Apparatus and methods for nanoplasma switches

Patent metadata

Field	Value
Publication number	US-12267940-B2
Application number	US-202318191327-A
Country	US
Kind code	B2
Filing date	Mar 28, 2023
Priority date	Mar 28, 2023
Publication date	Apr 1, 2025
Grant date	Apr 1, 2025

Abstract

Apparatus and methods for nanoplasma switches are disclosed. In certain embodiments, a nanoplasma switching system includes a nanoplasma radio frequency (RF) switch that receives an RF signal, and a nanoplasma DC switch that receives a DC bias voltage. The nanoplasma DC switch is positioned adjacent to but spaced apart from the nanoplasma RF switch. The nanoplasma DC switch induces a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level. By implementing the nanoplasma switching system in this manner, DC bias to turn on or off the nanoplasma RF switch can be realized without needing to use passive components such as DC blocking capacitors, choke inductors, or baluns for isolation.

First claim

What is claimed is:

1. A nanoplasma switching system comprising:
a nanoplasma radio frequency (RF) switch configured to receive an RF signal via an RF signal source; and
a first nanoplasma direct current (DC) switch configured to receive a DC bias voltage via a first DC bias circuit, the first nanoplasma DC switch positioned adjacent to and spaced apart from the nanoplasma RF switch, wherein the first nanoplasma DC switch is operable to induce a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level.

2. The nanoplasma switching system of claim 1 , wherein the nanoplasma RF switch comprises a first metal pad and a second metal pad separated by a first nano-gap.

3. The nanoplasma switching system of claim 2 , wherein the first nano-gap is in the range of 5 nm to 5,000 nm.

4. The nanoplasma switching system of claim 2 , wherein the first nanoplasma DC switch comprises a third metal pad and a fourth metal pad separated by a second nano-gap.

5. The nanoplasma switching system of claim 4 , wherein the RF signal source is connected to the first metal pad and the first DC bias circuit is connected to the third metal pad, the nanoplasma switching system further comprising a first load connected to the second metal pad, and a second load connected to the fourth metal pad.

6. The nanoplasma switching system of claim 1 , wherein the nanoplasma RF switch and the first nanoplasma DC switch are separated by a distance in the range of the range of 100 μm to 1,000 μm.

7. The nanoplasma switching system of claim 1 , wherein the first nanoplasma DC switch does not induce the nanoplasma when the DC bias voltage is set to a second voltage level.

8. The nanoplasma switching system of claim 7 , wherein the first DC bias circuit is configured to set the DC bias voltage to the first voltage level or the second voltage level based on a state of a switch enable signal.

9. The nanoplasma switching system of claim 8 , wherein the first nanoplasma DC switch, the nanoplasma RF switch and the second nanoplasma DC switch are formed on a common layer of a circuit board.

10. The nanoplasma switching system of claim 8 , wherein the first nanoplasma DC switch, the nanoplasma RF switch and the second nanoplasma DC switch are formed on different layers of a circuit board.

11. The nanoplasma switching system of claim 1 , further comprising a second nanoplasma DC switch configured to receive the DC bias voltage via a second DC bias circuit, the second nanoplasma DC switch positioned adjacent to and spaced apart from the nanoplasma RF switch.

12. The nanoplasma switching system of claim 1 , further comprising at least one metal oxide region interposed between the nanoplasma RF switch and the first nanoplasma DC switch.

13. A circuit board comprising:
a substrate;
a nanoplasma radio frequency (RF) switch formed over the substrate, the nanoplasma RF switch configured to receive an RF signal via an RF signal source; and
a first nanoplasma direct current (DC) switch formed over the substrate and positioned adjacent to and spaced apart from the nanoplasma RF switch, the first nanoplasma DC switch configured to receive a DC bias voltage via a first DC bias circuit, wherein the first nanoplasma DC switch is operable to induce a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level.

14. The circuit board of claim 13 , wherein the first nanoplasma DC switch and the nanoplasma RF switch are formed on a common metal layer of the circuit board.

15. The circuit board of claim 13 , wherein the first nanoplasma DC switch and the nanoplasma RF switch are formed on different metal layers of the circuit board.

16. The circuit board of claim 13 , further comprising a second nanoplasma DC switch formed over the substrate and positioned adjacent to and spaced apart from the nanoplasma RF switch, the second nanoplasma DC switch configured to receive the DC bias voltage via a second DC bias circuit.

17. The circuit board of claim 13 , wherein the nanoplasma RF switch comprises a first metal pad and a second metal pad separated by a first nano-gap, and the first nanoplasma DC switch comprises a third metal pad and a fourth metal pad separated by a second nano-gap.

18. The circuit board of claim 17 , wherein the first nano-gap and the second nano-gap are each in the range of 5 nm to 5,000 nm.

19. A method of radio frequency (RF) switching, the method comprising:
providing an RF signal via an RF signal source to a nanoplasma RF switch;
providing a direct current (DC) bias voltage via a first DC bias circuit to a first nanoplasma DC switch that is positioned adjacent to and spaced apart from the nanoplasma RF switch; and
inducing a nanoplasma through the nanoplasma RF switch using the first nanoplasma DC switch by setting the DC bias voltage to a first voltage level.

20. The method of claim 19 , further comprising setting the DC bias voltage to a second voltage level in which the nanoplasma is not induced via the first nanoplasma DC switch.

Assignees

• Analog Devices International Unlimited Co

Inventors

• Maggay Romulo

Classifications

• H05K2201/10053

  Switch · CPC title

• H05K2201/0949

  Pad close to a hole, not surrounding the hole · CPC title

• H05K2201/09409

  Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components · CPC title

• H05K2201/09381

  Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component · CPC title

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title