Device and method for mass transfer of mini light-emitting diodes (mini-LEDs) based on array water jet-based ejection

Patent metadata

Field	Value
Publication number	US-12261239-B2
Application number	US-202418769404-A
Country	US
Kind code	B2
Filing date	Jul 11, 2024
Priority date	Aug 8, 2023
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A device for mass transfer of Mini-LEDs based on array water jet-based ejection, including a planar motion platform, a vision camera, an array water jet-type ejection unit, a Z-axis motion platform, a blue membrane, an operation platform and a transfer substrate. The vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform. The array water jet-type ejection unit includes a water jet channel and a through-hole array. The Z-axis motion platform is provided at a side of the planar motion platform near the vision camera, and is configured for placement of the blue membrane. Multiple Mini-LED chips are bonded to the blue membrane. The operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform.

First claim

What is claimed is:

1. A method for mass transfer of mini light-emitting diodes (Mini-LEDs) based on array water jet-based ejection using a device for mass transfer of Mini-LEDs, comprising:
(S1) placing a blue membrane to which a plurality of Mini-LED chips are bonded horizontally on a Z-axis motion platform, and fixing a transfer substrate on a side of an operation platform near the blue membrane;
(S2) scanning, by a vision camera, the plurality of Mini-LED chips to obtain a pose information of the plurality of Mini-LED chips, and controlling a water jet channel to perform adjustment according to the pose information of the plurality of Mini-LED chips; identifying, by the vision camera, the blue membrane, an array water jet-type ejection unit, and a distance between the blue membrane and the transfer substrate to adjust a height of the Z-axis motion platform and a height of the operation platform, and to adjust a planar motion platform to complete positioning of the array water jet-type ejection unit and the plurality of Mini-LED chips in an X-axis direction and a Y-axis direction;
(S3) ejecting, by the array water jet-type ejection unit, a water jet array to drive a first group of Mini-LED chips among the plurality of Mini-LED chips and the blue membrane to be peeled off to the transfer substrate; and
(S4) transferring the array water jet-type ejection unit to a position above a second group of Mini-LED chips among the plurality of Mini-LED chips through positioning of the vision camera, and repeating step (S3) to complete ejection of the plurality of Mini-LED chips.

Assignees

• Univ Guangdong Technology

Inventors

• Chen Yun
• Chen Yanhui
• Ma Li
• Lv Pengwei
• Zhang Hao
• Hou Maoxiang
• Chen Xin

Classifications

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title