Backlight module, method for manufacturing the same, and display apparatus

Patent metadata

Field	Value
Publication number	US-12235541-B2
Application number	US-202218274726-A
Country	US
Kind code	B2
Filing date	Jul 28, 2022
Priority date	Jul 28, 2022
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

A backlight module includes a substrate provided with a light-emitting region and a bonding region, a plurality of light-emitting units disposed on a side of the substrate, a back plate disposed on the other side of the substrate, and at least three drive circuit boards bonded and connected to the bonding region by first connectors. Moreover, an extension direction of a long edge of each of the light-emitting units is not parallel to a bonding edge of the bonding region. In this way, when the back plate is a curved back plate, the risk of peeling of the light-emitting units from the substrate when the back plate is in a curved state can be reduced by flexibly setting the degree of the included angle between the extension direction of each long edge of each light-emitting unit and the bonding edge of the bonding region.

First claim

The invention claimed is:

1. A backlight module, comprising:
a substrate, wherein the substrate is provided with a light-emitting region and a bonding region which are arranged sequentially in a first direction;
a plurality of light-emitting units, wherein the plurality of light-emitting units are disposed on a side of the substrate and are in the light-emitting region, each of the plurality of light-emitting units is rectangular, an orthographic projection of each of the plurality of light-emitting units on the substrate comprises two opposite long edges and two opposite short edges, an extension direction of a long edge of each of the plurality of light-emitting units intersects with a bonding edge, which is a side edge of the substrate where the bonding region is provided;
a back plate disposed on the other side of the substrate where the light-emitting units are not provided;
a plurality of first connectors, wherein the plurality of first connectors are arranged at intervals in a second direction, one end of each of the plurality of first connectors is bonded and connected to the bonding region, and the second direction intersects with the first direction;
at least three drive circuit boards, wherein the at least three drive circuit boards are arranged at intervals in the second direction, and each of the drive circuit boards is bonded and connected to the other ends of at least two of the plurality of first connectors; and
a plurality of second connectors, wherein the plurality of second connectors are arranged at intervals in the second direction, and every two adjacent drive circuit boards are coupled by one of the plurality of second connectors.

2. The backlight module according to claim 1 , wherein the back plate is a curved back plate, and a radius of curvature of the curved back plate is between 700 mm and 2000 mm.

3. The backlight module according to claim 1 , wherein an orthographic projection of each of the plurality of light-emitting units on the substrate is rectangular, and the substrate is rectangular; and
an included angle between the extension direction of the long edge of each of the plurality of light-emitting units and the bonding edge is greater than or equal to a target degree and is less than or equal to 90 degrees, and the target degree is a degree of an included angle between a diagonal of the rectangular substrate and the bonding edge.

4. The backlight module according to claim 3 , wherein the included angle between the extension direction of the long edge of each of the plurality of light-emitting units and the bonding edge is 90 degrees, and the plurality of light-emitting units are arranged in an array.

5. The backlight module according to claim 1 , wherein the at least three drive circuit boards are arranged at equal intervals.

6. The backlight module according to claim 1 , wherein the bonding region is divided into at least three bonding subregions in the second direction; and
Wherein a number of the bonding subregions is the same as a number of the at least three drive circuit boards, and each of the at least three drive circuit boards is bonded and connected to a corresponding bonding subregion by at least one of the plurality of first connectors.

7. The backlight module according to claim 1 , wherein the backlight module comprises four drive circuit boards, and each of the four drive circuit boards is connected to a target number of adjacent first connectors connected to the bonding region, and the target number is greater than or equal to 1.

8. The backlight module according to claim 1 , wherein the backlight module further comprises a plurality of package structures in one-to-one correspondence to the plurality of light-emitting units;
each of the plurality of package structures is disposed on a side of a corresponding light-emitting unit further away from the substrate and covers the light-emitting unit, and a length to height ratio of each of the plurality of package structures is greater than or equal to a first ratio and is less than or equal to a second ratio; and
wherein an orthographic projection of each of the plurality of package structures on the substrate is circular, a length of each of the plurality of package structures is a diameter of a contact surface between the package structure and the substrate, and a height of each of the plurality of package structures is a distance between an apex of the package structure further away from the substrate and the substrate.

9. The backlight module according to claim 8 , wherein the first ratio is 1 and the second ratio is 4.5.

10. The backlight module according to claim 9 , wherein the length of each of the plurality of package structures is 2 mm, and the height of each of the plurality of package structures is 0.5 mm.

11. The backlight module according to claim 8 , wherein a surface of the package structure further away from the substrate is an arc surface.

12. The backlight module according to claim 8 , wherein a material of the plurality of package structures comprises a high-thixotropy protective adhesive material, and the material of the plurality of package structures is a transparent material.

13. The backlight module according to claim 8 , wherein the backlight module further comprises a reflective layer;
the reflective layer is disposed on the side of the substrate and is provided with a plurality of openings in one-to-one correspondence to the plurality of light-emitting units, each of the plurality of light-emitting units is disposed in a corresponding opening, an orthographic projection of each of the plurality of openings on the substrate is disposed in an orthographic projection of one package structure on the substrate, and an edge of each of the plurality of package structures is disposed on a side of the reflective layer further away from the substrate; and
wherein a material of the reflective layer and the material of the package structures are homogeneous materials.

14. The backlight module according to claim 13 , wherein the material of the reflective layer and the material of the package structures are both silicon-based resin materials.

15. The backlight module according to claim 13 , wherein the material of the reflective layer comprises white ink.

16. The backlight module according to claim 1 , wherein the at least three drive circuit boards comprise a printed circuit board; the plurality of first connectors comprise a chip on film bonding member; and the plurality of second connectors comprise a flexible flat cable.

17. The backlight module according to claim 1 , wherein the plurality of light-emitting units are submillimeter light-emitting diodes or micro light-emitting diodes.

18. The backlight module according to claim 1 , wherein the first direction and the second direction are perpendicular to each other.

19. A method for manufacturing a backlight module, applied for manufacturing the backlight module according to claim 1 , comprising:
providing a substrate, wherein the substrate is provided with a light-emitting region and a bonding region, which are arranged sequentially in a first direction;
forming a plurality of light-emitting units on a side of the substrate and in the light-emitting region, wherein each of the plurality of light-emitting units is rectangular, an orthographic projection of each of the plurality of light-emitting units on the substrate comprises two opposite long edges and two opposite short edges, and an extension direction of a long edge of each of the plurality of light-emitting units

Assignees

• Hefei Boe Ruisheng Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Wang Xiao
• Zhang Bing
• Gao Liang
• Qi Qi
• Sun Jiwei

Classifications

• G02F1/133605

  including specially adapted reflectors · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/133608

  including particular frames or supporting means · CPC title

• G02F1/1336

  Illuminating devices · CPC title

• G09G3/36

  using liquid crystals · CPC title