Flexible printed circuit board and electronic device including the same

Patent metadata

Field	Value
Publication number	US-12273992-B2
Application number	US-202217861630-A
Country	US
Kind code	B2
Filing date	Jul 11, 2022
Priority date	Jul 22, 2020
Publication date	Apr 8, 2025
Grant date	Apr 8, 2025

Abstract

A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.

First claim

The invention claimed is:

1. A flexible printed circuit board (FPCB) of an electronic device comprising a flexible display having a shape deformed by a hinge structure, the FPCB comprising:
a bending portion which is bent according to a deformation of the shape of the electronic device; and
a non-bending portion which extends from the bending portion,
wherein the bending portion and the non-bending portion are formed to have different thicknesses,
wherein an insulation layer is formed to have a first thickness in the bending portion, and
wherein the insulation layer is formed to have a second thickness thicker than the first thickness in the non-bending portion.

2. The FPCB of claim 1 ,
wherein the bending portion is formed to have a first portion thickness, and
wherein the non-bending portion is formed to have a second portion thickness thicker than the first portion thickness.

3. The FPCB of claim 1 , further comprising:
an electromagnetic shield layer and at least one wire unit,
wherein the at least one wire unit comprises a base film, a metal layer on the base film, and the insulation layer on the metal layer.

4. The FPCB of claim 3 , wherein the insulation layer comprises a coverlay adhesive layer.

5. The FPCB of claim 3 , wherein the metal layer comprises radio frequency (RF) signal wires and ground wires.

6. The FPCB of claim 1 , wherein a first resin tunnel having a first width is formed in the bending portion by removing a copper foil.

7. The FPCB of claim 6 ,
wherein a second resin tunnel is formed in the non-bending portion by controlling a portion of the copper foil, and
wherein the second resin tunnel has a second width narrower than the first width.

8. The FPCB of claim 6 , wherein the copper foil is disposed in the non-bending portion.

9. The FPCB of claim 1 , wherein the bending portion is formed on a portion that is bent according to folding and unfolding of the flexible display.

10. The FPCB of claim 1 , wherein the bending portion is formed on a portion that is bent according to whether the flexible display slides open or closed.

11. An electronic device comprising:
a hinge structure;
a flexible display having a shape deformed by the hinge structure; and
a flexible printed circuit board (FPCB),
wherein the FPCB comprises:
a bending portion which is bent according to a deformation of a shape of the electronic device, and
a non-bending portion which extends from the bending portion,

wherein the bending portion and the non-bending portion are formed to have different thicknesses,
wherein an insulation layer is formed to have a first thickness in the bending portion, and
wherein the insulation layer is formed to have a second thickness thicker than the first thickness in the non-bending portion.

12. The electronic device of claim 11 ,
wherein the bending portion of the FPCB is formed to have a first portion thickness, and
wherein the non-bending portion is formed to have a second portion thickness thicker than the first portion thickness.

13. The electronic device of claim 11 ,
wherein the FPCB comprises an electromagnetic shield layer and at least one wire unit,
wherein the at least one wire unit comprises a base film, a metal layer on the base film, and the insulation layer on the metal layer.

14. The electronic device of claim 13 , wherein the insulation layer of the FPCB comprises a coverlay adhesive layer.

15. The electronic device of claim 13 , wherein the metal layer comprises radio frequency (RF) signal wires and ground wires.

16. The electronic device of claim 11 , wherein a first resin tunnel having a first width is formed in the bending portion of the FPCB by removing a copper foil.

17. The electronic device of claim 16 ,
wherein a second resin tunnel is formed in the non-bending portion by controlling a portion of the copper foil, and
wherein the second resin tunnel has a second width narrower than the first width.

18. The electronic device of claim 16 , wherein the copper foil is disposed in the non-bending portion.

19. The electronic device of claim 11 , wherein the bending portion is formed on a portion that is bent according to folding and unfolding of the flexible display.

20. The electronic device of claim 11 , wherein the bending portion is formed on a portion that is bent according to whether the flexible display slides open or closed.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Youngsun
• Jeon Jongmin
• Kim Hyunsuk
• Choi Kyuwon

Classifications

• H05K2201/056

  Folded around rigid support or component · CPC title

• H05K5/0226

  Hinges · CPC title

• H05K5/0017

  with operator interface units · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K2201/10128

  Display · CPC title