Heatsink techniques for optical and electrical modules

Patent metadata

Field	Value
Publication number	US-12245359-B2
Application number	US-202418745045-A
Country	US
Kind code	B2
Filing date	Jun 17, 2024
Priority date	Sep 16, 2019
Publication date	Mar 4, 2025
Grant date	Mar 4, 2025

Abstract

A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

First claim

What is claimed is:

1. A module for use in a hardware platform for networking, computing, and/or storage, the module comprising:
a printed circuit board assembly;
components disposed on a primary side of the printed circuit board assembly;
a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module, wherein the primary side heatsink is attached to a faceplate of the module via a sprung line-contact.

2. The module of claim 1 , further comprising a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

3. The module of claim 2 , wherein the pluggable module and the cage are compliant to a multisource agreement (MSA).

4. The module of claim 1 , wherein the one or more pivot points include four points positioned adjacent to each corner of the pluggable module.

5. The module of claim 1 , wherein the one or more pivot points include four points positioned adjacent to each corner of the pluggable module.

6. The module of claim 1 , further comprising a secondary side heatsink for the pluggable module.

7. The module of claim 6 , wherein the secondary side heatsink and the primary side heatsink apply a required insertion force to the pluggable module.

8. The module of claim 6 , further comprising a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the cage includes a hole for the secondary side heatsink.

9. The module of claim 8 , wherein the pluggable module and the cage are compliant to a multisource agreement (MSA).

10. The module of claim 1 , wherein the one or more pivot points each apply a force for both thermal connectivity between the primary side heatsink and the pluggable module and for physical support of the pluggable module.

11. A printed circuit board assembly comprising:
a printed circuit board;
components disposed on a primary side of the printed circuit board;
a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module, wherein the primary side heatsink is attached to a faceplate connected to the printed circuit board via a sprung line-contact.

12. The printed circuit board assembly of claim 11 , further comprising a cage attached to the printed circuit board for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

13. The printed circuit board assembly of claim 12 , wherein the pluggable module and the cage are compliant to a multisource agreement (MSA).

14. The printed circuit board assembly of claim 11 , wherein the one or more pivot points include four points positioned adjacent to each corner of the pluggable module.

15. The printed circuit board assembly of claim 11 , wherein the one or more pivot points include two points positioned adjacent to rear corners of the pluggable module and the primary side heatsink is attached to a faceplate of the module.

16. The printed circuit board assembly of claim 11 , further comprising a secondary side heatsink for the pluggable module.

17. The printed circuit board assembly of claim 16 , wherein the secondary side heatsink and the primary side heatsink apply a required insertion force to the pluggable module.

18. The printed circuit board assembly of claim 16 , further comprising a cage attached to the printed circuit board for supporting the pluggable module, wherein the cage includes a hole for the secondary side heatsink.

Assignees

• Ciena Corp

Inventors

• O'Leary Mitchell
• Aldea Victor
• Rahmani Kamran
• Meunier Trevor
• Ajersch Peter
• Graham Terence
• Leclair Marc

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H01R13/533

  Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence) · CPC title

• H01R13/523

  for use under water · CPC title

• H01R13/521

  Sealing between contact members and housing, e.g. sealing insert · CPC title

• G02B6/3816

  for use under water, high pressure connectors (provisionally see G02B6/4428) · CPC title