Backlight module and display device

Patent metadata

Field	Value
Publication number	US-12234979-B2
Application number	US-202118272567-A
Country	US
Kind code	B2
Filing date	Oct 22, 2021
Priority date	Mar 18, 2021
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

A backlight module and a display device. The backlight module includes a backplane ( 1 ), a lamp board ( 2 ), a thermally conductive connecting layer ( 3 ), and a heat dissipation assembly ( 4 ), the backplane ( 1 ) has a first surface and a second surface, which are opposite each other; the lamp board ( 2 ) is arranged on the first surface of the backplane ( 1 ); the thermally conductive connecting layer ( 3 ) is arranged between the lamp board ( 2 ) and the backplane ( 1 ), and the thermally conductive connecting layer ( 3 ) is connected to the lamp board ( 2 ); the heat dissipation assembly ( 4 ) is arranged on the second surface of the backplane ( 1 ), and the heat dissipation assembly ( 4 ) passes through the backplane ( 1 ) and is then connected to the thermally conductive connecting layer ( 3 ).

First claim

What is claimed is:

1. A backlight module, comprising:
a backplane, having a first surface and a second surface opposite each other;
a lamp board, arranged at the first surface of the backplane;
a thermally conductive connecting layer, arranged between the backplane and the lamp board, wherein the thermally conductive connecting layer is connected with the lamp board; and
a heat dissipation assembly, arranged at the second surface of the backplane, wherein the heat dissipation assembly passes through the backplane and is then connected with the thermally conductive connecting layer, the heat dissipation assembly comprises a heat sink;
wherein the backplane has a mounting hole for the heat sink to pass therethrough; and

a size of the mounting hole is greater than a size of the heat sink in a first direction.

2. The backlight module according to claim 1 , wherein the thermally conductive connecting layer comprises at least one thermally conductive sheet, wherein
the at least one thermally conductive sheet each has a first thermally conductive portion and a second thermally conductive portion, wherein the first thermally conductive portion is configured to be connected with the heat dissipation assembly, and the second thermally conductive portion is configured to be connected with the lamp board.

3. The backlight module according to claim 2 , wherein the first thermally conductive portion and the second thermally conductive portion are integrally connected.

4. The backlight module according to claim 3 , wherein in the first direction, two first displacement assemblies symmetrical with respect to the heat sink and two second displacement assemblies symmetrical with respect to the thermally conductive sheet are arranged on the backplane;
each of the two first displacement assemblies comprises a first fixed portion and a first movable portion, wherein the first fixed portion is fixed to the backplane, the first movable portion is movable relative to the first fixed portion in the first direction, and the first movable portion abuts against the heat sink; and
each of the two second displacement assemblies comprises a second fixed portion and a second movable portion, wherein the second fixed portion is fixed to the backplane, the second movable portion is movable relative to the second fixed portion in the first direction, and the second movable portion abuts against the thermally conductive sheet.

5. The backlight module according to claim 3 , wherein the lamp board comprises at least one lamp sub-board, and a gap is provided between any two adjacent lamp sub-boards; and
seam test holes are provided on the backplane, and are distributed along the gap.

6. The backlight module according to claim 2 , wherein the first surface of the backplane is divided into a first region and a second region, and the first region comprises at least one sinking recess, wherein the at least one sinking recess corresponds to the at least one thermally conductive sheet in a one-to-one correspondence, and the at least one sinking recess is configured to place the at least one thermally conductive sheet; and
a depth of the at least one sinking recess is not less than a thickness of the thermally conductive connecting layer, and a size of the at least one of sinking recess is greater than a size of the at least one thermally conductive sheet in the first direction.

7. The backlight module according to claim 6 , wherein the first surface in which the second region is located is coated with thermally conductive silica gel.

8. The backlight module according to claim 1 , wherein heat dissipation teeth are formed on a surface of the heat dissipation assembly facing away from the backplane; and
a thickness of a tooth root of the heat dissipation tooth is greater than a thickness of a tooth tip, and a distance between any two heat dissipation teeth is greater than twice the thickness of the tooth root.

9. A display apparatus, comprising a display panel and the backlight module of claim 1 , wherein the display panel is arranged on a side of a light emitting surface of the backlight module.

10. The backlight module according to claim 1 , wherein a surface of the heat sink configured to be connected with the thermally conductive connecting layer is coated with thermally conductive silica gel.

11. The backlight module according to claim 1 , wherein a connecting hole is provided around the mounting hole, and the heat sink is connected with the connecting hole via a first connector.

12. The backlight module according to claim 11 , wherein the heat sink is connected with the backplane through the first connector.

13. The backlight module according to claim 12 , wherein the thermally conductive sheet is provided with a first avoiding hole configured with avoid the first connector.

14. The backlight module according to claim 13 , wherein a position of the first avoiding hole corresponds to a position of the connecting hole; and a size of the first avoiding hole is greater than a size of the connecting hole.

15. A backlight module, comprising:
a backplane, having a first surface and a second surface opposite each other;
a lamp board, arranged at the first surface of the backplane;
a thermally conductive connecting layer, arranged between the backplane and the lamp board, wherein the thermally conductive connecting layer is connected with the lamp board; and
a heat dissipation assembly, arranged at the second surface of the backplane, wherein the heat dissipation assembly passes through the backplane and is then connected with the thermally conductive connecting layer;
wherein the lamp board comprises at least one lamp sub-board, and a gap is provided between any two adjacent lamp sub-boards; and
seam test holes are provided on the backplane, and are distributed along the gap.

16. The backlight module according to claim 15 , wherein the thermally conductive connecting layer comprises at least one thermally conductive sheet, wherein
the at least one thermally conductive sheet each has a first thermally conductive portion and a second thermally conductive portion, wherein the first thermally conductive portion is configured to be connected with the heat dissipation assembly, and the second thermally conductive portion is configured to be connected with the lamp board.

17. The backlight module according to claim 16 , wherein the first surface of the backplane is divided into a first region and a second region, and the first region comprises at least one sinking recess, wherein the at least one sinking recess corresponds to the at least one thermally conductive sheet in a one-to-one correspondence, and the at least one sinking recess is configured to place the at least one thermally conductive sheet; and
a depth of the at least one sinking recess is not less than a thickness of the thermally conductive connecting layer, and a size of the at least one of sinking recess is greater than a size of the at least one thermally conductive sheet in the first direction.

18. The backlight module according to claim 17 , wherein the first surface in which the second region is located is coated with thermally conductive silica gel.

19. The backlight module according to claim 15 , wherein heat dissipation teeth are formed on a surface of the heat dissipation assembly facing away from the backplane; and
a thickness of a tooth root of the heat dissipation tooth is greater than a thickness of a tooth tip, and a distance between any two heat dissipation teeth is greater than twice

Assignees

• Beijing Boe Chatani Electronics Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Qilin
• Tian Qing

Classifications

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V29/74

  with fins or blades · CPC title

• F21V29/503 Primary

  of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) · CPC title

• F21V29/713 Primary

  in direct thermal and mechanical contact of each other to form a single system · CPC title

• G02F1/1336

  Illuminating devices · CPC title