Inertial sensor module

Patent metadata

Field	Value
Publication number	US-12259403-B2
Application number	US-202217954768-A
Country	US
Kind code	B2
Filing date	Sep 28, 2022
Priority date	Sep 30, 2021
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

Provided is an inertial sensor module having excellent detection accuracy. The inertial sensor module includes: a first sensor having a first axis, a second axis, and a third axis as detection axes; and a second sensor having accuracy higher than that of the first sensor and having the third axis as a detection axis. The first sensor and the second sensor are disposed on an inner bottom surface which is one plane in a package. The first sensor and the second sensor are sealed by the package in an airtight manner.

First claim

What is claimed is:

1. An inertial sensor module comprising:
a first sensor having a first axis, a second axis, and a third axis as detection axes;
a second sensor having accuracy higher than that of the first sensor and having the third axis as a detection axis; and
a package including a base substrate and a lid body, wherein
the first sensor and the second sensor are disposed on one plane in the package,
the base substrate is formed with a recess, and the lid body is bonded to an upper surface of the base substrate to seal an airtight internal space between the base substrate and the lid body at the recess,
the first sensor and the second sensor are sealed by the package in an airtight manner, in the airtight internal space between the base substrate and the lid body,
the first sensor and the second sensor detect a same physical quantity, and wherein
the inertial sensor module further comprises an alignment structure provided on the plane on which the first sensor and the second sensor are disposed, wherein
the alignment structure is provided on an inner bottom surface of the base substrate of the package and is a plurality of recesses that are formed at the inner bottom surface having a same depth, and
the first sensor is disposed within one of the plurality of recesses and the second sensor is disposed within an other of the plurality of recesses.

Assignees

• Seiko Epson Corp

Inventors

• Watanabe Toru

Classifications

• G01P15/18

  in two or more dimensions · CPC title

• G01P1/023 Primary

  for acceleration measuring devices · CPC title

• G01P15/125

  by capacitive pick-up · CPC title

• G01P15/14 Primary

  by making use of gyroscopes (gyroscopes per se G01C19/00) · CPC title