Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission

US12251862B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12251862-B2
Application numberUS-202418632326-A
CountryUS
Kind codeB2
Filing dateApr 11, 2024
Priority dateApr 12, 2023
Publication dateMar 18, 2025
Grant dateMar 18, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.

First claim

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What is claimed is: 1. A surface-treated metal for metal-resin bonding, wherein a nano-scale pore array for filling of a resin is provided to extend from a surface to an interior of a metal, and nano-scale pillars are provided to extend from bottoms to openings of some or all of nano-scale pores of the nano-scale pore array; the nano-scale pores each have a depth of 20 nm to 10 μm and a pore size of 20 nm to 1 μm; the nano-scale pillars each have a length of 10 nm to 9.9 μm and a diameter of 20 nm to 950 nm; the surface of the metal has a porosity of 0.1 to 0.9; the nano-scale pillars have a same chemical composition as walls of the nano-scale pores; a material for the walls of the nano-scale pores is a metal oxide; an included angle between a central axis of each of the nano-scale pores and the surface of the metal is 60° to 90°; an included angle between each of the nano-scale pillars and a central axis of a corresponding nano-scale pore is 0° to 30°; the nano-scale pores provided with the nano-scale pillars account for 10% to 100% of all the nano-scale pores on the surface of the metal; and the metal is selected from a group consisting of aluminum, magnesium, copper, titanium, iron, zinc, and an alloy thereof; and the resin is selected from a group consisting of a thermoplastic resin and a thermosetting resin. 2. The surface-treated metal for metal-resin bonding according to claim 1 , wherein a diameter ratio of the nano-scale pillars to the nano-scale pores is 0. 1 to 0.9, and a ratio of the length of the nano-scale pillars to the depth of the nano-scale pores is 0.15 to 0.95. 3. A metal-resin composite, comprising the surface-treated metal for metal-resin bonding according to claim 1 and a resin located on the surface and filled in the nano-scale pores in the nano-scale pore array of the metal, wherein the resin is a single resin or a resin composition; and the resin comprises a host resin, and comprises or does not comprise a reinforcing material. 4. A substrate of a printed circuit board for high-frequency and high-speed signal transmission, comprising the metal-resin composite according to claim 3 . 5. A manufacturing method of a surface-treated metal for metal-resin bonding, wherein the metal is aluminum or an aluminum alloy, wherein a nano-scale pore array for filling of a resin is provided to extend from a surface to an interior of a metal, and nano-scale pillars are provided to extend from bottoms to openings of at least one of nano-scale pores of the nano-scale pore array; the nano-scale pores each have a depth of 20 nm to 10 μm and a pore size of 20 nm to 1 μm; the nano-scale pillars each have a length of 10 nm to 9.9 um and a diameter of 20 nm to 950nm; the surface of the metal has a porosity of 0.1 to 0.9; the nano-scale pillars have a same chemical composition as walls of the nano-scale pores; a material for the walls of the nano-scale pores is a metal oxide; an included angle between a central axis of each of the nano-scale pores and the surface of the metal is 60° to 90°; an included angle between each of the nano-scale pillars and a central axis of a corresponding nano-scale pore is 0° to 30°; the nano-scale pores provided with the nano-scale pillars account for 10% to 100% of all the nano-scale pores on the surface of the metal; and the metal is selected from a group consisting of aluminum, magnesium, copper, titanium, iron, zinc, and an alloy thereof; and the resin is selected from a group consisting of a thermoplastic resin and a thermosetting resin, wherein the manufacturing method comprises the following steps: S1: cleaning a surface of an original metal to obtain a first metal intermediate, and placing the first metal intermediate as a first anode in an electrolytic cell for polishing to obtain a second metal intermediate; S2: placing the second metal intermediate as a second anode in a first acidic solution, and conducting anodic oxidation at a voltage of 10 V to 100 V and a temperature of −10° C. to 30° C. for 3 min to 300 min to obtain a third metal intermediate, wherein the first acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from a group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and a solvent of the first acidic solution is pure water or a water-ethylene glycol mixed solvent comprising 0.1 wt % to 80 wt % of ethylene glycol; and a current density for the anodic oxidation is less than 1.5 mA/cm2; S3: soaking the third metal intermediate in a second acidic solution I time to 20 times for 1 min to 90 min each time to allow pore expansion to obtain a fourth metal intermediate, wherein the second acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from the group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and has a strong acidity, but exhibits a weak dissolution-oxidation ability for a metal oxide; a temperature of the second acidic solution is maintained at 0° C. to 100° C.; and a metal product obtained after the soaking each time is washed with water and then blow-dried with cold air; and S4: rinsing and oven-drying the fourth metal intermediate. 6. A metal-resin composite, comprising the surface-treated metal for metal-resin bonding according to claim 2 and a resin located on the surface and filled in the nano-scale pores in the nano-scale pore array of the metal, wherein the resin is a single resin or a resin composition; and the resin comprises a host resin, and comprises or does not comprise a reinforcing material. 7. The manufacturing method of the surface-treated metal for metal-resin bonding according to claim 5 , wherein after the S1 and before the S2, the manufacturing method further comprises the following steps sequentially: S2-0: placing the second metal intermediate as a third anode in a third acidic solution, and conducting anodic pre-oxidation at a voltage of 30 V to 80 V and a temperature of 0° C. to 50° C. for 10 min to 60 min to obtain a fifth metal intermediate, wherein the third acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from the group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and a solvent of the third acidic solution is pure water or a water-ethylene glycol mixed solvent comprising 0.1 wt % to 80 wt % of ethylene glycol; and S2-1: soaking the fifth metal intermediate in a mixed acid solution 1 to 20 times for 1 min to 3 min each time to partially or completely remove a porous alumina layer formed after the anodic pre-oxidation, wherein the mixed acid solution comprises I wt % to 10 wt % of chromic acid and 5 wt % to 60 wt % of phosphoric acid; a temperature of the mixed acid solution is maintained at 10° C. to 100° C.; and a metal product obtained after the soaking each time is washed with water and then blow-dried with cold air. 8. A manufacturing method of the metal-resin composite according to claim 3 , comprising the following steps: S1: pretreating a surface of a metal to form a nano-scale pore structure for injection molding on the surface of the metal to obtain the surface-treated metal; S2: placing the surface-treated metal in a mold, setting a temperature of the mold to be higher than a glass transition temperature of the resin and lower than a melting temperature of the resin, and injecting the resin into the mold such that the resin is bonded with the surface-treated metal to produce an initial metal-resin composite, wherein a pressure-holding time is 5 s to 20 s; and S3: allowing the initial metal-resin composite in the mold to

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Inventors

Classifications

  • consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

  • High frequency adaptations (H05K1/0216 takes precedence) · CPC title

  • C25D11/02Primary

    Anodisation · CPC title

  • Printed circuits · CPC title

  • Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof · CPC title

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What does patent US12251862B2 cover?
A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to ex…
Who is the assignee on this patent?
Nanjing University, Jiangsu Hhck Advanced Mat Co Ltd
What technology area does this patent fall under?
Primary CPC classification C25D11/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).