Preparation method for W-Cu composite plate with Cu phase in finger-shaped gradient distribution

Patent metadata

Field	Value
Publication number	US-12241142-B2
Application number	US-202217967906-A
Country	US
Kind code	B2
Filing date	Oct 18, 2022
Priority date	Oct 18, 2021
Publication date	Mar 4, 2025
Grant date	Mar 4, 2025

Abstract

A preparation method for a W—Cu composite plate with a Cu phase in finger-shaped gradient distribution is provided. The method includes adding WO X powder obtained with ammonium metatungstate as a raw material into W powder through a combustion synthesis method, adding a binder and a pore-forming agent to prepare a slurry, then performing tape casting, soaking in water and sintering to obtain a W framework with pores in finger-shaped distribution, and then infiltrating Cu to obtain a target product. The Cu phase in the W—Cu composite material prepared by the present method is distributed in a finger-shaped gradient manner from an infiltration surface to the interior of a specimen, the Cu phase and the W phase are mutually pinned, and the W—Cu interface has good bonding strength. The present method has the characteristics of adjustable material component performance, simple process, low cost, suitability for large-scale production and the like.

First claim

What is claimed is:

1. A preparation method for a W—Cu composite plate with a Cu phase in a finger-shaped gradient distribution, comprising the following steps:
(1) mixing a WO X powder and a W powder to obtain a powder mixture; adding the powder mixture, a binder polyethersulfone, and a pore-forming agent polyvinyl pyrrolidone into an N-methylpyrrolidone solvent to obtain a first resulting mixture, and uniformly mixing the first resulting mixture by a ball milling in a planetary ball mill to obtain a slurry;
wherein the WO X powder accounts for 50 wt. % or less of a mass of the powder mixture and is not 0; the binder polyethersulfone and the pore-forming agent polyvinyl pyrrolidone each independently account for 1-6% of the mass of the powder mixture; and the slurry has a solid content of 50-85 wt. %;
(2) tape-casting the slurry on a PET film to obtain a green body, soaking the green body and the PET film in water together to partially remove the N-methylpyrrolidone solvent, then separating the green body from the PET film, and then drying the green body;
(3) pre-sintering the green body at 500-800° C. under a H 2 atmosphere to remove the binder polyethersulfone and reduce the green body, and then performing a heating to 800-2000° C. to sinter the green body to obtain a W framework with finger-shaped distributed pores; and
(4) infiltrating Cu into the W framework to obtain a resulting framework, and then cooling the resulting framework along with a furnace to obtain the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution.

2. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein the WO X powder is obtained through a combustion synthesis method by taking ammonium metatungstate, ammonium nitrate, glycine, and ethylenediaminetetraacetic acid as raw materials, adding deionized water for a dispersion to obtain a second resulting mixture, and then placing the second resulting mixture into a muffle furnace at a constant temperature of 200° C.

3. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (1), the ball milling is performed at a rotation speed of 100-400 r/min for 2-48 h.

4. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (2), the green body obtained through the tape-casting has a thickness of 200 μm-2 mm.

5. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (2), when the green body and the PET film are soaked in the water together, the PET film is placed at a lower part, the green body is placed at an upper part, and a sample is ensured to be parallel to a horizontal plane, so that a pore distribution in the green body is controlled, and the soaking is performed for 12-48 h.

6. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (2), when the green body and the PET film are soaked in the water together, an exchange of the water and the N-methylpyrrolidone solvent occurs at an interface of an upper surface of the green body and the water, and the water penetrates into the green body, forming finger-shaped distributed pores.

7. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (3), the green body is pre-sintered at 500-800° C. for 1-4 h and sintered at 800-2000° C. for 1-4 h.

8. The preparation method for the W—Cu composite plate with the Cu phase in the finger-shaped gradient distribution according to claim 1 , wherein in the step (4), the step of infiltrating the Cu into the W framework is that a pure purple Cu block or an electrolytic Cu powder pressed compact is placed on a surface of the W framework with the finger-shaped distributed pores in an infiltration sintering furnace under a protection of a N 2 or H 2 atmosphere, the heating is performed to melt the Cu to obtain a Cu melt, the Cu melt is infiltrated into the finger-shaped distributed pores of the W framework under an action of a capillary force, and an infiltration of the Cu is performed at 1200-1500° C. for 1-4 h.

Assignees

• Univ Hefei Technology

Inventors

• Cheng Jigui
• Zhou Rui
• Wei Bangzheng
• Chen Pengqi
• Zheng Su
• Yu Xinxi

Classifications

• C22C1/053 Primary

  with in situ formation of hard compounds · CPC title

• C22C27/04 Primary

  Alloys based on tungsten or molybdenum · CPC title

• C01G41/02

  Oxides; Hydroxides · CPC title

• B22F2301/20

  Refractory metals · CPC title

• B22F2301/10

  Copper · CPC title