Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
US-11462502-B2 · Oct 4, 2022 · US
US12246376B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12246376-B2 |
| Application number | US-202017594978-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 5, 2020 |
| Priority date | May 7, 2019 |
| Publication date | Mar 11, 2025 |
| Grant date | Mar 11, 2025 |
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A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.
Opening claim text (preview).
The invention claimed is: 1. A method of making a combined sinter-ready silver film and carrier, comprising the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings; c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier; and d) rolling or cutting the combined sinter-ready silver film and carrier into individual sheets ready for industrial use. 2. The method of claim 1 , wherein the carrier is created by permanently bonding two plastic films. 3. The method of claim 1 , wherein the carrier comprises a stencil layer and a backing layer. 4. The method of claim 3 , wherein the stencil layer defines the designed openings. 5. The method of claim 3 , wherein the backing layer is configured for sealing a bottom of the designed openings. 6. The method of claim 3 , wherein at the start of step b) a top of the designed openings is open for receiving the cast silver film layer. 7. The method of claim 3 , wherein casting the silver film layer comprises casting silver paste.
batch processes · CPC title
Connecting techniques · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
comprising metals or metalloids, e.g. solders · CPC title
Die-attach connectors having a filler embedded in a matrix · CPC title
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