substrate bond structure according to claim 5 , further comprising:
an outer oxide coating formed on an exterior surface of the outer gas-permeable layer, wherein the outer oxide coating blocks the gas from transferring from the atmosphere around the inter-substrate bond structure through the outer oxide coating and into the outer gas-permeable layer.

7. The inter-substrate bond structure according to claim 6 , wherein the outer gateway layer comprises palladium, and the gas comprises hydrogen.

8. The inter-substrate bond structure according to claim 1 , wherein:
the outer gas-permeable layer comprises one or more of titanium, titanium alloy, vanadium, niobium, palladium, tantalum, lanthanum, yttrium, zirconium, scandium, lithium, sodium, and magnesium; and
the gas comprises hydrogen.

9. The inter-substrate bond structure according to claim 1 , wherein the first substrate comprises one of a semiconductor die, a semiconductor tile, or a semiconductor wafer.

10. A method for fabricating an inter-substrate bond structure comprising:
forming an adhesion layer of the inter-substrate bond structure on a first substrate;
forming an outer gas-permeable layer coupled to the adhesion layer, wherein the outer gas-permeable layer is configured to expand and create a fracture in the inter-substrate bond structure in response to an absorption of a gas; and
forming an outer bond layer coupled to the outer gas-permeable layer,
wherein the outer bond layer is configured to form an initial thermocompression bond with a mating layer on a second substrate in response to an applied pressure and an applied heat, the initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure, and the fracture in the inter-substrate bond structure debonds first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

11. The method according to claim 10 , further comprising:
forming an inner bond layer between the adhesion layer and the outer gas-permeable layer, wherein the inner bond layer is configured to form a subsequent thermocompression bond after the outer bond layer and the outer gas-permeable layer are removed from the inter-substrate bond structure.

12. The method according to claim 11 , further comprising:
forming an intermediate gas-permeable layer between the outer gas-permeable layer and the inner bond layer, wherein the intermediate gas-permeable layer is configured to expand and create another fracture in the inter-substrate bond structure in response to another absorption of the gas, the intermediate gas-permeable layer absorbs the gas at an intermediate rate, the outer gas-permeable layer absorbs the gas at an outer rate, and the intermediate rate is slower than the outer rate; and
forming an intermediate bond layer between the outer gas-permeable layer and the intermediate gas-permeable layer, wherein the intermediate bond layer is configured to form another thermocompression bond after the outer bond layer and the outer gas-permeable layer are removed from the inter-substrate bond structure.

13. The method according to claim 12 , further comprising:
forming an intermediate gateway layer adjoining the intermediate gas-permeable layer, wherein the intermediate gateway layer is configured to transfer the gas from an atmosphere around the inter-substrate bond structure into the intermediate gas-permeable layer.

14. The method according to claim 10 , further comprising:
forming an outer gateway layer adjoining the outer gas-permeable layer, wherein the outer gateway layer is configured to transfer the gas from an atmosphere around the inter-substrate bond structure into the outer gas-permeable layer.

15. The method according to claim 14 , further comprising:
forming an oxide coating on an exterior surface of the outer gas-permeable layer, wherein the oxide coating blocks the gas from transferring from the atmosphere around the inter-substrate bond structure through the oxide coating and into the outer gas-permeable layer.

16. The method according to claim 10 , wherein the fracture occurs internal to the outer gas-permeable layer.

17. The method according to claim 10 , wherein the fracture is at one or more boundaries between the mating layer and the outer bond layer, between the outer bond layer and the outer gateway layer, between the outer gateway layer and the outer gas-permeable layer, and between the outer gas-permeable layer and the inner bond layer.

18. A method of reworking an inter-substrate thermocompression bond, comprising:
forming an adhesion layer of a

Assignees

• Boeing Co

Inventors

• Brewer Peter D
• Vajo John J
• Terterian Sevag
• Chang Chia-Ming
• Abijaoude Charbel
• Carrasco Diego Eduardo

Classifications

• H10W90/792

  between multiple chips · CPC title

• H10W80/334

  Thermocompression bonding · CPC title

• H10W80/161

  Aligning · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title