Liquid ejecting head and liquid ejecting apparatus

Patent metadata

Field	Value
Publication number	US-12269265-B2
Application number	US-202318321206-A
Country	US
Kind code	B2
Filing date	May 22, 2023
Priority date	May 23, 2022
Publication date	Apr 8, 2025
Grant date	Apr 8, 2025

Abstract

A liquid ejecting head includes an introduction portion for introducing a gas supplied, a discharge portion for discharging the gas, and drive circuits provided in each of head chips, in which the drive circuits include a first drive circuit for driving the first head chip and a second drive circuit for driving the second head chip, a gas path through which the gas flows from the introduction portion to the discharge portion includes a first path coupled to the introduction portion, a second path coupled to the discharge portion, a first branch path coupling the first path and the second path, and a second branch path coupling the first path and the second path so as not to pass through the first branch path, the first drive circuit is disposed in the first branch path, and the second drive circuit is disposed in the second branch path.

First claim

What is claimed is:

1. A liquid ejecting head comprising:
head chips configured to eject liquid in an ejection direction;
one or a plurality of introduction portions for introducing a gas supplied from a gas supply mechanism into an inside of the liquid ejecting head;
a discharge portion for discharging the gas supplied to the one or the plurality of introduction portions to an outside of the liquid ejecting head; and
drive circuits provided in each of the head chips, wherein
the head chips include a first head chip and a second head chip,
the drive circuits include a first drive circuit for driving the first head chip and a second drive circuit for driving the second head chip,
a gas path through which the gas flows from the one or the plurality of introduction portions to the discharge portion includes
a first path coupled to the one or the plurality of introduction portions,
a second path coupled to the discharge portion,
a first branch path coupling the first path and the second path, and
a second branch path coupling the first path and the second path so as not to pass through the first branch path,
the first drive circuit is disposed in the first branch path, and
the second drive circuit is disposed in the second branch path.

2. The liquid ejecting head according to claim 1 , wherein
the first path includes a first accommodation space accommodating the head chips and a communication portion through which the first accommodation space communicates with the one or the plurality of introduction portions, and
each of the first branch path and the second branch path is coupled to the first accommodation space.

3. The liquid ejecting head according to claim 2 , further comprising:
a first relay substrate coupled to the first head chip and the second head chip, wherein
the second path includes a second accommodation space accommodating the first relay substrate, and
each of the first branch path and the second branch path is coupled to the second accommodation space.

4. The liquid ejecting head according to claim 3 , further comprising:
a first member stacked on the head chips in a direction opposite to the ejection direction and disposed between the first accommodation space and the second accommodation space;
a first wiring substrate that couples the first relay substrate and the first head chip and that is provided with the first drive circuit; and
a second wiring substrate that couples the first relay substrate and the second head chip and that is provided with the second drive circuit, wherein
the first member includes,
a first through hole that penetrates in the ejection direction and into which the first wiring substrate is inserted, and
a second through hole that penetrates in the ejection direction and into which the second wiring substrate is inserted are formed,

the first branch path is the first through hole, and
the second branch path is the second through hole.

5. The liquid ejecting head according to claim 1 , further comprising:
a second member defining a first surface facing a direction opposite to the ejection direction of the liquid ejecting head, wherein
the one or the plurality of introduction portions are provided on the first surface of the second member.

6. The liquid ejecting head according to claim 5 , wherein
a liquid introduction portion for introducing the liquid into the inside of the liquid ejecting head is provided on the first surface of the second member.

7. The liquid ejecting head according to claim 1 , wherein
the discharge portion discharges the gas to the outside of the liquid ejecting head in a direction opposite to the ejection direction.

8. The liquid ejecting head according to claim 2 , wherein
the first branch path and the second branch path are disposed between the one or the plurality of introduction portions and the first accommodation space in the ejection direction, and
the communication portion and the second path do not directly communicate with each other.

9. The liquid ejecting head according to claim 8 , wherein
the communication portion overlaps with the second path as viewed in a direction orthogonal to the ejection direction.

10. The liquid ejecting head according to claim 3 , wherein
the one or the plurality of introduction portions overlap with the first relay substrate in a plan view as viewed in the ejection direction,
the communication portion includes a portion extending in a direction orthogonal to the ejection direction, and
in the plan view, one end of both ends of the portion, which is far from the introduction portion, does not overlap with the first relay substrate.

11. The liquid ejecting head according to claim 2 , wherein
an end portion of the communication portion coupled to the first accommodation space does not overlap with the head chips in a plan view as viewed in the ejection direction.

12. The liquid ejecting head according to claim 3 , wherein
an end portion of the communication portion coupled to the first accommodation space does not overlap with the head chips in a plan view as viewed in the ejection direction,
a wiring opening into which the first relay substrate or a second relay substrate coupled to the first relay substrate is inserted is formed on an outer wall of the liquid ejecting head, and
the discharge portion is the wiring opening coupled to only one end of the second path.

13. The liquid ejecting head according to claim 1 , wherein
the number of the one or the plurality of introduction portions is smaller than the number of the head chips.

14. The liquid ejecting head according to claim 1 , wherein
the number of the one or the plurality of introduction portions is one.

15. The liquid ejecting head according to claim 1 , wherein
the drive circuit includes a switching element configured to select whether or not to supply a drive signal for driving a drive element for ejecting the liquid.

16. The liquid ejecting head according to claim 1 , wherein
the head chips include a third head chip,
the drive circuits include a third drive circuit for driving the third head chip,
the gas path has a third branch path coupling the first path and the second path so as not to pass through the first branch path and the second branch path, and
the third drive circuit is disposed in the third branch path.

17. A liquid ejecting apparatus comprising:
the liquid ejecting head according to claim 1 ; and
the gas supply mechanism that supplies the gas to the one or the plurality of introduction portions of the liquid ejecting head.

Assignees

• Seiko Epson Corp

Inventors

• Hasegawa Yu
• Okui Hiroaki
• Watanabe Eiichiro
• Fukuzawa Yuma

Classifications

• B41J2202/08

  dealing with thermal variations, e.g. cooling · CPC title

• B41J2202/13

  Heads having an integrated circuit · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2202/20

  Modules · CPC title

• B41J2202/19

  Assembling head units · CPC title