Radiator module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-12261096-B2
Application number	US-202217980890-A
Country	US
Kind code	B2
Filing date	Nov 4, 2022
Priority date	Dec 28, 2021
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A radiator module includes a heat pipe and a terminal. The heat pipe includes a first plate and a second plate between which a refrigerant channel is defined, and a support member extending from the first plate to the second plate. The terminal is joined to a connection body of the first plate and the support member from outside of the heat pipe. The support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate.

First claim

What is claimed is:

1. A radiator module comprising:
a heat pipe including a first plate, a second plate opposing the first plate through a refrigerant channel, and a support member extending from the first plate to the second plate; and
a terminal joined to a connection body of the first plate and the support member from outside of the heat pipe,
wherein
the support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate,
the support member is arranged within the refrigerant channel,
the heat pipe includes an injection passage extending from the first plate to the support member so as to open to the refrigerant channel,
the injection passage is sealed by a sealing member in the first plate, and
the terminal is arranged to cover the sealing member.

2. The radiator module according to claim 1 , wherein the support member is a side wall forming a side surface of the refrigerant channel.

3. The radiator module according to claim 1 , wherein
when viewed in the thickness direction of the first plate, an area of an overlapping portion where the joint portion and the support member overlap with each other is 20% or more of an area of the joint portion.

4. The radiator module according to claim 1 , wherein the terminal is joined to the first plate from outside of the heat pipe.

5. The radiator module according to claim 1 , wherein the support member is fixed to the first plate by caulking, press-fitting, or bonding.

6. A method of manufacturing a radiator module having a heat pipe including a first plate, a second plate opposing the first plate through a refrigerant channel, and a support member extending from the first plate to the second plate, and a terminal joined to a connection body of the first plate and the support member from outside of the heat pipe, wherein the support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate, the method comprising:
joining the terminal to the heat pipe,
arranging the support member within the refrigerant channel,
sealing an injection passage of the heat pipe with a sealing member in the first plate, and
covering the sealing member with the terminal in the joining,
wherein the joining includes
connecting the terminal to the connection body of the first plate and the support member from outside of the heat pipe, and
placing the support member within the range that overlaps the joint portion of the terminal and the connection body when viewed in the thickness direction of the first plate.

7. The method according to claim 6 , wherein the support member is a side wall forming a side surface of the refrigerant channel.

8. The method according to claim 6 , wherein
in the joining, an area of an overlapping portion where the joint portion and the support member overlap with each other is more than or equal to 20% of an area of the joint portion, when viewed in the thickness direction of the first plate.

9. The method according to claim 6 , wherein
in the joining, the terminal is joined to the first plate from the outside of the heat pipe.

10. The method according to claim 6 , wherein
in the joining, the support member is fixed to the first plate by caulking, press-fitting, or bonding.

Assignees

• Denso Corp
• Toyota Motor Co Ltd
• MIRISE Technologies Corporation

Inventors

• Ito Shinya

Classifications

• H10W70/20

  Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40) · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title