Heatsinking in laser devices

Patent metadata

Field	Value
Publication number	US-12237643-B2
Application number	US-202117302964-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	May 17, 2021
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.

First claim

We claim:

1. A device, comprising:
a header disk having a radial face and an internal face with a circumference;
a header post that is thermally conductive, the header post having:
a connecting face contacting the internal face and connected coterminously with the circumference;
a bonding face opposite to the connecting face;
an arced face sharing a radius with the radial face of the header disk and at least partially orbiting the bonding face;
a mounting face perpendicular to the connecting and the bonding face;

a lens holder, wherein the lens holder is an annular cylinder that has a first end surface, a second end surface opposite the first end surface, an inner surface, and an outer surface, wherein the inner and outer surfaces extend between and connect the first and second end surfaces, and the inner surface defines an interior of the lens holder in which a lens is received, and wherein at least a portion of the first end surface is bonded to the bonding face of the header post and the outer surface is radially offset from the arced face of the header post; and
an optical subassembly connected to the mounting face and optically aligned with the lens of the lens holder.

2. The device of claim 1 , further comprising:
a cover connected to the internal face of the header disk, the outer surface of the lens holder, and the arced face of the header post.

3. The device of claim 2 , wherein the cover hermetically seals the optical subassembly.

4. The device of claim 2 , wherein the arced face of the header post is treated with a seed metal for bonding the cover thereto.

5. The device of claim 1 , wherein the internal face is circular in cross-section in a first plane and the connecting face and the bonding face are semi-circular in cross-section in the first plane.

6. The device of claim 1 , wherein the mounting face includes an elevated portion level with a laser sub-mount of the optical subassembly.

7. The device of claim 1 , further comprising:
a heatsink connected to the arced face of the header post.

8. A device, comprising:
a header disk having a circumference; and
a header post that is thermally conductive, the header post having:
an arc coterminous to a portion of the circumference;
a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and
a bonding face perpendicular to the mounting face;

a lens holder bonded to the bonding face and including a lens;
a sleeve bonded to the lens holder and arranged to receive an optical isolator; and
a fiber receptacle coupled with the lens holder by way of the sleeve, the fiber receptacle and the sleeve holding an optical fiber in optical alignment with the optical isolator and the lens.

9. The device of claim 8 , further comprising:
a laser sub-mount connected to the mounting face and including a laser; and
an optical fiber receptacle connected to the lens holder and including an optical fiber optically aligned with the laser via the lens.

10. The device of claim 8 , wherein the lens holder is an annular cylinder that is concentrically aligned with the header disk and has an outer diameter that is shorter than a diameter of the header disk.

11. A method for constructing a transmitter optical subassembly (TOSA), comprising:
bonding an internal face of a header disk to a connecting face of a header post that is thermally conductive, wherein an arc described by a arced face of the header post is aligned with a circumference described by a radial face of the header disk;
bonding a first end surface of a lens holder to a bonding face of the header post, opposite to the connecting face; and
bonding a laser sub-mount to a mounting face of the header post, perpendicular to the connecting face and the bonding face, and
wherein at least one:
the internal face is positioned at an offset angle to the connecting face at time of bonding to account for hammering during bonding; or
the first end surface is positioned at an offset angle to the bonding face at time of bonding to account for hammering during bonding.

12. The method of claim 11 , further comprising:
bonding a cover to the internal face of the header disk, the arced face of the header post, and the lens holder.

13. The method of claim 12 , wherein the cover hermetically seals the laser sub-mount.

14. The method of claim 11 , wherein bonding is performed via laser welding.

15. The method of claim 11 , wherein the arc and the circumference share a radius, and the arc describes up to 180 degrees.

16. The method of claim 11 , wherein bonding the laser sub-mount optically aligns a laser included in the laser sub-mount with a lens included in the lens holder.

17. The method of claim 16 , wherein the mounting face of the header post includes a mounting cavity in which the laser sub-mount is bonded.

18. The method of claim 11 , wherein bonding the first end surface of the lens holder to the bonding face of the header post includes two joints bonding the lens holder with the header post.

19. The method of claim 11 , wherein the first end surface is positioned at the offset angle to the bonding face at time of bonding to account for hammering during bonding.

20. The method of claim 11 , wherein the internal face is positioned at the offset angle to the connecting face at time of bonding to account for hammering during bonding.

Assignees

• Cisco Tech Inc

Inventors

• Schlepple Norbert
• Bovington Jock T
• Nadeau Mary
• Pannala Mittu
• Neiman Jarrett S

Classifications

• H01S5/02438

  Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens · CPC title

• H01S5/0215

  Bonding to the substrate · CPC title

• H01S5/02326

  Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/02492

  CuW heat spreaders · CPC title