Electronic component

Patent metadata

Field	Value
Publication number	US-12261588-B2
Application number	US-202217961639-A
Country	US
Kind code	B2
Filing date	Oct 7, 2022
Priority date	Oct 12, 2021
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

An electronic component includes a first main body including a plurality of dielectric layers stacked together, and a second main body mounted to the first main body. The second main body includes a first circuit section and a second circuit section that are each constituted by using at least one acoustic wave element and are electrically separated from each other. The first main body includes first to third ground conductor lavers located between the first and second circuit sections when seen in a Z direction.

First claim

What is claimed is:

1. An electronic component comprising:
a first main body including a plurality of dielectric layers stacked together; and
a second main body mounted to the first main body, wherein:
the second main body includes a first circuit section and a second circuit section, both of the first circuit section and the second circuit section being provided inside the second main body, and the first circuit section and the second circuit section being each constituted by using at least one acoustic wave element and being electrically separated from each other;
the first main body includes at least one ground conductor layer located between the first and second circuit sections when seen in a first direction parallel to a direction in which the first and second main bodies are arranged;
the second main body is in a form of a single box; and
both of the first circuit section and the second circuit section are provided inside the single box.

2. The electronic component according to claim 1 , wherein the first direction is a direction parallel to a stacking direction of the plurality of dielectric layers.

3. The electronic component according to claim 1 , wherein:
the second main body includes a first terminal, a second terminal, a third terminal, and a fourth terminal that are disposed on an outer surface of the second main body;
the first circuit section is provided between the first and second terminals in a circuit configuration;
the second circuit section is provided between the third and fourth terminals in the circuit configuration;
the first and third terminals are disposed to sandwich the at least one ground conductor layer therebetween when seen in the first direction; and
the second and fourth terminals are disposed to sandwich the at least one ground conductor layer therebetween when seen in the first direction.

4. The electronic component according to claim 1 , wherein the at least one ground conductor layer protrudes from the second main body when seen in the first direction.

5. The electronic component according to claim 1 , wherein the at least one ground conductor layer is provided inside the first main body.

6. The electronic component according to claim 5 , wherein:
the first main body has a first surface where the second main body is mounted, and a second surface opposite thereto; and
the at least one ground conductor layer is disposed at a position closer to the first surface than to the second surface.

7. The electronic component according to claim 1 , wherein the at least one ground conductor layer includes a plurality of ground conductor layers.

8. The electronic component according to claim 7 , wherein the first main body further includes a plurality of through holes that connect the plurality of ground conductor layers to each other.

9. The electronic component according to claim 8 , wherein:
the plurality of ground conductor layers include a first ground conductor layer, a second ground conductor layer, and a third ground conductor layer that are disposed at respective different positions in the first direction;
the plurality of through holes include a plurality of first through holes that electrically connect the first and second ground conductor layers, and a plurality of second through holes that electrically connect the second and third ground conductor layers; and
the plurality of first through holes and the plurality of second through holes are disposed so as not to overlap when seen in the first direction.

10. The electronic component according to claim 1 , wherein the first main body includes a third circuit section and a fourth circuit section that are disposed to sandwich the at least one ground conductor layer therebetween when seen in the first direction.

11. The electronic component according to claim 10 , wherein:
the first circuit section is electrically connected to the third circuit section; and
the second circuit section is electrically connected to the fourth circuit section.

12. The electronic component according to claim 11 , wherein:
the first and third circuit sections constitute a first filter that selectively passes a signal of a frequency within a first passband; and
the second and fourth circuit sections constitute a second filter that selectively passes a signal of a frequency within a second passband higher than the first passband.

Assignees

• Tdk Corp

Inventors

• Tsukamoto Kazuhiro

Classifications

• H03H9/70

  Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source · CPC title

• H03H9/0538

  Constructional combinations of supports or holders with electromechanical or other electronic elements · CPC title

• H03H7/0115

  comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) · CPC title

• H03H7/1783

  Combined LC in series path · CPC title

• H03H7/1775

  Parallel LC in shunt or branch path (H03H7/1791 takes precedence) · CPC title