Bonded body, separation membrane module equipped with same, and method for producing alcohol

US12257557B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12257557-B2
Application numberUS-202117165025-A
CountryUS
Kind codeB2
Filing dateFeb 2, 2021
Priority dateAug 2, 2018
Publication dateMar 25, 2025
Grant dateMar 25, 2025

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  1. Title

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  5. First independent claim

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Abstract

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The present invention addresses the problem of providing a bonded body which has a high airtightness and exhibits excellent durability under high-temperature and high-pressure conditions. This problem is solved by a bonded body in which a complex of a zeolite and an inorganic porous support, and a dense member are bonded together by an inorganic glass or an inorganic adhesive. The inorganic glass or the inorganic adhesive has a thermal expansion coefficient of 30×10 −7 /K to 90×10 −7 /K, and the inorganic glass has a softening point of 550° C. or lower. The present invention also addresses the problem of providing a method of efficiently producing an alcohol by installing a separation membrane in an alcohol synthesis reactor based on a bonding method that gives good sealing performance and durability under high-temperature and high-pressure conditions and in the presence of methanol vapor. This problem can be solved by an alcohol production method of obtaining an alcohol by allowing a raw material gas, which contains at least hydrogen and carbon monoxide and/or carbon dioxide, to react in the presence of a catalyst in a reactor. In the reactor for carrying out the reaction, an alcohol-selective permeable membrane bonded with a dense member is installed, and an alcohol generated by the reaction permeates and is recovered through the selective permeable membrane.

First claim

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The invention claimed is: 1. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and a lead-free inorganic glass bonding the dense member and the complex, wherein the lead-free inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 2. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic glass bonding the dense member and the complex, wherein the dense member is a metal member, and the inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 3. The bonded body according to claim 1 , wherein the inorganic glass comprises SnO and/or B 2 O 3 . 4. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic adhesive bonding the dense member and the complex and having a post-curing thermal expansion coefficient of 30×10 −7 /K to 90×10 −7 /K, wherein the post-curing thermal expansion coefficient is an average value at 30 to 300° C. and the inorganic adhesive is solidified by a chemical reaction and adheres to the zeolite, inorganic porous support and dense member and is non-invertible to an original state when heated. 5. A bonded body, comprising: a dense member; a complex of a zeolite and an inorganic porous support; and an inorganic adhesive bonding the dense member and the complex, wherein a difference in thermal expansion coefficient between the dense member and the inorganic adhesive after cured is 50×10 −7 /K or less, the after cured thermal expansion coefficient is an average value at 30 to 300° C., and the inorganic adhesive is solidified by a chemical reaction and adheres to the zeolite, inorganic porous support and dense member and is non-invertible to an original state when heated. 6. The bonded body according to claim 4 , wherein the inorganic adhesive comprises a metal alkoxide. 7. The bonded body according to claim 1 , wherein a bonded part between the complex and the dense member is covered with a sealing film. 8. The bonded body according to claim 7 , wherein the sealing film is a silica film. 9. The bonded body according to claim 1 , wherein the dense member has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 200×10 −7 /K or less. 10. A method of using a bonded body, in which the bonded body according to claim 1 is used under a high-temperature condition of 100° C. to 500° C. and/or a high-pressure condition of 0.5 to 10 MPa. 11. A separation membrane module, comprising the bonded body according to claim 1 . 12. A reactor, comprising the separation membrane module according to claim 11 . 13. A bonding method for bonding a complex of a zeolite and an inorganic porous support to a dense member, comprising: bonding a complex of a zeolite and an inorganic porous support to a dense member with a lead-free inorganic glass, wherein the lead-free inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 14. A bonding method for bonding a complex of a zeolite and an inorganic porous support to a dense member, comprising: bonding a complex of a zeolite and an inorganic porous support to a dense member with an inorganic glass, wherein the dense member is a metal member, and the inorganic glass has a thermal expansion coefficient measured at 30 to 250° C. of 30×10 −7 /K or more and 90×10 −7 /K or less, and a softening point of 397° C. or lower. 15. The bonded body according to claim 1 , wherein the lead-free inorganic glass has a softening point of 357° C. or lower.

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What does patent US12257557B2 cover?
The present invention addresses the problem of providing a bonded body which has a high airtightness and exhibits excellent durability under high-temperature and high-pressure conditions. This problem is solved by a bonded body in which a complex of a zeolite and an inorganic porous support, and a dense member are bonded together by an inorganic glass or an inorganic adhesive. The inorganic gla…
Who is the assignee on this patent?
Mitsubishi Chem Corp, Japan Tech Research Association Of Artificial Photosynthetic Chemical Process
What technology area does this patent fall under?
Primary CPC classification B01D69/108. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).