Method for producing composition for melt processing

US12240955B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12240955-B2
Application numberUS-202017627356-A
CountryUS
Kind codeB2
Filing dateJul 10, 2020
Priority dateJul 16, 2019
Publication dateMar 4, 2025
Grant dateMar 4, 2025

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A method for producing a poly(3-hydroxybutyrate) resin-containing composition for melt processing includes: heating a material containing a poly(3-hydroxybutyrate) resin to a temperature equal to or higher than a melting point peak temperature in differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin and equal to or lower than a melting point peak end temperature in the differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin, wherein the difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is 10° C. or more; and extruding the heated material to obtain a composition for melt processing that has a new crystallization peak at a temperature higher than the melting point peak temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a composition for melt processing, the method comprising: heating a material comprising a poly(3-hydroxybutyrate) resin to a temperature equal to or higher than a melting point peak temperature in differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin and equal to or lower than a melting point peak end temperature in the differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin, wherein a difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is at least 10° C.; and extruding the heated material to obtain a composition for melt processing that has a crystallization peak at a temperature higher than the melting point peak temperature of the poly(3-hydroxybutyrate) resin, wherein the crystallization peak of the composition obtained in the extruding is from 1° C. to 60° C. above the melting point peak temperature of the poly(3-hydroxybutyrate) resin. 2. The method according to claim 1 , wherein the poly(3-hydroxybutyrate) resin comprises poly(3-hydroxybutyrate-co-3-hydroxyhexanoate). 3. The method according to claim 1 , wherein a temperature of the material during the extruding is 175° C. or lower. 4. The method according to claim 1 , wherein a weight-average molecular weight of the poly(3-hydroxybutyrate) resin is 40×10 4 or less. 5. The method according to claim 1 , wherein the melting point peak temperature of the poly(3-hydroxybutyrate) resin is at least 135° C. 6. A method for producing a poly(3-hydroxybutyrate) resin-containing molded body, the method comprising: obtaining a composition for melt processing by the method according to claim 1 ; and subjecting the composition to melt processing to produce a molded body. 7. The method according to claim 2 , wherein a temperature of the material during the extruding is 175° C. or lower. 8. The method according to claim 1 , wherein prior to the heating and the extruding, the material does not have the crystallization peak at the temperature higher than the melting point peak temperature of the poly(3-hydroxybutyrate) resin. 9. The method according to claim 1 , wherein the difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is from 12° C. to 50° C. 10. The method according to claim 1 , wherein the difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is from 18° C. to 50° C. 11. The method according to claim 1 , wherein the difference between the melting point peak temperature and the melting point peak end temperature of the poly(3-hydroxybutyrate) resin is from 25° C. to 50° C. 12. The method according to claim 1 , wherein the melting point peak temperature of the poly(3-hydroxybutyrate) resin is from 135° C. to 160° C. 13. The method according to claim 1 , wherein a weight-average molecular weight of the poly(3-hydroxybutyrate) resin is from 15×10 4 to 30×10 4 or less. 14. The method according to claim 1 , wherein the crystallization peak of the composition obtained in the extruding is from 12° C. to 50° C. above the melting point peak temperature of the poly(3-hydroxybutyrate) resin. 15. The method according to claim 1 , wherein a temperature of the material during the extruding is from 140° C. to 165° C. 16. The method according to claim 1 , wherein a temperature of the material during the extruding is from 150° C. to 160° C.

Assignees

Inventors

Classifications

  • Polyesters derived from hydroxy carboxylic acids, e.g. lactones (C08J2367/06 takes precedence) · CPC title

  • Compositions for preparing crystalline polymers · CPC title

  • C08G63/06Primary

    derived from hydroxycarboxylic acids · CPC title

  • Use of specified macromolecular materials not provided for in a single one of main groups B29K2001/00 - B29K2095/00, as moulding material · CPC title

  • Extrusion moulding · CPC title

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What does patent US12240955B2 cover?
A method for producing a poly(3-hydroxybutyrate) resin-containing composition for melt processing includes: heating a material containing a poly(3-hydroxybutyrate) resin to a temperature equal to or higher than a melting point peak temperature in differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin and equal to or lower than a melting point peak end temperature in the…
Who is the assignee on this patent?
Kaneka Corp
What technology area does this patent fall under?
Primary CPC classification C08G63/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).