Sputter deposition

Patent metadata

Field	Value
Publication number	US-12249498-B2
Application number	US-202017776721-A
Country	US
Kind code	B2
Filing date	Nov 10, 2020
Priority date	Nov 15, 2019
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

A sputter deposition apparatus including: a substrate support assembly arranged to support a substrate; a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate; a plasma generation arrangement arranged to provide plasma for said sputter deposition; and a cartridge arranged to contain the substrate with deposited target material after said sputter deposition. The cartridge is removable from the sputter deposition apparatus.

First claim

The invention claimed is:

1. A sputter deposition apparatus comprising:
a substrate support assembly arranged to support a substrate;
a target support assembly arranged to support at least one sputter target for use in a sputter deposition of a target material onto the substrate;
a plasma generation arrangement arranged to provide plasma for said sputter deposition; and
a cartridge arranged to contain the substrate with deposited target material from the at least one sputter target after said sputter deposition, wherein the cartridge comprises the target support assembly, and the at least one sputter target supported by the target support assembly,
wherein the cartridge is configured as removable from the sputter deposition apparatus, and upon removal the cartridge contains each of the target support assembly, the at least one sputter target supported by the target support assembly, and the substrate with the deposited target material after said sputter deposition.

2. The sputter deposition apparatus according to claim 1 , wherein the cartridge comprises a vacuum chamber arranged to contain at least the portion of the substrate with the deposited target material in a vacuum.

3. The sputter deposition apparatus according to claim 1 , wherein the plasma generation arrangement is arranged to provide the plasma within a deposition zone of the sputter deposition apparatus, and wherein the cartridge comprises the deposition zone.

4. The sputter deposition apparatus according to claim 3 , wherein the plasma generation arrangement is arranged to generate an electric field and/or a magnetic field for generation and propagation of the plasma, and a casing of the cartridge comprises a transmissive region at least partially transmissive for the electric field and/or the magnetic field, to generate the plasma within the deposition zone of the cartridge.

5. The sputter deposition apparatus according to claim 3 , wherein the cartridge further comprises the substrate and the substrate support assembly, wherein the cartridge is sealed under vacuum during the sputter deposition.

6. The sputter deposition apparatus according to claim 3 , wherein the cartridge comprises an aperture for entry of the plasma into the deposition zone of the cartridge, wherein optionally the aperture is sealable.

7. The sputter deposition apparatus according to claim 1 , wherein the plasma generation arrangement is arranged to provide the plasma for the sputter deposition within a deposition zone of the sputter deposition apparatus, wherein the deposition zone is outside the cartridge.

8. The sputter deposition apparatus according to claim 7 , wherein the sputter deposition apparatus is arranged to receive the cartridge with the substrate arranged therein, and the sputter deposition apparatus comprises a transport assembly arranged to:
transport at least a portion of the substrate from the cartridge into the deposition zone, to provide for said sputter deposition within the deposition zone; and
transport at least the portion of the substrate, after said sputter deposition, into the cartridge.

9. The sputter deposition apparatus according to claim 8 , wherein the sputter deposition apparatus is arranged to receive the cartridge with the at least one sputter target arranged therein, and the transport assembly is further arranged to:
transport the at least one sputter target from the cartridge into the deposition zone, to provide for said sputter deposition within the deposition zone.

10. The sputter deposition apparatus according to claim 1 , wherein the substrate support assembly comprises a conveyor system arranged to convey the substrate relative to the at least one sputter target during said sputter deposition.

Assignees

• Dyson Technology Ltd

Inventors

• Rendall Michael Edward
• Gruar Robert Ian Joseph

Classifications

• C23C14/562

  for coating elongated substrates · CPC title

• H01J37/3435

  Target holders (includes backing plates and endblocks) · CPC title

• H01J37/32788

  for extracting the material from the process chamber · CPC title

• H01J37/32743 Primary

  for introducing the material into processing chamber · CPC title

• C23C14/50

  Substrate holders · CPC title