State monitoring method and state monitoring system

US12244785B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12244785-B2
Application numberUS-202318218261-A
CountryUS
Kind codeB2
Filing dateJul 5, 2023
Priority dateJul 12, 2022
Publication dateMar 4, 2025
Grant dateMar 4, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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The state monitoring system includes: a 3D camera configured to acquire an image in a work area; and information processing apparatus connected to the 3D camera and including a processing unit and a storage unit. The processing unit calculates a camera setting parameter that determines an imaging condition of the 3D camera with respect to a monitoring target as a target to be monitored in the work area and stores the camera setting parameter in the storage unit, determines the imaging condition of the 3D camera by applying the camera setting parameter corresponding to the monitoring target with reference to the camera setting parameter stored in the storage unit, acquires an image of the monitoring target from the 3D camera configured to image the monitoring target in the determined imaging condition, and determines a state of the monitoring target based on the acquired image of the monitoring target.

First claim

Opening claim text (preview).

What is claimed is: 1. A state monitoring method using a 3D camera configured to acquire an image in a work area and information processing apparatus connected to the 3D camera and including a processing unit and a storage unit, the method comprising: allowing the processing unit to calculate a camera setting parameter that determines an imaging condition of the 3D camera with respect to a monitoring target as a target to be monitored in the work area and store the camera setting parameter in the storage unit, determine the imaging condition of the 3D camera by applying the camera setting parameter corresponding to the monitoring target with reference to the camera setting parameter stored in the storage unit, acquire an image of the monitoring target from the 3D camera configured to image the monitoring target in the determined imaging condition, and determine a state of the monitoring target based on the acquired image of the monitoring target. 2. The state monitoring method according to claim 1 , further comprising: allowing the processing unit to acquire position coordinates of the monitoring target from the image acquired by the 3D camera, and calculate the camera setting parameter based on the acquired position coordinates. 3. The state monitoring method according to claim 1 , further comprising: allowing the storage unit to store position management information that is information regarding position coordinates of the monitoring target; and allowing the processing unit to acquire the position coordinates of the monitoring target using the position management information and calculate the camera setting parameter based on the acquired position coordinates. 4. The state monitoring method according to claim 1 , further comprising allowing the processing unit to calculate a camera setting parameter that determines an orientation of the 3D camera with respect to the monitoring target. 5. The state monitoring method according to claim 1 , further comprising allowing the processing unit to calculate a camera setting parameter that adjusts an viewing angle of the 3D camera with respect to the monitoring target. 6. The state monitoring method according to claim 1 , further comprising allowing the processing unit to calculate a camera setting parameter that executes pixel interpolation on the image acquired by the 3D camera when the monitoring target is acquired. 7. The state monitoring method according to claim 1 , further comprising: allowing the processing unit to generate a plurality of two-dimensional images of the monitoring target from different viewpoints based on the image of the monitoring target acquired from the 3D camera, to classify the generated two-dimensional images depending on a configuration belonging to the monitoring target, and to determine a state of the configuration belonging to the monitoring target. 8. A state monitoring system comprising: a 3D camera configured to acquire an image in a work area; and information processing apparatus connected to the 3D camera, wherein the information processing apparatus includes a processing unit and a storage unit, and the processing unit calculates a camera setting parameter that determines an imaging condition of the 3D camera with respect to a monitoring target as a target to be monitored in the work area and stores the camera setting parameter in the storage unit, determines the imaging condition of the 3D camera by applying the camera setting parameter corresponding to the monitoring target with reference to the camera setting parameter stored in the storage unit, acquires an image of the monitoring target from the 3D camera configured to image the monitoring target in the determined imaging condition, and determines a state of the monitoring target based on the acquired image of the monitoring target. 9. The state monitoring system according to claim 8 , wherein the processing unit acquires position coordinates of the monitoring target from the image acquired by the 3D camera, and calculates the camera setting parameter based on the acquired position coordinates. 10. The state monitoring system according to claim 8 , wherein the storage unit stores position management information that is information regarding position coordinates of the monitoring target, and the processing unit acquires the position coordinates of the monitoring target using the position management information, and calculates the camera setting parameter based on the acquired position coordinates. 11. The state monitoring system according to claim 8 , wherein the processing unit calculates a camera setting parameter that determines an orientation of the 3D camera with respect to the monitoring target. 12. The state monitoring system according to claim 8 , wherein the processing unit calculates a camera setting parameter that adjusts an viewing angle of the 3D camera with respect to the monitoring target. 13. The state monitoring system according to claim 8 , wherein the processing unit calculates a camera setting parameter that executes pixel interpolation on the image acquired by the 3D camera when the monitoring target is acquired. 14. The state monitoring system according to claim 8 , wherein the processing unit generates a plurality of two-dimensional images of the monitoring target from different viewpoints based on the image of the monitoring target acquired from the 3D camera, classifies the generated two-dimensional images depending on a configuration belonging to the monitoring target, and determines a state of the configuration belonging to the monitoring target. 15. The state monitoring system according to claim 8 , further comprising an information terminal configured to output information regarding the state of the monitoring target determined by the information processing apparatus, the information terminal being carried by a worker in the work area.

Assignees

Inventors

Classifications

  • Stereo camera calibration · CPC title

  • Surveillance · CPC title

  • Camera pose · CPC title

  • G06V20/52Primary

    Surveillance or monitoring of activities, e.g. for recognising suspicious objects (recognising microscopic objects G06V20/69) · CPC title

  • for generating image signals corresponding to three or more geometrical viewpoints, e.g. multi-view systems · CPC title

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What does patent US12244785B2 cover?
The state monitoring system includes: a 3D camera configured to acquire an image in a work area; and information processing apparatus connected to the 3D camera and including a processing unit and a storage unit. The processing unit calculates a camera setting parameter that determines an imaging condition of the 3D camera with respect to a monitoring target as a target to be monitored in the w…
Who is the assignee on this patent?
Hitachi Ltd
What technology area does this patent fall under?
Primary CPC classification G06V20/52. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).