Fluidic assembly encapsulating light emitting diodes

Patent metadata

Field	Value
Publication number	US-12230743-B2
Application number	US-202217981428-A
Country	US
Kind code	B2
Filing date	Nov 6, 2022
Priority date	Oct 31, 2014
Publication date	Feb 18, 2025
Grant date	Feb 18, 2025

Abstract

A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.

First claim

We claim:

1. An encapsulated emissive element for selective fluidic assembly comprising:
a micro-light emitting diode (micro-LED) having a closed perimeter shape, as viewed from a horizontal plane top-down perspective, comprising a top surface, a bottom surface with a first length in the horizontal plane, sidewall surfaces with a first thickness between the micro-LED top and bottom surfaces less than the first length, and a pair of electrical contacts; and,
a fluidic assembly key without electrical contacts, exposing the micro-LED electrical contacts and a second length of micro-LED bottom surface, where the second length is greater than the first thickness, while at least partially encapsulating the micro-LED to form a closed perimeter shape, as viewed from the horizontal plane top-down perspective, different than the micro-LED closed perimeter shape.

2. The encapsulated emissive element of claim 1 further comprising:
a plurality of micro-LED types, each micro-LED type having a unique closed perimeter shape and emitting a unique wavelength of light.

3. The encapsulated emissive elements of claim 2 further comprising:
a plurality of fluidic assembly key types, each fluidic assembly key type associated with a corresponding micro-LED type, and having a different closed perimeter shape than the corresponding micro-LED type.

4. The encapsulated emissive element of claim 1 further comprising:
a plurality of micro-LED types, each micro-LED type emitting a unique wavelength of light; and,
a plurality of fluidic assembly key types, each fluidic assembly key type associated with a corresponding micro-LED type, and having a different closed perimeter shape than the corresponding micro-LED type.

5. The encapsulated emissive element of claim 2 wherein each micro-LED type has a unique thickness, as viewed from a vertical sideways perspective, orthogonal to the top surface.

6. The encapsulated emissive element of claim 1 wherein each encapsulated emissive element has a common thickness, as viewed from a vertical sideways perspective, orthogonal to the micro-LED top surface.

7. The encapsulated emissive element of claim 1 wherein the fluidic assembly key completely encapsulates the micro-LED sidewalls.

8. The encapsulated emissive element of claim 7 wherein the micro-LED top surface is formed in a first horizontal plane and the micro-LED bottom surface is formed in a second horizontal plane, parallel to the first horizontal plane; and,
wherein the fluidic assembly key has a bottom surface, aligned in parallel with the micro-LED bottom surface, a top surface aligned in parallel with the micro-LED top surface, and a closed perimeter shape between the fluidic assembly key top and bottom surfaces, orthogonal to the first and second horizontal planes.

9. The encapsulated emissive element of claim 1 wherein the micro-LED electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a first electrical contact mounted on the micro-LED top surface and a second electrical contact mounted on the micro-LED bottom surface, and surface mount, with both the first and second electrical contacts mounted on the micro-LED top surface.

10. The encapsulated emissive element of claim 2 further comprising:
a plurality of fluidic assembly key types, each fluidic assembly key type having a circular closed perimeter shape with a unique diameter.

11. An encapsulated emissive element for selective fluidic assembly comprising:
a micro-light emitting diode (micro-LED) having a closed perimeter shape, as viewed from a horizontal plane top-down perspective, comprising a top surface, a bottom surface, sidewall surfaces between the micro-LED top and bottom surfaces, with a sidewall first profile as viewed from a vertical partial cross-sectional perspective, and a pair of electrical contacts; and,
a fluidic assembly key without electrical contacts, exposing the micro-LED electrical contacts while at least partially encapsulating the micro-LED to form a closed perimeter shape, as viewed from the horizontal plane top-down perspective, different than the micro-LED closed perimeter shape, with a second sidewall profile between fluidic assembly key top and bottom surfaces, as viewed from a vertical partial cross-sectional view perspective, formed independent of the first profile.

Assignees

• Elux Inc
• Ehux Inc

Inventors

• Sasaki Kenji
• Schuele Paul J

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title