Board edge electrical contact structures

Patent metadata

Field	Value
Publication number	US-12250770-B2
Application number	US-202117995961-A
Country	US
Kind code	B2
Filing date	Apr 13, 2021
Priority date	Apr 15, 2020
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

A printed circuit board for mounting electrical components thereupon include: a first side; a second side opposite the first side; electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and wherein the exterior edge of the printed circuit board is between the first side and the second side. Further a method of manufacturing a printed circuit board for mounting electrical components thereupon includes the steps of disposing interconnect structures within the printed circuit board adjacent to at least one edge of the printed circuit board; and removing material from the printed circuit board edge to expose the interconnect structures such that the exposed interconnect structures correspond to a component connection footprint.

First claim

What is claimed is:

1. A printed circuit board for mounting electrical components thereupon comprising:
a first side;
a second side opposite the first side;
electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and
one or more clips, each clip having a first end attached to the first side, and a second end extending outwardly beyond the exterior edge, wherein the second end is configured to engage an interposer board,
wherein the exterior edge of the printed circuit board is between the first side and the second side.

2. The printed circuit board of claim 1 , wherein
the exterior edge has a plurality of cavities therein, and
the electrical connection points are disposed in at least one of the cavities.

3. The printed circuit board of claim 2 , wherein the electrical connection points include printed circuit board component pads.

4. The printed circuit board of claim 2 , wherein a portion of the printed circuit board layer covering the electrical connection points covers a portion of the electrical connection points in the plurality of cavities.

5. The printed circuit board of claim 1 , wherein the electrical connection points comprise exposed vertical interconnect structures.

6. The printed circuit board of claim 5 , wherein the vertical interconnect structures had been exposed by at least one of edge milling and laser ablation operations.

7. The printed circuit board of claim 5 , wherein the vertical interconnect structures comprise plated through hole vias.

8. The printed circuit board of claim 5 , further comprising:
an interposer board with electronic components mounted on a first side, and a second side with lands connected to the electronic components.

9. The printed circuit board of claim 8 , wherein the lands of the interposer board are soldered to the vertical interconnect structures of the printed circuit board.

10. The printed circuit board of claim 8 , further comprising:
electrical interconnects attached to the lands of the interposer board, wherein the electrical interconnects include connection pins configured to engage the vertical interconnect structures;
wherein the one or more clips are configured to engage the interposer board and to secure the interposer board to the printed circuit board.

11. The printed circuit board of claim 8 , further comprising:
one or more connectors that are connected to the interposer board.

12. The printed circuit board of claim 11 , wherein at least one connector of the one or more connectors includes at least one spring-loaded pin.

13. The printed circuit board of claim 1 , wherein
the exterior edge has a ledge formed thereon, and
the electrical connection points are disposed on the ledge.

14. A printed circuit board for mounting electrical components thereupon comprising:
a first side;
a second side opposite the first side;
electrical connection points disposed on the surface of an exterior edge of the printed circuit board; and
wherein the exterior edge of the printed circuit board is between the first side and the second side,
wherein the electrical connection points comprise exposed vertical interconnect structures, and further comprising:
an interposer board with electronic components mounted on a first side thereof, and a second side thereof with lands connected to the electronic components, wherein the lands are connected to the vertical interconnect structures.

15. The printed circuit board of claim 14 , wherein the lands of the interposer board are soldered to the vertical interconnect structures of the printed circuit board.

16. The printed circuit board of claim 14 , further comprising:
electrical interconnects attached to the lands of the interposer board, wherein the electrical interconnects include connection pins configured to engage the vertical interconnect structures; and
a plurality of clips attached to the printed circuit board configured to engage the interposer board and to secure the interposer board to the printed circuit board.

17. The printed circuit board of claim 14 , further comprising:
one or more connectors that are connected to the second side of the interposer board.

18. The printed circuit board of claim 17 , wherein at least one connector of the one or more connectors includes at least one spring-loaded pin.

Assignees

• Nokia Solutions & Networks Oy

Inventors

• North David
• Anav Daniel
• Harvey David
• Dsouza Scott David
• Chan Alex
• Brown Paul James

Classifications

• H05K2203/0228

  Cutting, sawing, milling or shearing · CPC title

• H05K2201/10446

  Mounted on an edge · CPC title

• H05K3/3405

  Edge mounted components, e.g. terminals · CPC title

• H05K3/0044

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title

• H05K3/0026

  by laser ablation · CPC title