Electronics unit

Patent metadata

Field	Value
Publication number	US-12267974-B2
Application number	US-202218286459-A
Country	US
Kind code	B2
Filing date	Apr 27, 2022
Priority date	Apr 29, 2021
Publication date	Apr 1, 2025
Grant date	Apr 1, 2025

Abstract

An electronic unit for a missile comprising a potted electronics in a housing: the unit being adapted to compensate for a difference in coefficient of thermal expansion between the potted electronics and the housing, the unit further comprising: a first ramp; and a second ramp slidably arranged against the first ramp, wherein the first and second ramps are disposed within the housing, the first or the second ramp abutting the potted electronics so as to provide an interference fit between the potted electronics and the housing; wherein the first ramp and second ramp each comprise a coefficient of thermal expansion selected to maintain the interference fit between the potted electronics and the housing throughout a temperature range.

First claim

The invention claimed is:

1. An electronics unit for a missile comprising a potted electronics in a housing, the unit being adapted to compensate for a difference in coefficient of thermal expansion between the potted electronics and the housing;
the unit comprising a ramp arrangement disposed within the housing, and the unit having an axis in the direction from the potted electronics to the ramp arrangement;
the ramp arrangement comprising a first ramp, and a second ramp slidably arranged against the first ramp at a ramp interface, which ramp interface is angled relative to the axis;
the first and second ramps being formed of different materials having different coefficients of thermal expansion;
wherein the ramp arrangement abuts the potted electronics so as to provide an interference fit between the potted electronics and the housing, and is at least partially bounded by the housing such that, when the temperature changes and the different materials expand or contract by different amounts, the first and second ramps are constrained to move axially relative to one another within the housing so as to maintain the interference fit between the potted electronics and the housing; and
wherein the materials of the first and second ramps are selected such that, when the temperature changes by an expected amount, the relative movement of the first and second ramps, is substantially equal in magnitude, and opposite in direction, to the size of a change in the axial length of the potted electronics in the housing, thereby maintaining the interference fit between the potted electronics and the housing.

2. The unit of claim 1 wherein the axis aligns with the roll axis of the missile and said ramp interface is configured to translate shocks along the roll axis of the missile through the angle into the housing thereby isolating the potted electronics.

3. The unit of claim 1 wherein the first ramp is a toroid and the second ramp is cone shaped.

4. The unit of claim 3 wherein the first and second ramp are concentrically arranged such that the toroid is slidably mounted on the cone.

5. The unit of claim 1 wherein the temperature range is in the range of from −60° C. to 100° C.

6. The unit of claim 1 wherein one of the first or second ramps is integral to the housing.

7. The unit of claim 1 wherein the potted electronics is potted in an epoxy compound.

8. The unit of claim 1 wherein the first ramp is made from a polymer.

9. The unit of claim 1 wherein the first ramp is made from polyoxymethylene.

10. The unit of claim 1 wherein the second ramp is made from aluminium.

11. The unit of claim 1 wherein the first or second ramp angle profile is tailored to ensure abutment of the first or second ramp to the potted electronics throughout the temperature range.

12. The unit of claim 1 wherein the unit further comprises a compressible membrane arranged between the first or second ramp and the potted electronics.

13. The unit of claim 1 wherein the first ramp comprises a coefficient of thermal expansion in the range of from 75 to 130×10 −6 m/mK.

14. The unit of claim 1 wherein the second ramp comprises a coefficient of thermal expansion in the range of from 10 to 30×10 −6 m/mK.

15. The unit of claim 1 wherein the unit is a safe arm unit for a missile.

16. A missile comprising the unit of claim 1 .

Assignees

• Mbda Uk Ltd

Inventors

• Evans Michael

Classifications

• H05K7/1434 Primary

  for electronics exposed to high gravitational force; Cylindrical housings · CPC title

• H05K5/069

  Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft · CPC title

• F42B15/34 Primary

  Protection against overheating or radiation, e.g. heat shields; Additional cooling arrangements {(thermal protection fitted in or to cosmonautic vehicles B64G1/58)} · CPC title

• H05K5/0073

  having specific features for mounting the housing on an external structure · CPC title

• F42C19/00

  Details of fuzes (except F42C15/00) · CPC title