Liquid ejection head and production method for producing same

Patent metadata

Field	Value
Publication number	US-12246535-B2
Application number	US-202217961839-A
Country	US
Kind code	B2
Filing date	Oct 7, 2022
Priority date	Oct 14, 2021
Publication date	Mar 11, 2025
Grant date	Mar 11, 2025

Abstract

A liquid ejection head includes an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads, respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

First claim

What is claimed is:

1. A liquid ejection head, comprising:
an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the liquid ejection port, and a plurality of wiring pads aligned in a predetermined direction;
a flexible wiring substrate having a plurality of leads aligned in the predetermined direction and overlaid on and connected to, respectively, the plurality of wiring pads, and a base film overlaid on the plurality of leads at a side opposite to that of the plurality of wiring pads; and
a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads,
wherein the base film has:
a plurality of covering portions that respectively cover the plurality of leads at a side opposite to that of the plurality of connection portions; and
an opening or slit formed between the plurality of covering portions.

2. The liquid ejection head according to claim 1 ,
wherein a size of the opening or of the slit in the predetermined direction is shorter than a spacing between the plurality of wiring pads.

3. The liquid ejection head according to claim 1 ,
wherein the base film has the opening formed between the plurality of covering portions.

4. The liquid ejection head according to claim 3 , wherein the base film has the opening, which is polygonal or round, and formed between the plurality of covering portions.

5. The liquid ejection head according to claim 4 ,
wherein the base film has the opening, which is triangular, rhomboidal or rectangular, and formed between the plurality of covering portions.

6. The liquid ejection head according to claim 1 ,
wherein the base film has the slit formed between the plurality of covering portions.

7. The liquid ejection head according to claim 1 ,
wherein as viewed in a direction perpendicular to a surface of the element substrate, the opening or the slit does not overlap any of the leads.

8. The liquid ejection head according to claim 1 ,
wherein as viewed in a direction perpendicular to a surface of the element substrate, the plurality of leads is not exposed through the base film.

9. The liquid ejection head according to claim 1 ,
wherein a plurality of openings or slits is provided corresponding to one row of the plurality of wiring pads arranged in the predetermined direction.

10. A method for producing a liquid ejection head, the method comprising the steps of:
preparing an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the liquid ejection port, and a plurality of wiring pads aligned in a predetermined direction;
preparing a flexible wiring substrate having a plurality of leads aligned in the predetermined direction and overlaid on and connected to, respectively, the plurality of wiring pads, and a base film overlaid on the plurality of leads at a side opposite to that of the plurality of wiring pads;
respectively connecting the plurality of leads to the plurality of wiring pads; and
sealing, by a sealant, a plurality of connection portions of the plurality of wiring pads and the plurality of leads,
wherein the base film has:
a plurality of covering portions that respectively cover the plurality of leads at a side opposite to that of the plurality of connection portions; and
an opening or slit formed between the plurality of covering portions.

11. The method for producing a liquid ejection head according to claim 10 ,
wherein a size of the opening or of the slit in the predetermined direction is shorter than a spacing between the plurality of wiring pads.

12. The method for producing a liquid ejection head according to claim 10 ,
wherein the base film has the opening formed between the plurality of covering portions.

13. The method for producing a liquid ejection head according to claim 12 ,
wherein the base film has the opening, which is polygonal or round, and formed between the plurality of covering portions.

14. The method for producing a liquid ejection head according to claim 13 ,
wherein the base film has the opening, which is triangular, rhomboidal or rectangular, and formed between the plurality of covering portions.

15. The method for producing a liquid ejection head according to claim 10 ,
wherein the base film has the slit formed between the plurality of covering portions.

16. The method for producing a liquid ejection head according to claim 10 , wherein the sealant is injected via the opening or the slit to the plurality of connection portions.

Assignees

• Canon Kk

Inventors

• Chida Mitsuru
• Iri Junichiro

Classifications

• B41J2202/18

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• B41J2002/14491

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• B41J2/14

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• B41J2/1637

  molding · CPC title

• B41J2/1635

  dividing the wafer into individual chips · CPC title