Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-12266476-B2
Application number	US-202117412731-A
Country	US
Kind code	B2
Filing date	Aug 26, 2021
Priority date	Dec 31, 2020
Publication date	Apr 1, 2025
Grant date	Apr 1, 2025

Abstract

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween;
a first external electrode connected to the first internal electrodes;
a second external electrode connected to the second internal electrodes; and
a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode,
wherein the protective layer includes an adhesion assisting layer and a coating layer,
an average thickness of the protective layer is 70 nm or more and less than 400 nm, and
a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and 0.75 or less.

2. The multilayer ceramic electronic component of claim 1 , wherein the coating layer has an average thickness of 25 nm or more.

3. The multilayer ceramic electronic component of claim 1 , wherein the protective layer includes a crosslink linking the adhesion assisting layer and the coating layer to each other.

4. The multilayer ceramic electronic component of claim 1 , wherein the protective layer is disposed to cover at least parts of the ceramic body, the first external electrode, and the second external electrode.

5. The multilayer ceramic electronic component of claim 1 , wherein the adhesion assisting layer includes one or more selected from a group consisting of a polystyrene-based polymer, a vinyl acetate-based polymer, a polyester-based polymer, a polyethylene-based polymer, a polypropylene-based polymer, a polyamide-based polymer, a rubber-based polymer, an acrylic polymer, a phenol-based polymer, an epoxy-based polymer, a urethane-based polymer, an siloxane-based polymer, an melamine-based polymer, and an alkyd-based polymer.

6. The multilayer ceramic electronic component of claim 5 , wherein the one or more selected polymer of the adhesion assisting layer includes a compound including two or more vinyl groups.

7. The multilayer ceramic electronic component of claim 1 , wherein the coating layer includes a hydrophobic polymer.

8. The multilayer ceramic electronic component of claim 7 , wherein the coating layer includes a compound including a vinyl group and fluorine.

9. The multilayer ceramic electronic component of claim 1 , wherein the coating layer is an inorganic thin film layer.

10. The multilayer ceramic electronic component of claim 9 , wherein the coating layer includes one or more selected from a group consisting of Al 2 O 3 , HfO 2 , ZrO 2 La 2 O 3 , SiO 2 , Ta 2 O 5 , Nb 2 O 5 , Y 2 O 3 , SrTiO 3 , BaTiO 3 , AlN, and SiNx.

11. The multilayer ceramic electronic component of claim 1 , wherein the coating layer is disposed to cover the adhesion assisting layer.

12. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween;
a first external electrode connected to the first internal electrodes;
a second external electrode connected to the second internal electrodes; and
a cover layer disposed on the ceramic body, the first external electrode, and the second external electrode,
wherein the cover layer includes a first layer and a second layer,
an average thickness of the cover layer is 70 nm or more and less than 400 nm, and
a ratio of an average thickness of the second layer to the average thickness of the cover layer is 0.25 or more and 0.75 or less.

13. The multilayer ceramic electronic component of claim 12 , wherein the second layer has an average thickness of 25 nm or more.

14. The multilayer ceramic electronic component of claim 12 , wherein the cover layer includes a crosslink linking the first layer and the second layer to each other.

15. The multilayer ceramic electronic component of claim 12 , wherein the cover layer is disposed to cover at least parts of the ceramic body, the first external electrode, and the second external electrode.

16. The multilayer ceramic electronic component of claim 12 , wherein the first layer includes one or more selected from a group consisting of a polystyrene-based polymer, a vinyl acetate-based polymer, a polyester-based polymer, a polyethylene-based polymer, a polypropylene-based polymer, a polyamide-based polymer, a rubber-based polymer, an acrylic polymer, a phenol-based polymer, an epoxy-based polymer, a urethane-based polymer, an siloxane-based polymer, an melamine-based polymer, and an alkyd-based polymer.

17. The multilayer ceramic electronic component of claim 16 , wherein the one or more selected polymer of the second layer includes a compound including two or more vinyl groups.

18. The multilayer ceramic electronic component of claim 12 , wherein the second layer includes a hydrophobic polymer.

19. The multilayer ceramic electronic component of claim 18 , wherein the second layer includes a compound including a vinyl group and fluorine.

20. The multilayer ceramic electronic component of claim 12 , wherein the second layer is an inorganic thin film layer.

21. The multilayer ceramic electronic component of claim 20 , wherein the second layer includes one or more selected from a group consisting of Al 2 O 3 , HfO 2 , ZrO 2 La 2 O 3 , SiO 2 , Ta 2 O 5 , Nb 2 O 5 , Y 2 O 3 , SrTiO 3 , BaTiO 3 , AlN, and SiNx.

22. The multilayer ceramic electronic component of claim 12 , wherein the first external electrode includes a first electrode layer connected to the first internal electrodes, a first conductive layer disposed on the first electrode layer, and a first metal layer disposed on the first conductive layer, and
the second external electrode includes a second electrode layer connected to the second internal electrodes, a second conductive layer disposed on the second electrode layer, and a second metal layer disposed on the second conductive layer.

23. The multilayer ceramic electronic component of claim 22 , wherein the first electrode layer and the second electrode layer are sintered electrodes including a conductive metal.

24. The multilayer ceramic electronic component of claim 22 , wherein the first conductive layer and the second conductive layer are plating layers.

25. The multilayer ceramic electronic component of claim 22 , wherein the first metal layer and the second metal layer are plating layers.

26. The multilayer ceramic electronic component of claim 12 , wherein the second layer is disposed to cover the first layer.

27. The multilayer ceramic electronic component of claim 12 , wherein the second layer covering the first external electrode and the second layer covering the second external electrode are connected to each other.

28. The multilayer ceramic electronic component of claim 12 , wherein the first layer covering the first external electrode and the first layer covering the second external electrode are spaced apart from each other.

Assignees

• Samsung Electro Mech

Inventors

• Lee Kyo Yeol
• Han Seung Hun
• Lee Sang Wook
• Kim Jung Min
• Kim Jeong Ryeol

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title