Low profile pass-through electrical connector

Patent metadata

Field	Value
Publication number	US-12258133-B2
Application number	US-201715489654-A
Country	US
Kind code	B2
Filing date	Apr 17, 2017
Priority date	Jun 1, 2012
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A low profile pass-through electrical connector is designed for aerospace applications. The connector allows voltage and current to pass-thru a conductive wing surface, while maintaining a low profile height for aerodynamic performance considerations. Examples of applications of the electrical connector include power for thin film heaters and communication antennae applications.

First claim

What is claimed:

1. A conductive assembly, comprising:
a heating element or antenna disposed on a surface; an electrically conductive pin having a smooth surface that extends from and is electrically connected to and is integral with the heating element or antenna and is adapted to penetrate the surface to mate with a mating socket; wherein the mating socket that is adapted to mate with the smooth surface of the conductive pin without a nut; and an electrically insulating sleeve disposed around the circumference of the pin or mating socket wherein the electrically conductive pin comprises a countersunk head that is disposed in a countersunk orifice in the electrically insulating sleeve.

2. The conductive assembly of claim 1 wherein the socket is potted in place by an epoxy.

3. A conductive assembly on an airfoil, comprising: multiple thin film heaters stacked in close proximity to each other; a plurality of electrically conductive pins that are integral with and extend from and are electrically connected to each of the thin film heaters in the conductive assembly; a plurality of mating sockets in the airfoil that are adapted to mate with each of the conductive pins that are attached to and extend from and are electrically connected to each of the thin film heaters; and a plurality of electrically insulating sleeves disposed around the circumference of the pins or mating sockets wherein the electrically conductive pins comprise a countersunk head that is disposed in a countersunk orifice in the electrically insulating sleeves.

4. The conductive assembly of claim 3 wherein the multiple thin film heaters are disposed in a planar array.

5. The conductive assembly of claim 3 wherein the plurality of conductive pins have smooth surfaces that are disposed in the plurality of electrically insulating sleeves and that form interfaces with the mating sockets.

6. The conductive assembly of claim 3 wherein the multiple thin film heaters are disposed in a unitary array.

7. The conductive array of claim 3 wherein each thin film heater comprises two pins directly connected to the thin film heaters.

8. The conductive array of claim 3 wherein the conductive assembly has been formed by pressing the plurality of pins attached to the thin film heaters into the plurality of mating sockets.

9. The conductive array of claim 4 wherein the multiple thin film heaters are disposed in a single plane in a planar array on the surface of the airfoil.

Assignees

• Battelle Memorial Institute

Inventors

• Burton Brett
• Cox Andrew
• Wolfe Darren

Classifications

• H05B3/02

  Details · CPC title

• H05B2214/02

  Heaters specially designed for de-icing or protection against icing · CPC title

• H05B2203/016

  Heaters using particular connecting means · CPC title

• B64C1/36

  adapted to receive antennas or radomes · CPC title

• H01R2201/02

  for antennas · CPC title