Sound damping wallboard and method of constructing a sound damping wallboard

US12270207B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12270207-B2
Application numberUS-202318454179-A
CountryUS
Kind codeB2
Filing dateAug 23, 2023
Priority dateFeb 5, 2015
Publication dateApr 8, 2025
Grant dateApr 8, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard comprises a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a sound damping layer disposed at the gypsum layer inner surface for installation between the gypsum layer and an installed wallboard and having a sound damping layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, and a second encasing layer disposed at the sound damping layer inner surface.

First claim

Opening claim text (preview).

We claim: 1. A method for forming a sound damping wallboard, comprising: providing a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, the gypsum layer having a first encasing layer disposed at the gypsum layer outer surface and a third encasing layer disposed at the gypsum layer inner surface; applying a sound damping layer to the third encasing layer such that the sound damping layer includes a sound damping layer inner surface opposite the gypsum layer inner surface; and providing a second encasing layer at the sound damping layer inner surface, wherein the second encasing layer is formed of a material comprising paper, fiberglass, foil, or a polymer; wherein, when attached to an installed wallboard, the sound damping layer is disposed between the gypsum layer and the installed wallboard. 2. The method of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about 5/16 inch or less. 3. The method of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about ¼ inch or less. 4. The method of claim 1 , wherein the sound damping layer comprises a polymer. 5. The method of claim 1 , wherein the sound damping layer comprises an elastomer. 6. The method of claim 5 , wherein the elastomer comprises an acrylic polymer. 7. The method of claim 5 , wherein the elastomer comprises an acrylic copolymer. 8. The method of claim 1 , wherein the sound damping layer comprises an adhesive. 9. The method of claim 1 , wherein the second encasing layer is a curable coating. 10. The method of claim 9 , wherein the curable coating is applied to the sound damping layer inner surface and then cured to form the second encasing layer. 11. The method of claim 9 , wherein the curable coating is applied to the sound damping layer inner surface by spraying. 12. The method of claim 1 , wherein the first encasing layer comprises paper. 13. The method of claim 1 , wherein the second encasing layer comprises paper. 14. The method of claim 1 , wherein the third encasing layer comprises paper. 15. The method of claim 1 , wherein the first encasing layer and the third encasing layer comprise paper. 16. The method of claim 1 , wherein at least one of the first encasing layer, the second encasing layer, or the third encasing layer comprise a plurality of sheets. 17. The method of claim 1 , wherein the first encasing layer and the third encasing layer comprise a plurality of sheets. 18. The method of claim 1 , wherein the sound damping wallboard further comprises a first edge encasing layer. 19. The method of claim 18 , wherein the sound damping wallboard further comprises a second edge encasing layer. 20. The method of claim 1 , wherein the method further comprises: providing the first encasing layer; depositing a gypsum slurry on the first encasing layer to form the gypsum layer; and providing the third encasing layer to the gypsum layer inner surface before applying the sound damping layer to the third encasing layer. 21. The method of claim 1 , wherein the gypsum layer is the only gypsum layer of the sound damping wallboard.

Assignees

Inventors

Classifications

  • Room acoustics, i.e. forms of, or arrangements in, rooms for influencing or directing sound (E04B1/82 takes precedence; acoustics in general G10K11/00; electric signal processing for producing a reverberation or echo sound G10K15/08) · CPC title

  • with a bottom layer for sound insulation · CPC title

  • stone or stone-like materials, e.g. ceramics {concrete,}; of glass {or with an outer layer of stone or stone-like materials or glass (E04F13/0864 takes precedence; producing shaped elements from concrete, ceramic compositions or other stone-like materials B28B; prefabricated panels in general E04C2/00)} · CPC title

  • having a basic insulating layer and at least one covering layer · CPC title

  • layered · CPC title

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What does patent US12270207B2 cover?
A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard comprises a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a sound damping layer disposed at the gypsum layer inner surface for install…
Who is the assignee on this patent?
Gold Bond Building Products Llc
What technology area does this patent fall under?
Primary CPC classification E04B1/86. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Apr 08 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).