Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
US12233441B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12233441-B2 |
| Application number | US-202217987591-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 15, 2022 |
| Priority date | Nov 15, 2022 |
| Publication date | Feb 25, 2025 |
| Grant date | Feb 25, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A cleaning apparatus for cleaning a substrate wherein the substrate is contacted with ozonated water and irradiating the substrate and the ozonated water with UV electromagnetic radiation from a UV lamp within a cleaning chamber; wherein greater than or equal to about 50% of the UV electromagnetic radiation has a wavelength of greater than or equal to about 280 nm. Methods of cleaning a substrate are also presented.
Opening claim text (preview).
We claim: 1. A cleaning apparatus for cleaning a substrate, comprising: a UV lamp assembly comprising a UV lamp, disposed over a substrate support disposed within a cleaning chamber, and a water inlet for receiving a supply of ozonated water and a water outlet disposed above the substrate support for discharging ozonated water irradiated by the UV lamp assembly into contact with the substrate when disposed on the substrate support; wherein the UV lamp assembly is configured such that, in operation, UV electromagnetic radiation emitted by the UV lamp assembly contacts the ozonated water and the substrate within the cleaning chamber; wherein the UV lamp is in thermal communication with a cooling fluid; wherein the cleaning apparatus further comprises at least one of a sensor configured to determine a temperature of the UV lamp and/or a UV detector; wherein a flow of the cooling fluid is controlled based at least in part on the temperature of the UV lamp and/or a signal from the UV detector, such that, in operation, greater than or equal to about 50% of UV electromagnetic radiation emitted by the UV lamp assembly has a wavelength of greater than or equal to about 280 nm, wherein the cleaning apparatus comprises the UV detector; and wherein the flow of the cooling fluid is controlled based at least in part on the signal from the UV detector. 2. The cleaning apparatus for cleaning a substrate of claim 1 , comprising a coating disposed on the UV lamp, configured to produce a bathochromic shift in a wavelength of UV electromagnetic radiation, and configured to remove UV electromagnetic radiation having a wavelength below 280 nm. 3. The cleaning apparatus for cleaning a substrate of claim 1 , comprising an optical filter configured to produce a bathochromic shift in a wavelength of UV electromagnetic radiation, and configured to remove UV electromagnetic radiation having a wavelength below 280 nm. 4. The cleaning apparatus for cleaning a substrate of claim 1 , wherein the cleaning apparatus comprises the sensor configured to determine a temperature of the UV lamp; wherein the flow of the cooling fluid is controlled based at least in part on the temperature of the UV lamp. 5. The cleaning apparatus for cleaning a substrate of claim 1 , wherein the UV lamp is a mercury UV lamp. 6. The cleaning apparatus for cleaning a substrate of claim 1 , configured such that, in operation greater than or equal to about 50% of the UV electromagnetic radiation emitted by the UV lamp assembly has a wavelength greater than or equal to about 310 nm and less than or equal to about 320 nm. 7. The cleaning apparatus for cleaning a substrate of claim 1 , configured such that, in operation greater than or equal to about 50% of the UV electromagnetic radiation emitted by the UV lamp assembly has a wavelength greater than or equal to about 365 nm and less than or equal to about 375 nm. 8. The cleaning apparatus for cleaning a substrate of claim 1 , wherein the sensor configured to determine a temperature of the UV lamp is a thermocouple.
by a combination of operations · CPC title
by sonic or ultrasonic vibrations · CPC title
by ultraviolet radiation · CPC title
Accessories or details of general applicability for machines or apparatus for cleaning · CPC title
with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.