Organic photodetector
US-2020052216-A1 · Feb 13, 2020 · US
US12232340B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12232340-B2 |
| Application number | US-202117390277-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2021 |
| Priority date | Jul 31, 2020 |
| Publication date | Feb 18, 2025 |
| Grant date | Feb 18, 2025 |
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A photoconductive infrared detector comprising a substrate, an electrode geometry, and a layer of intrinsically conductive or photoconductive donor-acceptor conjugated polymer.
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What is claimed is: 1. A photoconductive detector with an organic active layer comprising: a substrate; an electrode geometry positioned on the substrate and including: a first transmission line having a terminal end; a second transmission line having a terminal end, wherein the first and second transmission lines are spaced apart to define a gap, the gap between the first and second transmission lines acting as one pixel; a first layer at least partially covering the gap; and a second layer at least partially covering the polymer, wherein the second layer is configured as an encapsulant. 2. The photoconductive detector of claim 1 , wherein the second layer is formed of one of alumina, silica, zinc selenide, germanium, barium fluoride, germanium-arsenide-selenide, gallium arsenide, glass, fused silica (“quartz”), silicon, magnesium fluoride, calcium fluoride, zinc sulphide, and magnesium aluminate. 3. The photoconductive detector claim 1 , wherein the first layer is formed of an oligomer or polymer with a conjugated structure, narrow bandgap, is electrically conductive, and possesses open-shell character. 4. The photoconductive detector of claim 1 , wherein the first layer is a spin-coated, donor-acceptor conjugated polymer layer. 5. The photoconductive detector of claim 1 , wherein the first layer is deposited by oxidative chemical vapor deposition. 6. The photoconductive detector of claim 1 , further comprising: pulse capture electronics; cascaded pre-amplifier circuitry; and an analog-to-digital converter. 7. The photoconductive detector of claim 1 , wherein the electrode geometry is biased with an RF or DC potential less than a dielectric breakdown threshold of the substrate. 8. The photoconductive detector of claim 1 , wherein at least one of the first layer and the second layer is optically transparent. 9. The photoconductive detector of claim 1 , further comprising: a contact pad operably coupled with one of the first and second transmission lines. 10. The photoconductive detector of claim 9 , wherein the contact pad is formed of gold. 11. The photoconductive detector of claim 1 , wherein the first and second transmission lines are formed of gold. 12. A linear detector, comprising: a substrate; an m×n dimensional array of ohmic contacts fabricated on the substrate; a polymer layer at least partially covering the array of ohmic contacts; an ohmic top electrode at least partially covering the polymer layer; and an encapsulant layer at least partially covering the ohmic top electrode. 13. The linear detector of claim 12 , wherein the substrate is an ROIC substrate. 14. The linear detector of claim 12 , further comprising: pulse capture electronics; cascaded pre-amplifier circuitry; and an analog-to-digital converter. 15. The linear detector of claim 12 , wherein the array is biased with an RF or DC potential less than a dielectric breakdown threshold of the substrate. 16. The linear detector of claim 12 , wherein at least one of the polymer layer, the top electrode, and the encapsulant layer is optically transparent. 17. The linear detector of claim 12 , wherein the polymer layer is a spin-coated, donor-acceptor conjugated polymer layer. 18. The linear detector of claim 12 , wherein the polymer layer is deposited by oxidative chemical vapor deposition. 19. A method of fabricating a photoconductive detector, comprising steps of: fabricating first and second transmission lines on a substrate to define a gap; spin-coating a polymer layer over at least a portion of the substrate; evaporating an encapsulant layer over at least a portion of the gap. 20. The method of claim 19 , further comprising a step of: removing the polymer layer from edges of the first and second transmission lines. 21. The method of claim 19 , further comprising a step of: fabricating a contact pad on the substrate such that the contact pad is operably coupled with one of the first and second transmission lines. 22. The method of claim 21 , further comprising a step of: using a solvent-soaked applicator to remove the polymer layer from the contact pad. 23. The method of claim 21 , further comprising a step of: using a shadow mask to prevent deposition of the polymer onto the contact pads.
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