Antenna package and image display device including the same

US12249767B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12249767-B2
Application numberUS-202318096649-A
CountryUS
Kind codeB2
Filing dateJan 13, 2023
Priority dateJul 17, 2020
Publication dateMar 11, 2025
Grant dateMar 11, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna package according to an embodiment includes an antenna device and a flexible circuit board. The antenna device includes a dielectric layer, a first antenna unit arranged on the dielectric layer and a second antenna unit arranged on the dielectric layer to be physically and electrically separated from the first antenna unit. The printed circuit board is coupled to the antenna device to be electrically connected to the first antenna unit, and electrically separated from the second antenna unit.

First claim

Opening claim text (preview).

What is claimed is: 1. An antenna package, comprising: an antenna device comprising: a dielectric layer; a first antenna unit arranged on the dielectric layer; a second antenna unit arranged on the dielectric layer to be physically and electrically separated from the first antenna unit; and an antenna ground layer disposed on a bottom surface of the dielectric layer; and a printed circuit board coupled to the antenna device to be electrically connected to the first antenna unit, and electrically separated from the second antenna unit, wherein the first antenna unit comprises a first radiator, a first transmission line extending from the first radiator and a first signal pad connected to one end portion of the first transmission line, the first radiator, the first transmission line and the first signal pad are disposed at the same layer, the second antenna unit comprises a second radiator, a second transmission line extending from the second radiator and a second signal pad connected to one end portion of the second transmission line, the second radiator, the second transmission line and the second signal pad are disposed at the same layer, and the antenna ground layer overlaps the first radiator and the second radiator in a planar view, and does not overlap the first signal pad and the second signal pad in the planar view. 2. The antenna package of claim 1 , wherein the printed circuit board comprises a core layer and a feeding line formed on one surface of the core layer and electrically connected to the first antenna unit. 3. The antenna package of claim 2 , wherein the first signal pad of the first antenna unit is electrically connected to the feeding line. 4. The antenna package of claim 3 , wherein the core layer covers the first signal pad of the first antenna unit in a planar view and does not cover the second antenna unit. 5. The antenna package of claim 3 , wherein the core layer entirely covers the first signal pad and at least partially covers the second signal pad in a planar view. 6. The antenna package of claim 3 , wherein the first antenna unit further comprises a first ground pad disposed around the first signal pad to be separated from the first transmission line and the first signal pad, and the second antenna unit further comprises a second ground pad disposed around the second signal pad to be separated from the second transmission line and the second signal pad. 7. The antenna package of claim 6 , wherein the core layer covers the first signal pad and the first ground pad of the first antenna unit, and the second ground pad of the second antenna unit in a planar view. 8. The antenna package of claim 7 , wherein the core layer does not cover the second signal pad of the second antenna unit in the planar view. 9. The antenna package of claim 6 , wherein the printed circuit board further comprises a first bonding pad formed on the one surface of the core layer and bonded to the first ground pad. 10. The antenna package of claim 1 , wherein the printed circuit board further comprises a second bonding pad formed on the one surface of the core layer and bonded to the second ground pad. 11. The antenna package of claim 1 , wherein the first antenna unit comprises a plurality of first antenna units forming a first antenna unit row. 12. The antenna package of claim 11 , wherein the second antenna unit is disposed to be adjacent to one end or both ends of the first antenna unit row. 13. The antenna package of claim 11 , further comprising a dummy pattern disposed between neighboring first antenna units of the plurality of first antenna units. 14. The antenna package of claim 13 , wherein the dummy pattern comprises a plurality of floating dummy patterns independently arranged in spaces between the first antenna units and a space between the first antenna unit and the second antenna unit. 15. The antenna package according to claim 1 , wherein the first antenna unit and the second antenna unit have the same shape and structure. 16. An image display device comprising: a display panel; and the antenna package of claim 1 disposed on the display panel.

Assignees

Inventors

Classifications

  • Particular feeding systems · CPC title

  • with built-in antennas · CPC title

  • with core of ferromagnetic material (H01Q7/02 takes precedence) · CPC title

  • Electric supply lines or communication lines · CPC title

  • Earthing means; Earth screens; Counterpoises · CPC title

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Frequently asked questions

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What does patent US12249767B2 cover?
An antenna package according to an embodiment includes an antenna device and a flexible circuit board. The antenna device includes a dielectric layer, a first antenna unit arranged on the dielectric layer and a second antenna unit arranged on the dielectric layer to be physically and electrically separated from the first antenna unit. The printed circuit board is coupled to the antenna device t…
Who is the assignee on this patent?
Dongwoo Fine Chem Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01Q21/061. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).