Head mountable display

Patent metadata

Field	Value
Publication number	US-12238909-B2
Application number	US-202318478596-A
Country	US
Kind code	B2
Filing date	Sep 29, 2023
Priority date	May 15, 2023
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.

First claim

What is claimed is:

1. A wearable electronic display assembly, comprising:
a first housing defining an external surface and an internal volume;
a structural frame coupled to the first housing in the internal volume and defining an aperture;
a display coupled to the structural frame and aligned with the aperture;
a heat-generating electronic component disposed in the internal volume; and
a fan including:
a second housing disposed within the internal volume, the second housing physically coupled to the heat generating electronic component; and
plurality of blades disposed in the internal volume and aligned with the aperture;

wherein:
the structural frame is disposed between the display and the fan; and
the fan is disposed between the structural frame and the heat generating electronic component.

2. The wearable electronic display assembly of claim 1 , wherein the second housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.

3. The wearable electronic display assembly of claim 2 , further comprising a printed circuit board (PCB), the heat-generating component coupled to the PCB.

4. The wearable electronic display assembly of claim 3 , further comprising a barrier coupled to the PCB and at least partially surrounding the heat-generating component, wherein:
the heat-generating component, the PCB, the barrier, and the housing define a containment volume; and
the barrier is configured to contain the thermal paste within the containment volume.

5. The wearable electronic display assembly of claim 3 , wherein the second housing defines a major plane of the fan disposed parallel to the PCB.

6. The wearable electronic display assembly of claim 1 , the housing comprising:
a first housing shell thermally coupled to the heat-generating component; and
a second housing shell coupled to the first housing shell, the second housing shell defining a fan inlet.

7. The wearable electronic display assembly of claim 6 , wherein the first housing shell and the second housing shell define a fan outlet.

8. The wearable electronic display assembly of claim 1 , wherein the heat-generating component includes a processor.

9. An electronic device, comprising:
an external frame defining:
an internal volume;
an air inlet port; and
an air exhaust port;

a printed circuit board (PCB) disposed in the internal volume;
a processor coupled to the PCB;
a fan configured to draw air into the internal volume through the inlet port and push air out from the internal volume through the exhaust port, the fan including a metal housing disposed within the internal volume and directly contacting the processor;
a display disposed within the internal volume, the fan disposed between the display and the processor, the fan configured to convectively cool the display and conductively cool the processor;

wherein:
the metal housing defines a fan inlet and a fan outlet; and
the air inlet port, the fan inlet, the fan outlet, and the air exhaust port define an airflow path with the air inlet port upstream from the fan inlet, the fan inlet upstream from the fan outlet, and the fan outlet upstream from the air exhaust port.

10. The electronic device of claim 9 , wherein the processor is disposed outside of the airflow path.

11. The electronic device of claim 9 , wherein the metal housing is disposed between the processor and the airflow path.

12. The electronic device of claim 9 , wherein the metal housing is thermally coupled to the processor via a thermal paste disposed between the processor and the metal housing.

13. The electronic device of claim 9 , wherein the metal housing defines a planar portion disposed parallel to the PCB, the processor thermally coupled to the planar portion.

14. An electronic display device, comprising:
an external frame defining an internal volume;
an internal frame coupled to the external frame at discrete touch points the internal frame defining an aperture;
a display screen disposed in the internal volume and aligned with the aperture;
a processor electrically coupled to the display screen; and
a fan disposed between the display screen and the processor, the fan aligned with the aperture, the fan including a housing contacting the processor;

wherein the aperture is disposed between the fan and the display screen such that the fan is configured to conductively cool the processor and convectively cool the display screen.

15. The electronic display device of claim 14 , the housing comprising:
a first housing shell comprising metal, the first housing shell thermally coupled to the processor; and
a second housing shell coupled to the first housing shell and defining a fan inlet, the second housing shell disposed between the display screen and the first housing shell.

16. The electronic display device of claim 15 , wherein:
the first housing shell and the second housing shell define a fan outlet; and
the fan outlet is configured to direct air away from the processor.

17. The electronic display device of claim 16 , the external frame further defining an exhaust port, wherein the outlet is configured to direct air toward the exhaust port.

18. The electronic display device of claim 14 , wherein the housing is coupled to the internal frame at an interface.

19. The electronic display device of claim 18 , wherein the interface includes an insulator disposed between the housing and the internal frame.

Assignees

• Apple Inc

Inventors

• Dunsmoor David J
• Mylabathula Enoch
• Sauers Jason C
• Dybenko Jesse T
• Campo Laura M

Classifications

• H05K7/20963

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• G06F1/163 Primary

  Wearable computers, e.g. on a belt · CPC title

• H05K7/20163

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• G02B27/0176

  characterised by mechanical features · CPC title