Composition for metal bonding
US-2016121432-A1 · May 5, 2016 · US
Silver nanoparticles
US12257631B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12257631-B2 |
| Application number | US-201917250764-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 2, 2019 |
| Priority date | Sep 3, 2018 |
| Publication date | Mar 25, 2025 |
| Grant date | Mar 25, 2025 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exothermic peak due to binding of the silver nanoparticles in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less.
First claim
Opening claim text (preview).
The invention claimed is: 1. Silver nanoparticles having an average particle diameter of 240 nm to 500 nm, wherein a proportion of the number of particles with particle diameters of 100 to 200 nm is 10%-29%, wherein an exothermic peak due to binding of the silver nanoparticles to each other in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less. 2. The silver nanoparticles according to claim 1 , wherein an amine compound is adhered to a surface of the silver nanoparticles. 3. A conductive adhesive comprising the silver nanoparticles according to claim 1 and a solvent. 4. A sintered body of the conductive adhesive according to claim 3 . 5. A device in which components are bonded with the sintered body according to claim 4 . 6. A conductive adhesive comprising the silver nanoparticles according to claim 2 and a solvent. 7. A sintered body of the conductive adhesive according to claim 6 . 8. A device in which components are bonded with the sintered body according to claim 7 . 9. The silver nanoparticles according to claim 1 , wherein the silver nanoparticles have an average particle diameter of 250 nm to 500 nm.
Assignees
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Classifications
Composite powder [e.g., coated, etc.] · CPC title
Agglomerating · CPC title
Submicron particles having a size above 100 nm up to 300 nm · CPC title
Metallic powder characterised by the size or surface area of the particles · CPC title
Dispersions or suspensions of nanosized particles · CPC title
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- What does patent US12257631B2 cover?
- The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exotherm…
- Who is the assignee on this patent?
- Osaka Soda Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B22F1/07. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).