Thick film resistor paste, thick film resistor, and electronic component

Patent metadata

Field	Value
Publication number	US-12249447-B2
Application number	US-202117921854-A
Country	US
Kind code	B2
Filing date	Apr 30, 2021
Priority date	May 1, 2020
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

To provide a thick film resistor paste for a resistor having no abnormalities of cracks in appearance and sufficient surge resistance, especially for low resistance, while using lead borosilicate glass, a thick film resistor using the thick film resistor paste, and an electronic component provided with the thick film resistor. A thick film resistor paste comprises a ruthenium-oxide-containing glass powder and an organic vehicle, the ruthenium-oxide-containing glass powder comprises 10 to 60 mass % of ruthenium oxide, a glass composition of the ruthenium-oxide-containing glass powder comprises 60 mass % or less of silicon oxide, 30 to 90 mass % of lead oxide, 5 to 50 mass % of boron oxide relative to 100 mass % of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.

First claim

The invention claimed is:

1. A thick film resistor paste, characterized by kneading: a ruthenium-oxide-containing glass powder that does not contain a lead ruthenate; and an organic vehicle,
wherein the ruthenium-oxide-containing glass powder comprises 10 mass % or more and 60 mass % or less of ruthenium oxide relative to 100 mass % of the glass composition containing the ruthenium oxide;
wherein a glass composition of the ruthenium-oxide-containing glass powder comprises 3 mass % or more and 60 mass % or less of silicon oxide, 30 mass % or more and 90 mass % or less of lead oxide, and 5 mass % or more and 50 mass % or less of boron oxide relative to 100 mass % of glass components; and
wherein a combined amount of silicon oxide, lead oxide and boron oxide by mass % is 50 mass % or more relative to 100 mass % of the glass components.

2. The thick film resistor paste according to claim 1 , wherein an average particle diameter of the ruthenium-oxide-containing glass powder is 5 micrometers or less.

3. The thick film resistor comprising a sintered body of the thick film resistor paste according to claim 2 .

4. An electronic component provided with the thick film resistor according to claim 3 .

5. The thick film resistor comprising a sintered body of the thick film resistor paste according to claim 1 .

6. An electronic component provided with the thick film resistor according to claim 5 .

Assignees

• Sumitomo Metal Mining Co

Inventors

• Ando Masaki
• Nagano Takahito

Classifications

• H01C7/003 Primary

  Thick film resistors · CPC title

• C03C8/10

  containing lead · CPC title

• C03C8/16

  with vehicle or suspending agents, e.g. slip · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H01C17/06533 Primary

  composed of oxides · CPC title