Adhesive structure
US-2019218426-A1 · Jul 18, 2019 · US
US12257557B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12257557-B2 |
| Application number | US-202117165025-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2021 |
| Priority date | Aug 2, 2018 |
| Publication date | Mar 25, 2025 |
| Grant date | Mar 25, 2025 |
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The present invention addresses the problem of providing a bonded body which has a high airtightness and exhibits excellent durability under high-temperature and high-pressure conditions. This problem is solved by a bonded body in which a complex of a zeolite and an inorganic porous support, and a dense member are bonded together by an inorganic glass or an inorganic adhesive. The inorganic glass or the inorganic adhesive has a thermal expansion coefficient of 30×10 −7 /K to 90×10 −7 /K, and the inorganic glass has a softening point of 550° C. or lower. The present invention also addresses the problem of providing a method of efficiently producing an alcohol by installing a separation membrane in an alcohol synthesis reactor based on a bonding method that gives good sealing performance and durability under high-temperature and high-pressure conditions and in the presence of methanol vapor. This problem can be solved by an alcohol production method of obtaining an alcohol by allowing a raw material gas, which contains at least hydrogen and carbon monoxide and/or carbon dioxide, to react in the presence of a catalyst in a reactor. In the reactor for carrying out the reaction, an alcohol-selective permeable membrane bonded with a dense member is installed, and an alcohol generated by the reaction permeates and is recovered through the selective permeable membrane.
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The invention claimed is: 1. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and a lead-free inorganic glass bonding the dense member and the complex, wherein the lead-free inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 2. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic glass bonding the dense member and the complex, wherein the dense member is a metal member, and the inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 3. The bonded body according to claim 1 , wherein the inorganic glass comprises SnO and/or B 2 O 3 . 4. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic adhesive bonding the dense member and the complex and having a post-curing thermal expansion coefficient of 30×10 −7 /K to 90×10 −7 /K, wherein the post-curing thermal expansion coefficient is an average value at 30 to 300° C. and the inorganic adhesive is solidified by a chemical reaction and adheres to the zeolite, inorganic porous support and dense member and is non-invertible to an original state when heated. 5. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic adhesive bonding the dense member and the complex, wherein a difference in thermal expansion coefficient between the dense member and the inorganic adhesive after cured is 50×10 −7 /K or less, the after cured thermal expansion coefficient is an average value at 30 to 300° C., and the inorganic adhesive is solidified by a chemical reaction and adheres to the zeolite, inorganic porous support and dense member and is non-invertible to an original state when heated. 6. The bonded body according to claim 4 , wherein the inorganic adhesive comprises a metal alkoxide. 7. The bonded body according to claim 1 , wherein a bonded part between the complex and the dense member is covered with a sealing film. 8. The bonded body according to claim 7 , wherein the sealing film is a silica film. 9. The bonded body according to claim 1 , wherein the dense member has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 200×10 −7 /K or less. 10. A method of using a bonded body, in which the bonded body according to claim 1 is used under a high-temperature condition of 100° C. to 500° C. and/or a high-pressure condition of 0.5 to 10 MPa. 11. A separation membrane module, comprising the bonded body according to claim 1 . 12. A reactor, comprising the separation membrane module according to claim 11 . 13. A bonding method for bonding a complex of a zeolite and an inorganic porous support to a dense member, comprising: bonding a complex of a zeolite and an inorganic porous support to a dense member with a lead-free inorganic glass, wherein the lead-free inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 14. A bonding method for bonding a complex of a zeolite and an inorganic porous support to a dense member, comprising: bonding a complex of a zeolite and an inorganic porous support to a dense member with an inorganic glass, wherein the dense member is a metal member, and the inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 15. The bonded body according to claim 1 , wherein the lead-free inorganic glass has a softening point of 357° C. or lower.
Zeolites · CPC title
Methanol · CPC title
characterised by the reactor used · CPC title
Details of supporting structures · CPC title
Oxides · CPC title
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