Remote surface treatment systems and methods

US12257663B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12257663-B2
Application numberUS-201916372961-A
CountryUS
Kind codeB2
Filing dateApr 2, 2019
Priority dateApr 2, 2019
Publication dateMar 25, 2025
Grant dateMar 25, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems remotely polish and compress surfaces for working, including surfaces created through electrical discharge machining. A bridge may secure about the surface and carry a spindle that rotatably extends downward and carries a polishing assembly. The polishing assembly can push against the surface while polishing the same with larger amounts of force. The polisher can be moved about a perimeter of the surface and vertically. Systems may be remotely operated with a pneumatic slide, hydraulic motor, and/or stepper motor. Spotfaces formed from electrical discharge machining, including those in nuclear facilities and deep underwater, may have recast layers removed with such systems without manual or direct operator interface.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for polishing a remote surface, comprising: a bridge shaped to secure around the surface; a spindle coupled to the bridge and rotatable about a first axis; and a polishing assembly secured under the bridge to the spindle, wherein the polishing assembly includes a polishing surface rotatable about a second axis and the pneumatic slide configured to expand to force the polishing surface along the second axis. 2. The system of claim 1 , wherein the pneumatic slide is configured to apply about 24 pounds of force per inch of width of the polishing surface. 3. The system of claim 1 , wherein the polishing assembly further includes a hydraulic motor configured to rotate the polishing surface about the second axis. 4. The system of claim 3 , wherein the hydraulic motor is configured to rotate the polishing surface at about 2000 rotations per minute. 5. The system of claim 1 , wherein the bridge includes a stepper motor connected to the spindle and configured to rotate the spindle about the first axis relative to the bridge. 6. The system of claim 5 , wherein the spindle is positioned in a middle of the bridge and extends below the bridge, and wherein the polishing assembly extends transversely from the spindle so as to reach a surface for polishing below the bridge. 7. The system of claim 1 , wherein the polishing surface is rotatable to approximately 10 degrees from the horizontal by rotation of the polishing assembly. 8. The system of claim 1 , wherein the polishing surface is about 80 grit silicon carbide. 9. The system of claim 1 , wherein the polishing assembly is rotatable about the second axis 360 degrees below the bridge. 10. A system for polishing a remote surface, comprising: a bridge; and a polishing assembly configured to secure relative to the surface under the bridge, wherein the polishing assembly includes a first pneumatic slide, a second pneumatic slide, a motor, and a polishing surface, wherein, the second pneumatic slide is configured to move the polishing surface across the remote surface in a first plane containing the polishing surface, the polishing surface is moveable in a first direction perpendicular to the first plane by expansion of the first pneumatic slide to bias against the remote surface while moving across the remote surface in the first plane, and the motor is configured to rotate the polishing surface about an axis internal to the polishing surface and passing through the bridge and polishing assembly to move across an entire perimeter of the remote surface. 11. The system of claim 10 , wherein the first pneumatic slide is configured to apply about 24 pounds of force per inch of width of the polishing surface. 12. The system of claim 10 , wherein the motor is a hydraulic motor configured to rotate the polishing surface about the second axis. 13. The system of claim 12 , wherein the hydraulic motor is configured to rotate the polishing surface at about 2000 rotations per minute. 14. The system of claim 10 , wherein the bridge includes a stepper motor configured to rotate the polishing assembly the first axis relative to the bridge. 15. The system of claim 10 , wherein the polishing surface is rotatable to approximately 10 degrees from the horizontal by rotation of the polishing assembly. 16. The system of claim 10 , wherein the polishing surface is about 80 grit silicon carbide. 17. The system of claim 10 , wherein the polishing assembly is rotatable about the second axis 360 degrees below the bridge.

Assignees

Inventors

Classifications

  • Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation · CPC title

  • Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators · CPC title

  • for grinding cylindrical surfaces internally (B24B5/40 takes precedence) · CPC title

  • B24B29/02Primary

    designed for particular workpieces · CPC title

  • the grinding wheel support being angularly adjustable · CPC title

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Frequently asked questions

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What does patent US12257663B2 cover?
Systems remotely polish and compress surfaces for working, including surfaces created through electrical discharge machining. A bridge may secure about the surface and carry a spindle that rotatably extends downward and carries a polishing assembly. The polishing assembly can push against the surface while polishing the same with larger amounts of force. The polisher can be moved about a perime…
Who is the assignee on this patent?
Ge Hitachi Nuclear Energy Americas Llc
What technology area does this patent fall under?
Primary CPC classification B24B29/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).