Light-emitting diode substrate and manufacturing method thereof, display device

Patent metadata

Field	Value
Publication number	US-12249529-B2
Application number	US-202017427628-A
Country	US
Kind code	B2
Filing date	Oct 30, 2020
Priority date	Oct 30, 2020
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

First claim

The invention claimed is:

1. A manufacturing method of a light-emitting diode substrate, comprising:
growing an epitaxial layer group of M light-emitting diode chips on a substrate;
transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and
transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate,
wherein an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2,
growing the epitaxial layer group of M light-emitting diode chips on the substrate comprises:
forming a first conductivity type semiconductor layer on the substrate; forming a light-emitting layer on a side of the first conductivity type semiconductor layer away from the substrate; and forming a second conductivity type semiconductor layer on a side of the light-emitting layer away from the first conductivity type semiconductor layer,
the light-emitting diode chips corresponding to the N epitaxial layer groups on the N substrates are configured to emit light of a same color.

2. The manufacturing method of the light-emitting diode substrate according to claim 1 , wherein, on the transition carrier substrate, a distance between two adjacent epitaxial layer groups is approximately equal to a distance between two adjacent light-emitting diode chips.

3. The manufacturing method of the light-emitting diode substrate according to claim 1 , wherein the driving substrate comprises a base substrate and a plurality of driving circuits on the base substrate, each of the plurality of driving circuits comprises a pad and is configured to drive a light-emitting diode chip electrically connected with the pad to emit light, and the manufacturing method further comprises:
bonding the light-emitting diode chip transferred on the driving substrate with the pad of a corresponding one of the plurality of driving circuits by adopting a bonding process.

4. The manufacturing method of the light-emitting diode substrate according to claim 3 , wherein the driving substrate further comprises a plurality of conductive bumps located at a side of the pad away from the base substrate, and an orthographic projection of the pad on the base substrate is overlapped with an orthographic projection of at least one of the plurality of conductive bumps on the base substrate, and the manufacturing method further comprises:
coating an organic insulating adhesive on the driving substrate before transferring at least part of the N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto the driving substrate;
bonding the light-emitting diode chip transferred on the driving substrate with the pad of the corresponding one of the plurality of driving circuit by adopting a bonding process comprises:
performing thermal reflow on the driving substrate and evaporating a solvent in the organic insulating adhesive, to bond the light-emitting diode chip and the pad together.

5. The manufacturing method of the light-emitting diode substrate according to claim 1 , wherein transferring the N epitaxial layer groups on the N substrates to the transition carrier substrate comprises:
forming a first adhesive layer on the transition carrier substrate; and
transferring the N epitaxial layer groups on the N substrates to a side of the first adhesive layer away from the transition carrier substrate.

6. The manufacturing method of the light-emitting diode substrate according to claim 5 , wherein a material of the first adhesive layer comprises ultraviolet light viscosity reducing adhesive or laser dissociation adhesive.

7. The manufacturing method of the light-emitting diode substrate according to claim 1 , wherein after forming the epitaxial layer group of the M light-emitting diode chips on the substrate, the manufacturing method further comprises:
forming M electrode structures on a side of the epitaxial layer group away from the substrate; and
dividing the epitaxial layer group and the M electrode structures to form the M light-emitting diode chips.

8. The manufacturing method of the light-emitting diode substrate according to claim 7 , wherein transferring the N epitaxial layer groups on the N substrates to the transition carrier substrate comprises:
transferring the substrate on which the M light-emitting diode chips are formed to a transfer substrate;
peeling off the substrate from the transfer substrate; and
transferring N*M light-emitting diode chips on N transfer substrates to the transition carrier substrate,
wherein an area of the transfer substrate is approximately equal to an area of the substrate.

9. The manufacturing method of the light-emitting diode substrate according to claim 8 , wherein transferring the substrate on which M light-emitting diode chips are formed to the transfer substrate comprises:
coating a second adhesive layer on the transfer substrate; and
transferring the substrate on which M light-emitting diode chips are formed to a side of the second adhesive layer away from the transfer substrate.

10. The manufacturing method of the light-emitting diode substrate according to claim 8 , wherein the transition carrier substrate comprises a plurality of first support structures, and a size of each of the plurality of first support structures in a direction perpendicular to the transition carrier substrate is larger than a size of the light-emitting diode chips in the direction perpendicular to the transition carrier substrate, and transferring the N*M light-emitting diode chips on the N transfer substrates to the transition carrier substrate comprises:
sequentially aligning the N transfer substrates with the transition carrier substrate so that each of the plurality of first support structures is located between two adjacent light-emitting diode chips on the transfer substrate.

11. The manufacturing method of the light-emitting diode substrate according to claim 10 , wherein transferring at least part of the N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto the driving substrate comprises:
aligning the transition carrier substrate with the driving substrate so that the plurality of first support structures are located between the transition carrier substrate and the driving substrate;
aligning a first mask plate with the transition carrier substrate, wherein the first mask plate comprises a plurality of openings corresponding to a plurality of light-emitting diode chips to be transferred; and
irradiating light to the transition carrier substrate through the first mask plate to transfer the plurality of light-emitting diode chips to be transferred onto the driving substrate.

12. The manufacturing method of the light-emitting diode substrate according to claim 11 , wherein the driving substrate comprises a plurality of first receiving structures, and aligning the transition carrier substrate with the driving substrate comprises: inserting the plurality of first support structures on the transition carrier substrate into the plurality of first receiving structures on the driving substrate, wherein the plurality of first support structures and the plurality of first receiving structures are arranged in one-to-one correspondence, and a size of each of the plurality of first receiving structures in a direct

Assignees

• Boe Technology Group Co Ltd

Inventors

• Li Haixu
• Zhang Xiao
• Wang Fei
• Wang Mingxing
• Li Shulei
• Dong Xue
• Yuan Guangcai
• Cao Zhanfeng
• Gu Xin
• Wang Ke
• Qu Feng
• Liang Xuan
• Yan Junwei

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title