Chip card, and process for manufacturing a chip card

Patent metadata

Field	Value
Publication number	US-12265871-B2
Application number	US-202218552257-A
Country	US
Kind code	B2
Filing date	Mar 23, 2022
Priority date	Mar 25, 2021
Publication date	Apr 1, 2025
Grant date	Apr 1, 2025

Abstract

A chip card has a flexible inlay including chip card contacts on an upper face of the inlay and which supports an integrated circuit and an antenna, both of which are spaced apart from the contacts. The chip card further includes a top layer with a recess in which the contacts are placed, and a metal layer which is located below the inlay and includes a slit that extends from a peripheral surface of the metal layer to the area of the recess and extends through the entire thickness of the metal layer.

First claim

The invention claimed is:

1. A chip card, including:
a flexible inlay having contacts of the chip card arranged on an upper side of the inlay,
wherein the inlay carries an integrated circuit and antenna spaced apart from the contacts,
an upper layer having a recess, in which the contacts are arranged, and
a metal layer arranged below the inlay, having a slot, which extends from a circumferential surface of the metal layer into an area of the recess, and which extends through an entire thickness of the metal layer;
wherein at least one of the integrated circuit and the antenna are displaced out of the area of the recess by the inlay.

2. The chip card according to claim 1 , wherein the upper layer is a further metal layer having a slot, which extends from a circumferential surface of the further metal layer to the recess and extends through the entire thickness of the further metal layer.

3. The chip card according to claim 2 , wherein an adhesive layer having a further recess is provided between the further metal layer and the inlay, in that the further recess of the adhesive layer has smaller dimensions than the recess of the further metal layer, and in that a part of the adhesive layer is arranged between the contacts and an inner wall of the recess of the further metal layer.

4. The chip card according to claim 1 , wherein the upper layer comprises a layer having optical features and an outer overlay layer.

5. The chip card according to claim 1 , wherein the metal layer is covered using at least one outer layer.

6. The chip card according to claim 1 , wherein an insert is arranged below the contacts, which positions the contacts in the recess of the upper layer.

7. The chip card according to claim 6 , wherein a height of the insert, of the inlay, and of the contacts corresponds to a height of the recess of the upper layer.

8. The chip card according to claim 1 , wherein inner edges of the recess of the upper layer are provided with a chamfer.

9. The chip card according to claim 1 , wherein the antenna is arranged in the area of a circumferential surface of the chip card, wherein turns of the antenna are arranged to have a maximum diameter about the circumferential surface.

10. A process for manufacturing a chip card, having the following steps:
providing a flexible inlay having contacts of the chip card arranged on an upper side of the inlay,
wherein the inlay carries an integrated circuit and antenna spaced apart from the contacts,
arranging an upper layer having a recess on the upper side of the inlay in such a way that the contacts are arranged in the recess,
arranging a metal layer having a slot below the inlay, which extends from a circumferential surface of the metal layer into an area of the recess and extends through an entire thickness of the metal layer, and
laminating the layers to form the chip card;
wherein at least one of the integrated circuit and the antenna are displaced out of the area of the recess by the inlay.

11. A chip card, including:
a flexible inlay having contacts of the chip card arranged on an upper side of the inlay,
wherein the inlay carries an integrated circuit and antenna spaced apart from the contacts,
an upper layer having a recess, in which the contacts are arranged, and
a metal layer arranged below the inlay, having a slot, which extends from a circumferential surface of the metal layer into an area of the recess, and which extends through an entire thickness of the metal layer;
wherein the upper layer is a further metal layer having a slot, which extends from a circumferential surface of the further metal layer to the recess and extends through the entire thickness of the further metal layer; and
wherein an adhesive layer having a further recess is provided between the further metal layer and the inlay, in that the further recess of the adhesive layer has smaller dimensions than the recess of the further metal layer, and in that a part of the adhesive layer is arranged between the contacts and an inner wall of the recess of the further metal layer.

Assignees

• Giesecke & Devrient Epayments Gmbh

Inventors

• Minks Andreas

Classifications

• G06K19/07749

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G06K19/07747

  at least one of the integrated circuit chips being mounted as a module · CPC title

• G06K19/07722 Primary

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title