Curable resin composition, thin film, and color conversion panel and display device including thin film

Patent metadata

Field	Value
Publication number	US-12252587-B2
Application number	US-202217654720-A
Country	US
Kind code	B2
Filing date	Mar 14, 2022
Priority date	Mar 23, 2021
Publication date	Mar 18, 2025
Grant date	Mar 18, 2025

Abstract

A curable resin composition includes a silicon-containing polymer, hollow silica particles having greater than or equal to two times higher a maximum peak value in a Q4 region than that in a Q3 region, as measured by silicon nuclear magnetic resonance spectroscopy (Si-NMR) analysis. A solvent, a thin film prepared from the composition, and a color conversion panel including the thin film, and a display device including the color conversion panel are also provided.

First claim

What is claimed is:

1. A curable resin composition comprising:
a silicon-containing polymer;
aluminosilicate hollow silica particles having greater than or equal to two times higher a maximum peak value in a Q4 region than that in a Q3 region, as measured by silicon nuclear magnetic resonance spectroscopy (Si-NMR) analysis; and
a solvent.

2. The curable resin composition according to claim 1 , wherein the silicon-containing polymer comprises a carbosilane-siloxane copolymer represented by Chemical Formula 1:
(R 4 R 5 R 6 SiO 1/2 ) M (R 7 R 8 SiO 2/2 ) D (R 9 SiO 3/2 ) T1 (SiO 3/2 —Y—SiO 3/2 ) T2 (SiO 4/2 ) Q   Chemical Formula 1

wherein, in Chemical Formula 1,
R 4 to R 9 are independently hydrogen, a substituted or unsubstituted C 1 to C 30 alkyl group, a substituted or unsubstituted C 2 to C 30 alkenyl group, a substituted or unsubstituted C 2 to C 30 alkynyl group, a substituted or unsubstituted C 1 to C 30 heteroalkyl group, a substituted or unsubstituted C 6 to C 30 aryl group, a substituted or unsubstituted C 3 to C 30 cycloalkyl group, a substituted or unsubstituted C 2 to C 30 heterocycloalkyl group, a substituted or unsubstituted C 1 to C 30 alkoxyl group, carboxyl group, R(C═O), R(═O)O-(wherein, R is hydrogen, a C 1 to C 30 alkyl group, a C 3 to C 30 cycloalkyl group, a C 6 to C 30 aryl group, or a combination thereof), an epoxy-containing monovalent organic group, a (meth)acrylic group, a (meth)acrylate group, or a combination thereof,
Y is a substituted or unsubstituted C 1 to C 30 alkylene group, a substituted or unsubstituted C 2 to C 30 alkenylene group, a substituted or unsubstituted C 3 to C 30 cycloalkylene group, a substituted or unsubstituted C 6 to C 30 arylene group, or a combination thereof, and
0≤M≤0.5, 0≤D≤0.5, 0<T1≤0.95, 0<T2≤0.2, 0<Q≤0.95, provided that M+D+T1+T2+Q=1.

3. The curable resin composition according to claim 2 , wherein in Chemical Formula 1, M=0, 0≤D≤0.2, 0<T1<0.5, 0<T2<0.2, 0.5≤Q≤0.95, and D+T1+T2+Q=1.

4. The curable resin composition according to claim 2 , wherein in Chemical Formula 1, M=0, D=0, 0<T1<0.4, 0<T2<0.2, 0.6≤Q≤0.9, and T1+T2+Q=1.

5. The curable resin composition according to claim 1 , wherein a weight average molecular weight (Mw) of the silicon-containing polymer is 1,000 to 100,000 g/mol in terms of a polystyrene standard sample.

6. The curable resin composition according to claim 1 , wherein an amount of the silicon-containing polymer is 1 weight % to 30 weight % based on a total weight of the curable resin composition.

7. The curable resin composition according to claim 1 , wherein the curable resin composition further comprises an organic polymer having a boiling point of from 100° C. to 250° C.

8. The curable resin composition according to claim 7 , wherein the organic polymer comprises a polyalkylene oxide copolymer, a polyarylene oxide copolymer, a glycol copolymer, or a combination thereof.

9. The curable resin composition according to claim 7 , wherein the organic polymer has a number average molecular weight (Mn) of 100 g/mol to 10,000 g/mol.

10. The curable resin composition according to claim 7 , wherein an amount of the organic polymer is 0.1 weight % to 10 weight % based on a total weight of the curable resin composition.

11. The curable resin composition according to claim 1 , wherein an average diameter (D 50 ) of the hollow silica particles is 10 nanometers (nm) to 300 nm.

12. The curable resin composition according to claim 1 , wherein an average porosity of the hollow silica particles is 40% to 90%.

13. The curable resin composition according to claim 1 , wherein an amount of the hollow silica particles is 0.1 weight % to 15 weight % based on a total weight of the curable resin composition.

14. The curable resin composition according to claim 1 , wherein the curable resin composition further comprises a surface modifying additive comprising a fluorine-based surfactant.

15. A thin film prepared by curing the curable resin composition according to claim 1 .

16. The thin film according to claim 15 , wherein the film has a refractive index of less than or equal to 1.35 with respect to light having a wavelength of 500 nm to 550 nm, and a water contact angle of greater than or equal to 105°.

17. A color conversion panel comprising the thin film according to claim 15 .

18. A display device comprising the color conversion panel according to claim 17 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Lee Seungeun
• Seo Hyun-Joo
• Ryu Jeehyun
• Seo Donggyoon
• So Minji
• Shin Dongju
• Lee Sungkeun

Classifications

• C08K3/36

  Silica · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08G77/70

  Siloxanes defined by use of the MDTQ nomenclature · CPC title

• C08K7/26 Primary

  Silicon- containing compounds · CPC title

• C08K2201/011

  Nanostructured additives · CPC title