Sputtering apparatus for coating of 3D-objects

Patent metadata

Field	Value
Publication number	US-12272525-B2
Application number	US-202218554754-A
Country	US
Kind code	B2
Filing date	Feb 22, 2022
Priority date	Apr 16, 2021
Publication date	Apr 8, 2025
Grant date	Apr 8, 2025

Abstract

An apparatus to coat at least one three-dimensional (3D) object. The apparatus includes: a coating chamber; a vacuum pump system; a chamber port; and a rotatable object holder. The holder has a rotational axis Z. At least two rotary cathodes are positioned in the chamber. Each cathode includes a hollow cylindrical rotary target having a rotary axis Y. A magnetic system is swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of the target. At least one power supply is provided for the target. The targets of the at least two rotary cathodes are positioned round the holder, with their axes Y 1 , Y 2 transverse to axis Z, both being offset to the holder in a z-direction, and being offset to each other in a direction along axis Z on opposite sides of an object plane O which is vertical to axis Z.

First claim

What is claimed is:

1. An apparatus to coat at least one three-dimensional (3D) object on a surface by physical vapor deposition, the apparatus comprising:
a coating chamber;
a vacuum pump system connected to the chamber by a vacuum port;
a chamber port;
a rotatable object holder, the holder having a rotational axis Z, and an object axis of the at least one 3D-object to be mounted corresponds to the holder axis Z;
at least two rotary cathodes positioned in the chamber, the cathodes each comprising a hollow cylindrical rotary target having a rotary axis Y;
a plurality of magnetic systems which are swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of each of the targets;
at least one power supply for the target;
wherein the targets of the at least two rotary cathodes are positioned round the holder, with their axes Y 1 , Y 2 transverse to axis Z, both being offset to the holder in a z-direction, and being offset to each other in a direction along axis Z on opposite sides of an object plane O, O′, O″ which is vertical to axis Z, and the holder is movable along axis Z to position the object plane O, O′, O″ in or near the center of a circumferential edge, protrusion, or recess of the 3D-object to be coated, and
wherein the apparatus comprises a magnet controller being designed to control a position angle β or/and a swivel frequency f of the magnetic systems in dependency of a number m of holder turns round axis Z, where m is an integer, to set the position angle β of the magnetic systems of the targets to another in dependency of the shape of the at least one object to be mounted on the holder and sweep or position a center of a sputter cone in an angle Bx from 0° to 90° or smaller to deposit a coating on the surface of the at least one 3D-object to be mounted.

2. The apparatus according to claim 1 , wherein axes Y 1 , Y 2 of the targets are in a right angle to axis Z.

3. The apparatus according to claim 1 , wherein axes Y 1 , Y 2 of the targets are both horizontal.

4. The apparatus according to claim 1 , wherein the holder is mounted on the closure of the chamber port.

5. The apparatus according to claim 1 , wherein the chamber port is mounted in a bottom area of the chamber.

6. The apparatus according to claim 1 , comprising at least one further rotary cathode, positioned above or below the at least two rotary cathodes.

7. The apparatus according to claim 1 , comprising at least one planar magnetron, positioned above or below the at least two rotary cathodes.

8. The apparatus according to claim 1 , wherein targets are positioned on the same side of the holder.

9. The apparatus according to claim 1 , wherein targets are positioned on opposite sides of the holder.

10. The apparatus according to claim 1 , comprising 2n targets wherein n is an integer.

11. The apparatus according to claim 1 , wherein the at last one target on one side of plane O, O′, O″ and the at last one target on the other side of plane O, O′, O″ each have a separate power supply.

12. The apparatus according to claim 1 , wherein at last one target on one side of plane O, O′, O″ and at last one target positioned next on the other side of plane O, O′, O″ is connected to a bipolar power supply in dual magnetron configuration.

13. The apparatus according to claim 1 , comprising a control system with a power modulator adapted to set and control the power of the at least one power supply and a magnet controller adapted to set and control movement and position of the magnetic system.

14. A process to deposit a coating on a surface of at least one 3D-object using an apparatus according to claim 1 and comprising the following steps:
mounting the at least one 3D-object on the holder;
transferring the holder with the 3D-object into the coating chamber;
applying vacuum to the chamber by opening the vacuum port;
setting a gas flow of inert gas and setting optionally a gas flow of a reactive gas;
optionally applying a substrate bias to the 3D-object;
connecting the targets to a power supply to sputter material from the targets towards the surface.

15. The process according to claim 14 , wherein a target power P of at least one of the targets is synchronized by a power modulator with at least one of the following process features:
a rotation angle α of the holder round axis Z,
a position angle β of the magnetic system,
a swivel frequency f of the magnetic system,
an angular velocity ω of the magnetic system.

16. The process according to claim 14 , wherein the magnetic systems of the targets are swivel mounted, and a magnet controller controls the position angle β or/and a swivel frequency f of each of the magnetic systems in dependency of a rotation angle α of the holder round axis Z.

17. The process according to claim 14 , wherein a position angle β of the magnetic system is set in a range from ±0° towards plane O, O′, O″ to ±90° towards axis Z or smaller.

18. The process according to claim 14 , wherein the magnetic systems are rotary mounted, and a magnet controller controls an angular velocity ω of the magnetic system in dependency of a number m of turns of the holder, where m is an integer, or in dependency of a rotation angle α of the holder round axis Z.

19. The process according to claim 14 , wherein an object to be coated has a long Z-Axis and is of a cylindric, or prismatic, or cuboid shape.

20. The process according to claim 14 , wherein the object to be coated is a flat body having two horizontal axes A, B of essentially different length in a relation of 10/12 to 10/40, and a thickness in a relation of 1 to 150 to one of horizontal axes A, B.

21. A process to deposit a coating on a surface of at least one 3D-object comprising the following steps:
providing an apparatus comprising:
a coating chamber;
a vacuum pump system connected to the chamber by a vacuum port;
a chamber port;
a rotatable object holder, the holder having a rotational axis Z;
at least one rotary cathode positioned in the chamber, the cathode comprising a plurality of hollow cylindrical rotary targets having a rotary axis Y;
a plurality of magnetic systems which are swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of each of the targets;
at least one power supply for the target;
the target of the rotary cathode being positioned with axis Y 1 , Y 2 in a target plane T′, T″, the target plane being perpendicular to axis Z, both targets being offset to the holder and to each other in a z-direction, on opposite sides of an object plane O, O′, O″ which is vertical to the axis Z, and the rotary cathode(s) being positioned in a distance D from rotary axis Z;

mounting the at least one 3D-object on the rotatable holder;
transferring the holder with the 3D-object into the coating chamber; and
positioning at least one object plane O, O′, O″ comprising an essentially circumferential edge, protrusion or recess in a distance to a target plane T′, T″ to allow sputtering in an angle β E to the edge, protrusion or recess;
applying vacuum to the chamber by opening the vacuum port;
setting a gas flow of an inert gas and setting optionally a gas flow of a reactive gas;
optionally applying a substrate bias to the 3D-object;
rotating the 3D-object;
connecting the targets to a power supply to sputter material from the targets towards the surface; and
swiveling or rotating the magnetic system to sweep or position a center of a sputter cone in an angle β x

Assignees

• Evatec Ag

Inventors

• Voser Stephan

Classifications

• H01J37/342

  Hollow targets · CPC title

• H01J2237/332

  Coating · CPC title

• H01J37/3455

  Movable magnets · CPC title

• H01J37/3417

  Arrangements · CPC title

• H01J37/3408

  Planar magnetron sputtering · CPC title