Conductor forming apparatus and conductor forming method

US12255506B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12255506-B2
Application numberUS-202318459431-A
CountryUS
Kind codeB2
Filing dateSep 1, 2023
Priority dateSep 16, 2022
Publication dateMar 18, 2025
Grant dateMar 18, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A conductor forming apparatus that forms a wave winding coil group by folding a conductor, in which the conductor forming apparatus includes: a folding jig that is arranged on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the tip of the support plate so as to hold the conductor before folding from both sides in a width direction, the plurality of guide protrusions each including a guide surface that can guide a folding operation of the conductor from the start of folding.

First claim

Opening claim text (preview).

What is claimed is: 1. A conductor former that forms a wave winding coil group by folding a conductor, the conductor former comprising: a folding jig that is arranged on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the tip of the support plate so as to hold the conductor before folding from both sides in a width direction, the plurality of guide protrusions each including a guide surface that can guide a folding operation of the conductor from the start of folding. 2. The conductor former according to claim 1 , wherein the guide surface of the guide protrusion is substantially circular. 3. The conductor former according to claim 2 , wherein an outer peripheral edge of the guide surface of the guide protrusion is chamfered or rounded. 4. The conductor former according to claim 1 , wherein the tip of the support plate is chamfered or rounded. 5. A conductor forming method of forming a wave winding coil group by folding a conductor, the method comprising: arranging a folding jig on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the tip of the support plate so as to hold the conductor before folding from both sides in a width direction, the plurality of guide protrusions each including a guide surface that can guide a folding operation of the conductor from the start of folding; and folding the conductor with the tip of the support plate as a starting point, and guiding the folding operation of the conductor from the start of folding by the guide surface of the guide protrusion. 6. The conductor forming method according to claim 5 , wherein the guide surface of the guide protrusion is substantially circular. 7. The conductor forming method according to claim 6 , wherein an outer peripheral edge of the guide surface of the guide protrusion is chamfered or rounded. 8. The conductor forming method according to claim 5 , wherein the tip of the support plate is chamfered or rounded.

Assignees

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Classifications

  • of the wave winding type · CPC title

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Frequently asked questions

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What does patent US12255506B2 cover?
A conductor forming apparatus that forms a wave winding coil group by folding a conductor, in which the conductor forming apparatus includes: a folding jig that is arranged on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the…
Who is the assignee on this patent?
Honda Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification H02K15/0433. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).