Two-phase immersion-type heat dissipation device having reinforced fins

Patent metadata

Field	Value
Publication number	US-12262511-B2
Application number	US-202318097665-A
Country	US
Kind code	B2
Filing date	Jan 17, 2023
Priority date	Jan 17, 2023
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.

First claim

What is claimed is:

1. A two-phase immersion-type heat dissipation device, comprising:
a heat dissipation substrate having a first surface and a second surface that is configured to be in contact with a heating element immersed in a two-phase coolant, wherein the first surface is opposite to the second surface and is arranged away from the heating element; and
a plurality of reinforced fins integrally formed on the first surface of the heat dissipation substrate, wherein a thickness of each of the plurality of reinforced fins is less than 1 mm;
wherein a microstructure of the plurality of reinforced fins undergoes a predeformation process so as to be different from a microstructure of the heat dissipation substrate; wherein, according to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate, so as to determine orientations of each crystal grain of the plurality of reinforced fins to ensure a structural strength to withstand a pushing force from air bubbles in the two-phase coolant.

2. The two-phase immersion-type heat dissipation device according to claim 1 , wherein the heat dissipation substrate is made of copper, copper alloy, or aluminum alloy.

3. The two-phase immersion-type heat dissipation device according to claim 1 , wherein the plurality of reinforced fins are made of copper, copper alloy, or aluminum alloy.

4. The two-phase immersion-type heat dissipation device according to claim 1 , wherein the plurality of reinforced fins are plate-fins or pin-fins.

5. The two-phase immersion-type heat dissipation device according to claim 1 , wherein the plurality of reinforced fins are made by bending, forging, or extruding.

6. The two-phase immersion-type heat dissipation device according to claim 1 , wherein, in the scanning electron microscopy image of electron backscattered diffraction, an area of calculation is a square of 3 pixels by 3 pixels, and a mean difference between an orientation angle of a core pixel and orientation angles of each of adjacent pixels is calculated, and wherein the orientation angles are less than 5 degrees.

7. The two-phase immersion-type heat dissipation device according to claim 6 , wherein the median of local misorientation distribution of the plurality of reinforced fins is between 1.5 and 3.

8. The two-phase immersion-type heat dissipation device according to claim 1 , wherein a ratio of a thickness of each of the reinforced fins to a distance between two adjacent ones of the reinforced fins is between 0.7 and 1.5.

9. The two-phase immersion-type heat dissipation device according to claim 1 , wherein a height of each of the reinforced fins is 15 times or more the thickness of each of the reinforced fins.

10. The two-phase immersion-type heat dissipation device according to claim 1 , wherein a length of each of the reinforced fins is 200 times or more the thickness of each of the reinforced fins.

11. A two-phase immersion-type heat dissipation device, comprising:
a heat dissipation substrate having a first surface and a second surface that is configured to be in contact with a heating element immersed in a two-phase coolant, wherein the first surface is opposite to the second surface and is arranged away from the heating element; and
a plurality of reinforced fins integrally formed on the first surface of the heat dissipation substrate, wherein a thickness of each of the plurality of reinforced fins is less than 1 mm;
wherein a microstructure of the plurality of reinforced fins is different from a microstructure of the heat dissipation substrate; wherein, according to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate;
wherein, in the scanning electron microscopy image of electron backscattered diffraction, an area of calculation is a square of 3 pixels by 3 pixels, and a mean difference between an orientation angle of a core pixel and orientation angles of each of adjacent pixels is calculated, and wherein the orientation angles are less than 5 degrees.

12. The two-phase immersion-type heat dissipation device according to claim 11 , wherein the heat dissipation substrate is made of copper, copper alloy, or aluminum alloy.

13. The two-phase immersion-type heat dissipation device according to claim 11 , wherein the plurality of reinforced fins are made of copper, copper alloy, or aluminum alloy.

14. The two-phase immersion-type heat dissipation device according to claim 11 , wherein the plurality of reinforced fins are plate-fins or pin-fins.

15. The two-phase immersion-type heat dissipation device according to claim 11 , wherein the plurality of reinforced fins are made by bending, forging, or extruding.

16. The two-phase immersion-type heat dissipation device according to claim 11 , wherein the median of local misorientation distribution of the plurality of reinforced fins is between 1.5 and 3.

17. The two-phase immersion-type heat dissipation device according to claim 11 , wherein a ratio of a thickness of each of the reinforced fins to a distance between two adjacent ones of the reinforced fins is between 0.7 and 1.5.

18. The two-phase immersion-type heat dissipation device according to claim 11 , wherein a height of each of the reinforced fins is 15 times or more the thickness of each of the reinforced fins.

19. The two-phase immersion-type heat dissipation device according to claim 11 , wherein a length of each of the reinforced fins is 200 times or more the thickness of each of the reinforced fins.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Wu Chun-Te
• Yang Ching-Ming
• Chiu Yu-Wei
• Yeh Tze-Yang

Classifications

• H05K7/203 Primary

  by immersion · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title