Electronic component

Patent metadata

Field	Value
Publication number	US-12237110-B2
Application number	US-202318534790-A
Country	US
Kind code	B2
Filing date	Dec 11, 2023
Priority date	May 31, 2021
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

First claim

What is claimed is:

1. An electronic component comprising:
an electronic element; and
an interposer board; wherein
the electronic element includes:
a multilayer body including dielectric layers and internal electrode layers which are laminated, a pair of multilayer body end surfaces intersecting the internal electrode layers, a pair of multilayer body side surfaces intersecting the multilayer body end surfaces, and a pair of main surfaces intersecting the multilayer body end surfaces and the multilayer body side surfaces; and
external electrodes each on a respective one of the pair of multilayer body end surfaces and connected to the internal electrode layers;

the interposer board includes a pair of board end surfaces, a pair of board side surfaces intersecting the board end surfaces, and a pair of board main surfaces intersecting the board end surfaces and the board side surfaces;
one of the pair of board main surfaces is joined with one of the pair of multilayer body main surfaces or with one of the pair of multilayer body side surfaces;
the interposer board is an alumina board; and
the pair of board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated Cu layer on an outer periphery of the Pd-containing layer.

2. The electronic component according to claim 1 , wherein the metal layer includes:
a Ni plated layer on an outer periphery of the Cu layer; and
a second Sn plated layer provided on an outer periphery of the Ni plated layer.

3. The electronic component according to claim 1 , wherein the interposer board includes the metal layer includes:
the Cu layer;
the Ni plated layer on an outer periphery of the Cu layer; and
a second Sn plated layer on an outer periphery of the Ni plated layer, on the one of the pair of board main surfaces in the vicinity of the electronic element, and in a vicinity of at least one of the board end surfaces.

4. The electronic component according to claim 1 , wherein the external electrodes and the metal layer on the at least one of the board end surfaces are covered by a first Sn plated layer.

5. The electronic component according to claim 1 , wherein the interposer board includes a recess in each of the pair of board end surfaces.

6. The electronic component according to claim 1 , wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 2.01 mm to about 2.20 mm, a width between the pair of multilayer body side surfaces is about 1.30 mm to about 1.50 mm, a thickness between the pair of multilayer body main surfaces is about 1.70 mm to about 1.9 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm.

7. The electronic component according to claim 1 , wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 3.1 mm to about 3.3 mm, a width between the pair of multilayer body side surfaces is about 1.5 mm to about 2.7 mm, a thickness between the pair of multilayer body main surfaces is about 1.5 mm to about 2.7 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm.

Assignees

• Murata Manufacturing Co

Inventors

• Ikeda Mitsuru
• Nishisaka Yasuhiro

Classifications

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title